Quectel AF20 Hardware Design
  1. Manuals
  2. Brands
  3. Quectel Manuals
  4. GSM/GPRS Modules
  5. AF20
  6. Hardware design

Quectel AF20 Hardware Design

Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
AF20
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.1
Date: 2022-10-18
Status: Released

Advertisement

Table of Contents
loading

Related Manuals for Quectel AF20

Summary of Contents for Quectel AF20

  • Page 1 AF20 Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.1 Date: 2022-10-18 Status: Released...
  • Page 2 Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
  • Page 5 Wi-Fi&Bluetooth Module Series metal powders. AF20_Hardware_Design 4 / 49...

  • Page 6: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description 2019-06-05 Power JIN/Kane ZHU Creation of the document 2019-06-05 Power JIN/Kane ZHU First official release 1. Updated the pin 42 from RESERVED to HOST_WAKE_BT; Updated the pin 46 from RESERVED to BT_WAKE_HOST.

  • Page 7: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ............................ 5 Contents .................................6 Table Index ..............................8 Figure Index ..............................9 Introduction ............................10 1.1. Special Mark ..........................10 Product Overview ..........................11 2.1. Key Features ..........................11 2.2. Functional Diagram ........................13 2.3.
  • Page 8 Wi-Fi&Bluetooth Module Series 5.1. Mechanical Dimensions ......................38 5.2. Recommended Footprint ......................40 5.3. Top and Bottom Views ........................41 Storage, Manufacturing and Packaging ................... 42 6.1. Storage Conditions ........................42 6.2. Manufacturing and Soldering ..................... 43 6.3. Packaging Specification ......................45 6.3.1. Carrier Tape ........................45 6.3.2.
  • Page 9 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ............................10 Table 2: Key Features ............................11 Table 3: I/O Parameters Definition ........................16 Table 4: Pin Description ............................16 Table 5: Power Supply Pins and GND Pins ....................... 19 Table 6: Pin Definition of WLAN_EN ........................
  • Page 10 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ..........................13 Figure 2: Pin Assignment (Top View) ......................... 15 Figure 3: Reference Circuit for VDD_3V3 ......................20 Figure 4: Turn-on and Turn-off Timing ........................20 Figure 5: Wi-Fi Application Interface Connection ....................

  • Page 11: Introduction

    Wi-Fi&Bluetooth Module Series Introduction This document defines AF20 module and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 12: Product Overview

    Connection between AF20 and AG35 via the coexistence interface helps reduce the interference between LTE signal and Wi-Fi/Bluetooth signal. AF20 is an SMD type module with a compact form factor of 17.2 mm × 15.2 mm × 2.26 mm. It can be embedded in your applications through the 52 LGA pins.
  • Page 13 Wi-Fi&Bluetooth Module Series 108 Mbps, 121.5 Mbps, 135 Mbps 802.11a: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48  Mbps, 54 Mbps 802.11ac: VHT20 (MCS 0–8), VHT40 (MCS 0–9), VHT80 (MCS 0–9)  2.4 GHz 802.11b/11Mbps: 16 dBm ±2.5 dB ...

  • Page 14: Functional Diagram

    The following figure shows a block diagram of AF20 module. Figure 1: Functional Diagram 2.3. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to control or test the module. For more details, see document [1]. AF20_Hardware_Design...

  • Page 15: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 3.1. General Description AF20 module is equipped with 52 LGA pins that can be connected to the cellular application platform. The subsequent chapters will provide a detailed introduction on the following module interfaces: Power supply ...

  • Page 16: Pin Assignment

    Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment Figure 2: Pin Assignment (Top View) AF20_Hardware_Design 15 / 49...

  • Page 17: Pin Description

    Wi-Fi&Bluetooth Module Series NOTE 1. Please keep all RESERVED and unused pins disconnected. 2. All GND pins should be connected to ground. 3.3. Pin Description Table 3: I/O Parameters Definition Type Description Analog input/output Digital input Digital input/output Digital output Power input Table 4: Pin Description Power Supply...
  • Page 18 Wi-Fi&Bluetooth Module Series min = -0.3 V max = 0.54 V 1.8 V power domain. WLAN_EN Wi-Fi enable control min = 1.26 V Active high. max = 2.0 V max = 0.18 V min = 1.62 V min = -0.3 V SDIO_D3 SDIO data bit 3 1.8 V power domain...
  • Page 19 Wi-Fi&Bluetooth Module Series min = 1.26 V max = 2.0 V min = -0.3 V max = 0.54 V PCM_IN PCM data input min = 1.26 V max = 2.0 V min = -0.3 V PCM data frame max = 0.54 V PCM_SYNC synchronization min = 1.26 V...

