DA14706 PRO Development kit UM-B-148 Abstract Hardware description of the DA14706 PRO development kit, including DA14706 or DA14708 PRO daughterboards, PRO motherboard and the accompanying boards which mounted on the motherboard, namely the LCD module and the power measurement module.
Figures ........................... 3 Tables ............................ 4 Terms and Definitions ....................5 References ........................6 Introduction DA14706 PRO Development kit ..............7 Introduction ..............................7 Features ..............................8 PRO Development kit Hardware block diagram ..................8 PRO-Motherboard main features .................. 9 USB HUB ..............................
Figure 6: Debug interface including DIP switch SW1 ..................11 Figure 7: PCB top of the DA1470x PRO Development Kit Top................11 Figure 8: USB HUB Circuitry of DA14706 PRO-Motherboard................12 Figure 9: USB to UART (FTDI module) ......................13 Figure 10: UART &...
Figure 42: LCD TFT daughterboard top (left) and PCBA bottom side (right) ............. 42 Figure 43: System Block Diagram of DA1470x PRO-Daughterboard ..............44 Figure 44: PCB top of the DA14706 PRO- Daughterboard................44 Figure 45: PCB bottom of the DA1470x PRO- Daughterboard................45 Figure 46: PRO- Daughterboard.
Preliminary document Specifications in this document are tentative and subject to change. Terms and Definitions Analog Front End Bluetooth Low Energy Dev Kit Development Kit PRO-Devkit Professional Development Kit PRO-DB PRO-Daughterboard PRO-MB PRO-Motherboard Daughterboard Mainboard or motherboard OPAMP Operational Amplifier Over Voltage Protection Printed Circuit Board SW Development Kit...
The PRO development kit when combined with the DA1470x SDK and SmartSnippets tools, provides an easy to use and complete platform for software/hardware development. In this document we focus on the DA14706 PRO Development kit which consists of the following parts: ▪...
Preliminary document Specifications in this document are tentative and subject to change. Features ▪ DA1470x silicon easily replaceable on a daughterboard core module ▪ Dedicated daughterboard for current measurement (on a M2 socket) ▪ LCD daughterboard ▪ On-board basic peripherals for demo and development ▪...
Preliminary document Specifications in this document are tentative and subject to change. PRO-Motherboard main features ▪ Single USB connector *NOTE: USB host must support USB 2.0 high-speed for reliable power measurements ▪ USB hub with 3 downstream ports Port1: Segger JLink-OB SWD-JTAG debugger for ARM Cortex M33 Port2: FT2232H multiprotocol serial interface providing a booting/debugging/HCI UART (2 or 4- pin) and SPI connected to the current measurement daughterboard A/D converter Port3: Segger JLink-OB SWD-JTAG debugger for SNC...
Preliminary document Specifications in this document are tentative and subject to change. ▪ QSPI flash (with three footprint options) ▪ dedicated connector (J6) which can accept an eMMC flash daughterboard ▪ Optional 2x MikroBUS sockets (supporting 3.3V compatible click boards) ▪...
USB HUB Figure 8: USB HUB Circuitry of DA14706 PRO-Motherboard The USB HUB of DA14706 PRO-Motherboard is implemented by U11, USB2513B. This chip is supplied with 3.3V from a voltage regulator, U13. The signal PWR_ENABLE is generated from U11 and it is an active high signal. It enables the power components (DCDC converter &...
Preliminary document Specifications in this document are tentative and subject to change. To UART voltage translators From USB To current measurement daughterboard Figure 9: USB to UART (FTDI module) SWDIO_CMAC P007 SWDIO_CMAC P004 SWCLK_1 SWCLK_M33 P001 SWCLK_2 SWCLK_SNC P003 & SWDIO_M33 SWDIO_1 P000...
Preliminary document Specifications in this document are tentative and subject to change. USB to Serial Wire Debug port (SWD) DA1470x SoC contains three processors, the main processor M33, the SNC and the CMAC. Each of them can be accessed by a SWD port. M33 and SNC are accessed from the debuggers on board (U30 and U31 respectively) which are located on the PRO-Motherboard.
Preliminary document Specifications in this document are tentative and subject to change. For the M33 processor only, the connector J31 is available to access the Embedded Trace Macrocell (ETM) module via a standard 20-pin high density connector. A J-Link Trace debug probe can be connected to J31 for this purpose.
Figure 14: Analog Switch (U8) used to isolate the Digital Audio interface Notice: On DA14706 PRO-Development kit, there is no capability to connect a PDM microphone directly to DA1470x. However, this can be realized by plugging an external PDM microphone break out on break out headers.
Preliminary document Specifications in this document are tentative and subject to change. The SPI signals that can be utilized by the J27 connector are either SPI1/SPI2 (up to 24MHz, Master/Slave) or SPI3 controller (up to 48MHz, master only). Voltage level translation (debugging) section Voltage translation is required because the DA1470x I/O voltage will vary depending on the battery level and setting for the I/O LDO.
