Fluke Datapaq Reflow Tracker User Manual
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Fluke Datapaq Reflow Tracker User Manual

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Datapaq
®
Reflow
Tracker
®
USER MANUAL
for use with
Insight
™
software
Issue 4
MA5120A

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Summary of Contents for Fluke Datapaq Reflow Tracker

  • Page 1 Datapaq ® Reflow Tracker ® USER MANUAL for use with Insight ™ software Issue 4 MA5120A...
  • Page 3 Tracker systems. Europe & Asia North & South America Fluke Process Instruments Fluke Process Instruments Lothbury House, Cambridge Technopark 87 Stiles Road, Suite 206 Newmarket Road Salem...

  • Page 4: Safety Warnings

    Datapaq software, associated hardware or this material. Fluke Process Instruments reserves the right to revise this publication from time to time and to make changes to the content hereof without obligation to notify any person of such revisions or changes.
  • Page 5 CO NTE NT S Introduction System Components 11 Basic Hardware 11 Thermal Barriers 12 Barriers for DP5 Logger Standard, 6-channel, DP5x60 13 Barriers for DP5 Logger Super-slim, 6-channel, DP5x61 14 Barriers for DP5 Logger Narrow, 6-channel, DP5x62 14 Barriers for DP5 Logger, 12-channel, DP5x12 15 Barriers for Q18 Micro Logger, DQ1804 15 Thermocouple Probes 16 Thermocouple Specification...
  • Page 6 31 Wave Solder 32 Running a Wave-solder Temperature Profile 33 Preparing the System for the Oven 34 Removing from the Oven and Downloading Data 35 Analysis of Wave-solder Temperature Profiles 35 Checking Profiles 37 Easy Oven Setup 37 Profile Prediction 38 Recipe Prediction 38 Setting Process Limits 40 Generating Recipe Predictions...
  • Page 7 Introduction Datapaq Reflow Tracker , incorporating Insight software, is a complete ® ® ™ system for monitoring and analyzing the temperature profiles of products within all types of soldering processes. Power and flexibility make it a perfect tool for process temperature monitoring, from commissioning and troubleshooting to process optimization, ensuring consistent quality of product, consistent oven performance and maximum efficiency.

  • Page 8: System Components

    Powerful reporting facilities allow the user to generate customized printouts, including any or all of the analysis results or raw temperature data. This manual contains the following sections: • Basic Hardware (p. 11) – The standard system’s thermal barriers and thermocouple probes, their specifications and their care and maintenance.
  • Page 9 ○ Reflow Tracker User Manual. ○ Data logger User Manual (specific to the logger model). ○ TM21 Radio-telemetry System User Manual (radio-telemetry option only). Additional hardware is supplied with Wave Solder (p. 31) and Surveyor systems (p. 43). This manual, and other Datapaq user documentation, in various languages, is available on the Insight installation DVD included with Datapaq systems.
  • Page 10 Introduction REFLOW TR ACK ER...

  • Page 11: Basic Hardware

    It is essential to use the correct Datapaq thermal barrier for your individual process, as supplied and approved by Fluke Process Instruments. Failure to use the appropriate approved barrier, or the use of a barrier in an unapproved manner (e.g.
  • Page 12 Barriers for DP5 Logger Standard, 6-channel, DP5x60 These barriers also fit Q18 standard 6-channel logger, DQ1860. TB2015 – Most reflow soldering processes including lead-free Temp °C Duration (mins) 32 Dimensions Height Width Length Weight 25 mm 133 mm 210 mm 0.7 kg 1.0 in.
  • Page 13 TB2065 – Increased protection for frequent use or for long-duration processes Temp °C Duration (mins) 35 Dimensions Height Width Length Weight 29 mm 133 mm 210 mm 0.7 kg 1.1 in. 5.2 in. 8.3 in. 1.5 lb Barriers for DP5 Logger Super-slim, 6-channel, DP5x61 These barriers also fit Q18 super-slim 6-channel logger, DQ1861.
  • Page 14 Barriers for DP5 Logger Narrow, 6-channel, DP5x62 These barriers also fit Q18 narrow 6-channel logger, DQ1862. TB2020 – Low-height thermal barrier Temp °C Duration (mins) 25 Dimensions Height Width Length Weight 28 mm 84 mm 241 mm 0.5 kg 1.1 in. 3.3 in.
  • Page 15 Barriers for Q18 Micro Logger, DQ1804 TB2098 – Reflow soldering processes Duration 10 mins at 200°C. Dimensions Height Width Length Weight 27 mm 57 mm 190 mm 0.4 kg 1.1 in. 2.2 in. 7.5 in. 0.9 lb TB3006 – Long-duration reflow soldering processes Duration 14 mins at 200°C.
  • Page 16 All have green type-K connectors (conforming to IEC 60584-3). WARNING Never connect thermocouples to mains electricity, nor allow thermocouples to touch an oven’s heating elements. This could cause major injury or death. Take care when handling thermocouple cables to avoid accidental damage to the eyes by sharp thermocouple-tips.