  • Page 20: Power Supply

    2, 3, 4, 32–35, 37, 41, 47 open. 3.4. Power Supply The following table shows the power supply pins and the ground pins of AF20 module. The VIO can be powered by VDD_EXT of AG35 module. Table 5: Power Supply Pins and GND Pins...
  • Page 21 Wi-Fi&Bluetooth Module Series AF20 module is powered by VDD_3V3, and it is recommended to use a power supply chip with maximum output current exceeding 0.6 A. The following figure shows a reference design for VDD_3V3 which is controlled by PM_ENABLE. And PM_ENABLE should be connected to the pin 5 (PM_ENABLE) of AG35 module.

  • Page 22: Wi-Fi Application Interface

    The following figure shows the Wi-Fi application interface connection between AF20 and AG35. Figure 5: Wi-Fi Application Interface Connection 3.5.1. WLAN_EN WLAN_EN is used to control the Wi-Fi function of AF20. Wi-Fi function will be enabled when WLAN_EN is at high level. Table 6: Pin Definition of WLAN_EN Pin Name Pin No.

  • Page 23: Sdio Interface

    Wi-Fi&Bluetooth Module Series 3.5.2. SDIO Interface The following table shows the pin definition of the SDIO interface of AF20. Table 7: Pin Definition of SDIO Interface Pin Name Pin No. Description Comment SDIO_D3 SDIO data bit 3 1.8 V power domain 1.8 V power domain.

  • Page 24: Bluetooth Application Interface

    50 mm. The total length of SDIO signal traces inside AG35 module is 12 mm and that inside AF20 is 10 mm, so the exterior total trace length should be less than 28 mm. On the SDIO_CLK signal trace, a 15 to 24 Ω terminal matching resistance should be placed near the ...

  • Page 25: Bt_En

    Wi-Fi&Bluetooth Module Series Figure 7: Block Diagram of Bluetooth Application Interface Connection 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of AF20 module. Bluetooth function will be enabled when BT_EN is at high level. Table 8: Pin Definition of BT_EN Pin Name Pin No.

  • Page 26: Bluetooth Uart

    Bluetooth UART clear to send 1.8 V power domain BT_UART_TXD Bluetooth UART transmit BT_UART_RXD Bluetooth UART receive The following figure shows the reference design for Bluetooth UART connection between AF20 and AG35. Figure 9: Reference Design for Bluetooth UART Connection AF20_Hardware_Design 25 / 49...

  • Page 27: Coexistence Uart

    The 32 kHz clock is used in low power modes such as IEEE power saving mode and sleep mode. It serves as a timer to determine when to wake up AF20 module to receive signals in various power saving schemes, and to maintain basic logic operations when in sleep mode.

  • Page 28: Rf Antenna Interface

    2.402–2.480 3.9.3. Reference Design AF20 module provides an RF antenna interface for antenna connection. A reference circuit design for RF antenna interface is shown below. It is recommended to reserve a π-type matching circuit for better RF performance, and the π-type matching components (C1, C2, R1) should be placed as close to the antenna as possible.

  • Page 29: Rf Routing Guidelines

    Wi-Fi&Bluetooth Module Series Figure 11: Reference Circuit for RF Antenna Interface Another type of reference circuit for the RF antenna interface is shown below. It is designed for vehicle applications. It is recommended to reserve two notch filter circuits and a π-type matching circuit for better RF performance.
  • Page 30 Wi-Fi&Bluetooth Module Series Figure 13: Microstrip Design on a 2-layer PCB Figure 14: Coplanar Waveguide Design on a 2-layer PCB Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) AF20_Hardware_Design 29 / 49...

  • Page 31: Requirements For Antenna Design

    Wi-Fi&Bluetooth Module Series To ensure better RF performance and reliability, the following conditions should be complied with in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to  50 Ω. GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully ...
  • Page 32 Wi-Fi&Bluetooth Module Series Figure 17: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 18: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connectors. AF20_Hardware_Design 31 / 49...
  • Page 33 Wi-Fi&Bluetooth Module Series Figure 19: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. AF20_Hardware_Design 32 / 49...

  • Page 34: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 4.1. Absolute Maximum Ratings Table 16: Absolute Maximum Ratings Parameter Min. Max. Unit VDD_3V3 -0.3 3.46 -0.3 1.89 Voltage at digital pins -0.3 VIO + 0.2 Table 17: Recommended Operating Conditions Parameter Min. Typ.

