Table of Contents
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A
Applications 3-1
B
Backplane row jumpers 2-6
Basic matrix configurations 2-1
C
Card identification 4-12
Card installation and removal 4-1
Component layout and schematic diagram
5-1
Connections 2-5
Current gain checks 3-6
D
Differential and common model isolation
tests 4-10
Differential switching 2-4
E
Environmental conditions 4-4
F
Factory service 5-1
Features 1-1
Four-terminal ohms measurements 3-1
G
General information 1-1
H
Handling and cleaning precautions 4-1
I
I
and V
measurements 3-7
E
BE
Inspection for damage 1-2
Instruction manual 1-2
M
Mainframe matrix expansion 2-10
Manual addenda 1-1
Matrix expansion 2-6
Matrix/multiplexer system 2-13
Multiple card system 2-10
Multiple switching matrix system 2-13
N
Narrow matrix expansion 2-8
O
Offset current tests 4-6
Operation 2-1
Optional accessories 1-2
Ordering information 5-1
P
Partial matrix implementation 2-9
Parts list 5-1
Path isolation tests 4-8
Path resistance tests 4-5
Performance verification 4-4
Power up safeguard 4-13
Principles of operation 4-12
Index
R
Recommended equipment 4-4, 4-13
Replaceable parts 5-1
S
Safety symbols and terms 1-1
Sensing 2-4
Service information 4-1
Shipping contents 1-2
Single card system 2-10
Single-ended switching 2-4
Special handling of static-sensitive devices
4-13
Specifications 1-1
Switching circuitry 4-12
T
Thick film resistor network testing 3-1
Transistor testing 3-3
Troubleshooting 4-13
Troubleshooting procedure 4-13
Typical connection schemes 2-10
Typical matrix switching schemes 2-4
U
Unpacking and inspection 1-2
V
Voltage divider checks 3-3
W
Warranty information 1-1
Wide matrix expansion 2-8
i-1
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Table of Contents
Troubleshooting