  • Page 17: Health Hazard Data

    The important products from PTFE thermal decomposition are: At Temperatures Greater Than: Product 400°C See note* 430°C Tetrafluoroethylene 440°C Hexafluoropropylene 475°C Perfluoroisobutylene 500°C Carbonyl fluoride*, which, in moist air, converts to the acid gas hydrogen fluoride May also be produced if PTFE tape is kept at 400°C for an extended time. Health Hazard Data •...
  • Page 18 Basic Hardware REFLOW TR ACK ER...
  • Page 19 Reflow Temperature Profiles: Creation and Use A temperature profile can be acquired by two means: • Without telemetry – After the logger and product have been in the oven, data is downloaded from the logger into the PC to be displayed and analyzed by the Datapaq Insight software.

  • Page 20: Probe Location

    8. Add any additional information that you wish to have recorded with the profile data. After this, Insight can be used to analyze the profile data as required. Probe Location Whatever the method of heating, the thermal mass of the PCB, its tracks and the components attached to them significantly influence the time taken for each physical element to attain a given temperature.

  • Page 21: Good Practice

    • Locations shaded by large components, i.e. tracks under large quad flat packs and ball-grid arrays which may require extra time to achieve reflow temperature. Note that it may be necessary for thermocouple cables to exit via a hole to the underside of the PCB. •...
  • Page 22 Methods of Attachment The following are the chief methods. High-melting-point Solder • Gives best repeatability but difficult to perform. • Recommended for metal-to-metal attachment. High-melting-point solder is used to attach thermocouples to the legs of components and to PCB tracks. It melts far enough above reflow temperature to ensure that the thermocouple remains in place.
  • Page 23 them to the measuring point. However, attachment is improved by using self- adhesive aluminum tape and deforming it to fit closely around the thermocouple tip; high-temperature tape placed over this will hold it in place during the profile run. Restraining the Cable The thermocouple cables must be routed from their points of attachment to the rear of the PCB to enable the data logger to follow the PCB through the oven.
  • Page 24 Installing the Logger in the Thermal Barrier WARNING It is essential to use the correct Datapaq thermal barrier for your individual process; see p. 11. Ensure that all dimensions of your logger/barrier/accessory assembly are such that it will fit comfortably within the oven through all stages of the process. Pay particular attention to handles, catches, etc., and to trailing thermocouples.
  • Page 25 WARNING Take care not to trap fingers when closing the barrier lid. Placing the System in the Oven 1. Place the instrumented PCB on the oven’s conveyor with the thermocouple cables towards the rear. 2. As the board travels towards the oven feed the thermocouple cables carefully, ensuring they do not foul the oven.