  • Page 35: Power Consumption

    Wi-Fi&Bluetooth Module Series Low Level Output Voltage 0.1 × VIO 4.3. Power Consumption Table 19: Wi-Fi Power Consumption of the Module (1.8 V and 3.3 V Power Supply) Description Conditions (Typ.) (Typ.) Unit WLAN_3V3 AT+QWIFI=0 OFF State μA Idle AT+QWIFI=1 Tx 1 Mbps @ 17.3 dBm 366.4 802.11b...

  • Page 36: Rf Performances

    Wi-Fi&Bluetooth Module Series Tx VHT40 MCS 9 @ 8.1 dBm 214.2 Tx VHT80 MCS 0 @ 10.7 dBm 329.1 Tx VHT80 MCS 9 @ 7.1 dBm 192.1 4.4. RF Performances Table 20: Conducted RF Output Power at 2.4 GHz Frequency Min.
  • Page 37 Wi-Fi&Bluetooth Module Series 802.11ac, VHT20 @ MCS 8 802.11ac, VHT40 @ MCS 0 12.5 802.11ac, VHT40 @ MCS 9 802.11ac, VHT80 @ MCS 0 802.11ac, VHT80 @ MCS 9 Table 22: Conducted RF Receiving Sensitivity at 2.4 GHz Frequency Receiving Sensitivity (Typ.) 802.11b, 1 Mbps -95.0 dBm 802.11b, 11 Mbps...

  • Page 38: Esd Protection

    Wi-Fi&Bluetooth Module Series 802.11ac, VHT20, MCS 0 -91.0 dBm 802.11ac, VHT20, MCS 8 -67.5 dBm 802.11ac, VHT40, MCS 0 -88.0 dBm 802.11ac, VHT40, MCS 9 -62.5 dBm 802.11ac, VHT80, MCS 0 -84.5 dBm 802.11ac, VHT80, MCS 9 -59 dBm 4.5. ESD Protection Static electricity occurs naturally and it may damage the module.

  • Page 39: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 20: Top and Side Dimensions AF20_Hardware_Design 38 / 49...
  • Page 40 Wi-Fi&Bluetooth Module Series Figure 21: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. AF20_Hardware_Design 39 / 49...

  • Page 41: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint ure 22: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. AF20_Hardware_Design 40 / 49...

  • Page 42: Top And Bottom Views

    Figure 23: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. AF20_Hardware_Design 41 / 49...

  • Page 43: Storage, Manufacturing And Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 44: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 45 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective wave soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 46: Packaging Specification

    Wi-Fi&Bluetooth Module Series 6.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 6.3.1.

  • Page 47: Plastic Reel

    Wi-Fi&Bluetooth Module Series 6.3.2. Plastic Reel Figure 26: Plastic Reel Dimension Drawing Table 27: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 32.5 6.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 48 Wi-Fi&Bluetooth Module Series Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton and seal it. 1 carton can pack 1000 modules. Figure 27: Packaging Process AF20_Hardware_Design 47 / 49...

  • Page 49: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 28: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_AG35_Quecopen_Reference_Design [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_User_Guide Table 29: Terms and Abbreviations Abbreviation Description Access Point BPSK Binary Phase Shift Keying Bluetooth Complementary Code Keying Clear To Send Dynamic Frequency Selection Electrostatic Discharge Ground...
  • Page 50 Wi-Fi&Bluetooth Module Series Long Term Evolution Mbps Million Bits Per Second Modulation and Coding Scheme Minimum Order Quantity Printed Circuit Board Pulse Code Modulation Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency Relative Humidity RoHS Restriction of Hazardous Substances Request To Send Receive Direction SDIO...
  • Page 51 Wi-Fi&Bluetooth Module Series VSWR Voltage Standing Wave Ratio WLAN Wireless Local Area Networks AF20_Hardware_Design 50 / 49...
  • Page 52 The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. Hereby, We, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type AF20 is in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: https://www.quectel.com/support/downloadb/TechnicalDocuments.htm...
  • Page 53 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023AF20.
  • Page 54 A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).
  • Page 55 Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
  • Page 56 The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. Hereby, We, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type AF20 is in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: https://www.quectel.com/support/downloadb/TechnicalDocuments.htm...
  • Page 57 ❒ Buletooth(LE):≤0.73dBi Wi-Fi 2.4G:≤0.73dBi ❒ ❒ Wi-Fi 5G:≤1.14dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
  • Page 58 XMR2023AF20.” or “Contains FCC ID: XMR2023AF20.” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

Table of Contents