  • Page 26: Profile Types

    1. Open the thermal barrier. Placing it on a cold surface will increase its rate of cooling. (An additional thermal barrier should be purchased if insufficient time is available to allow it to cool between test runs.) 2. If data acquisition has to be stopped manually, press and hold the logger’s red stop button until the red and green logger-status LEDs both flash once.
  • Page 27 Checking Profiles Some soldering faults which can be caused by incorrect temperature profiles are described below. • Incomplete soldering – There are numerous possible causes, one of which is insufficient heat energy input to the solder joint. This would usually be caused by too low a temperature before the reflow zone or too short a time above the liquidus temperature of the solder.
  • Page 28 performance of your process, potential problems can be identified and dealt with before they occur. (Not available with all versions of Insight.) The Datapaq Surveyor system (p. 43) is an alternative means of assessing oven performance which requires you to use specific hardware first to quantify and then to run checks on the system to ensure it is still operating within limits.
  • Page 29 An SPC analysis is easily carried out using SPC Setup Wizard (click the Insight toolbar, or select Tools > Wizards from the menu). This guides you through the following stages: 1. Select existing temperature profiles (paqfiles) on which the analysis will be based.
  • Page 30 Reflow Temperature Profiles REFLOW TR ACK ER...
  • Page 31 Wave Solder The Datapaq Reflow Tracker system – and Insight software – can be used with both reflow and wave-solder ovens. In the Wave Solder system, the logger (in its thermal barrier) is mounted on a flat pallet (part no. CS5000) which passes through the oven. Up to nine fixed thermocouples on the pallet measure conditions relating to the solder wave: the oven’s line-speed and the contact length of the solder wave, and thus the...
  • Page 32 Reflow Tracker’s Insight software identifies the thermocouples as follows: • Thermocouples attached to the PCB are numbered 1–3. • With a 6-channel logger, the leading-edge thermocouples are numbered 4–5 and the rear thermocouple is number 6. • With a 12-channel logger, the leading-edge thermocouples are numbered 4–11 and the rear thermocouple is number 12.
  • Page 33 Preparing the System for the Oven WARNING It is essential to use the correct Datapaq thermal barrier for your individual process; see p. 11. Ensure that all dimensions of your logger/barrier/pallet assembly are such that it will fit comfortably within the oven through all stages of the process. Failure to do this can cause the assembly to jam in the oven with consequent overheating and potentially-severe damage to the equipment.
  • Page 34 3. After the thermocouples are attached, ensure the mating surfaces of the thermal barrier – mounted securely on the pallet, if used – are clean and undamaged. A good seal between the barrier and the thermocouple cables is essential if the logger is to be protected. Put the logger in place in the barrier, laying the thermocouple cables across the sealing material to exit the barrier at the cutout.
  • Page 35 Analysis of Wave-solder Temperature Profiles For details of analyses that can be performed on a wave-solder profile, see Insight’s Help system (under Contents, select Data Analysis > Wave Solder). Note that the temperature profiles resulting from reflow and wave-solder ovens require different analyses, and consequently the data files (paqfiles) which Insight produces for each also differ and are not interchangeable –...
  • Page 36 Wave Solder REFLOW TR ACK ER...
  • Page 37 Easy Oven Setup Not available in Insight Reflow Tracker Basic and Reflow Lite. Easy Oven Setup provides a rapid, simple and effective way to tune the settings of your reflow oven in order to produce the temperature profile you require for a specific solder paste and a specific application.
  • Page 38 5. To save the revised recipe, click to the left of the Oven Settings grid. 6. To save the predicted profile, click on the main toolbar, or select File > Save, or File > Save As > Prediction; the profile is saved as a prediction file with a .PRE extension.
  • Page 39 Supplying data for four aspects of the desired profile shape is optional: Overall Profile Slopes, Ramp, Soak and Spike. For each of these, check the box to enable the setting of their parameters (this is disabled by default). • Overall Profile Slopes Specify the maximum permitted heating slope (rate of temperature increase) for the profile (default 4.0°C/s) and the maximum permitted cooling slope (default −4.0°C/s;...
  • Page 40 Generating Recipe Predictions After setting up the process limits (see above), click or select Easy Oven Setup > Recipe Predict to carry out a recipe prediction. By using data from your solder-paste specification, Insight will create recipes which are predicted to produce temperature profiles to match the solder’s preferred usage conditions.
  • Page 41 • Oven settings – the set temperatures for each oven zone and the line speed. • Data analysis for its predicted profile. The full range of analysis options is available. The contents of the Reflow Results tab reflect what was specified in the process limits used, though you may use the analysis options dialog to add or remove results from the display.
  • Page 42 Troubleshooting the Predictions Poor predictions can be due to problems or errors in any of the components of a prediction. Care must always be taken when entering data or performing runs. Common reasons for bad predictions are as follows. • Invalid zone length measurements – The oven’s actual zone lengths and those entered into the oven file are different.
  • Page 43 1. Configure your oven for optimum performance – Your oven must be set up correctly, and producing defect-free product. Analysis with the standard Datapaq Reflow Tracker system will assist in achieving optimum results. 2. Conduct a baseline survey – In Insight, using Surveyor’s Technician Mode (see p.

  • Page 44: Carrier Frame

    The Insight online Help system explains in full the functions and use of Surveyor, and the process of making selections and entering data in the wizards: click Help, and then Contents, on Insight’s main menu; then, within Help, click on Contents headings and topics to expand and read them.

  • Page 45: Preparing The Frame

    The Surveyor carrier frame, with three sensors (at right) and their plugs (at left) ready to attach to the data logger which will lie within the frame in its thermal barrier. Side- by-side sensor-plugs (PA0885) are shown; see text. The frame’s side-rails are shown partially extended and with their side-plates in place.
  • Page 46 Sensors The frame has three fixed temperature sensors across its width, each sensor having two thermocouples – on its upper- and underside. Sensors are of two types, differing in the arrangement of their plugs, to suit different logger models. Part numbers: PA0885 Sensor with pair of plugs fixed side-by-side, for standard 6-channel DP5 logger.
  • Page 47 WARNING It is essential to use the correct Datapaq thermal barrier for your individual process; see p. 11. Ensure that all dimensions of your logger/barrier/frame assembly are such that it will fit comfortably within the oven through all stages of the process. Failure to do this can cause the assembly to jam in the oven with consequent overheating and potentially-severe damage to the equipment.
  • Page 48 Running a Baseline Survey and Setting Tolerances Running the Baseline Survey Wizard in Technician Mode (see box) allows you to perform a baseline survey of a correctly functioning oven with given heater settings (defined in a recipe), thereby establishing an ideal temperature profile for a given process and defining limits –...
  • Page 49 • Saving the results and displaying them (graphically and numerically); they can also be printed. WARNING Never carry the Surveyor assembly by holding the attached thermocouples. This can lead to injury by dropping the equipment onto your body, and may damage the equipment itself.
  • Page 50 For an alternative approach to identifying trends, using SPC on normal Insight paqfiles, see p. 28. Note that temperature profiles obtained using the Surveyor system will not match normal Insight paqfiles obtained from an instrumented PCB. The Surveyor sensors are designed to yield highly repeatable results enabling reliable SPC analysis to be conducted on the resultant dataset.

  • Page 51: Troubleshooting

    Troubleshooting For problems in communication between the logger and the PC and for logger download error messages, see the ‘Troubleshooting’ chapter of the dedicated User Manual for your logger. For process problems revaled by temperature profiles, see p. 26 for reflow and p.
  • Page 52 4. Replace any damaged thermocouples and test again. Datapaq Service Department If you cannot resolve your problem, please contact your nearest Datapaq Service Department at Fluke Process Instruments. For contact details, see www.flukeprocessinstruments.com – or email as follows: Europe, Asia (except China), Africa, Australasia – datapaqservice@ flukeprocessinstruments.co.uk...
  • Page 53 2. Select Logger > Setup > Advanced, or Help > Service. 3. Select a name and location for the downloaded file, and a destination for the email. The file created is accessible to Fluke Process Instruments but is not designed to be opened by the user.
  • Page 54 Europe & Asia Fluke Process Instruments Lothbury House Cambridge Technopark Newmarket Road Cambridge CB5 8PB United Kingdom Tel. +44-(0)1223-652400 sales@flukeprocessinstruments.co.uk North & South America Fluke Process Instruments 87 Stiles Road, Suite 206 Salem, NH 03079 Tel. +1-425-446-6780 sales@flukeprocessinstruments.com China Fluke Process Instruments...

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