R148 ▪ is generated from U1, where V30 from PRO-daughterboard is used as a reference. Consequently, DDIO there is no additional power consumption on the power circuitry of DA14706 PRO-Motherboard due to voltage translation Push Buttons ▪...
Preliminary document Specifications in this document are tentative and subject to change. GPIO assignment Table 2: DA14706 PRO-Development kit GPIO pin assignment DA1470x GPIO GPIO assignment Comments Pin Name P0_00 M33_SWDIO Available on J4 of PRO- Daughterboard P0_01 M33_SWDCLK Available on J4 of PRO-...
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Preliminary document Specifications in this document are tentative and subject to change. DA1470x GPIO GPIO assignment Comments Pin Name P0_23 MikroBUS-INT(1) / LCD_RED1 Multiplexed GPIO P0_24 MikroBUS-INT(2) / LCD_GREEN0 Multiplexed GPIO P0_25 eMMC_CLK / P025x eMMC daughterboard, dual usage GPIO described in 4.11 eMMC daughterboard, dual P0_26...
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Preliminary document Specifications in this document are tentative and subject to change. DA1470x GPIO GPIO assignment Comments Pin Name P1_12 I3C SCL I3C clock signal P1_13 QSPIC2_D2/P113x QSPI RAM, dual usage GPIO described in P1_14 QSPIC2_D1/P114x QSPI RAM, dual usage GPIO described in QSPI RAM, dual usage GPIO P1_15...
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Preliminary document Specifications in this document are tentative and subject to change. DA1470x GPIO GPIO assignment Comments Pin Name DI signal on the expansion P2_00 EXP_DI connector J27 P2_01 UART RX (input) Available on J4 of PRO- Daughterboard P2_02 EXP_D0 D0 signal on the expansion connector J27 P2_03...
Figure 18: QSPI RAM schematic QSPI-RAM may be used in applications where we need bulk data transfers with DMA. The most common case is as LCD frame buffer. On DA14706 PRO-Motherboard, the APS6404L-SQH-SN from APMEMORY is mounted. The memory characteristics are shown below: ▪...
4.10 QSPI FLASH In this DA14706 PRO-Motherboard, three different footprints are available for the storage flash memory (WSON8, SOIC16 and UDFN8), in order to support a large selection of memories. The default option is the AT25SL128A-MHE-T at a UDFN8 package.
Preliminary document Specifications in this document are tentative and subject to change. Figure 22: Two QSPI Flash PCB footprint options (not populated) The QSPI flash signals are connected to the DA1470x using an analog switch, as shown in Figure 23. The switch serves two purposes: It selects which group of pins (default or marked as “for future use”) will be connected to the QSPI storage flash.
Preliminary document Specifications in this document are tentative and subject to change. Table 3: U6 truth table BA_DBn eMMC_DBn QSPI Flash DA1470x Comments Use with eMMC switch off through connector J6 QSPIC_D0 P110 QSPIC_D1 P102 QSPIC_D2 P203 Use with QSPI Flash, (U15) QSPIC_D3 P116...
Break-out connector (J6) Figure 25: eMMC connector schematic For better flexibility, J6 break-out connector is added on the DA14706 PRO Motherboard. The connector used is the 1775013-2, a 24 positions,0.8 mm, PCB Mount vertical receptacle. User can design a module using the mate connector.
Preliminary document Specifications in this document are tentative and subject to change. 4.12 DA14706 PRO-Motherboard power configuration The power structure of the PRO-Motherboard (shown in Figure 26) contains two high efficient adjustable 1A DCDC step down converters the U28 (TPS62250DRVR) and the U13 (AP61100Z6-7) both fed from the USB connector 5V supply (VBUS_HUB).
Preliminary document Specifications in this document are tentative and subject to change. Table 4: SW2 switch voltage settings VLDO = 3.0V VLDO = 3.3V Default VLDO = 3.6V Header J9 is added for facilitating the current measurements. Jumper settings of header J9 are presented below on 5.2.2.
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Preliminary document Specifications in this document are tentative and subject to change. Important note on DA14706 PRO Devkit power setup There are two USB ports, one on PRO-Daughterboard and another on the PRO-Motherboard. As it is appeared on Figure 26, the USB of PRO-Motherboard supplies all supporting circuits as well as the DCDC converter (U28) which supplies PRO-Daughterboard.
This is implemented with a power measurement circuitry which consists of the power measurement module (PMM2) and the monitoring circuit which resides on the DA14706 PRO-Motherboard. This feature is intended to provide a good visualization of the system current draw and various voltages. It is relatively accurate but please note that for proper measurements an external calibrated instrument shall be used.
Preliminary document Specifications in this document are tentative and subject to change. The Power measurement circuitry, the monitoring section on PRO- Motherboard The power measurement module (PMM2) is connected to PRO-Motherboard via J36, M.2 socket. Power to PMM2 is provided from PRO-Motherboard through power switch U34. Figure 30: Current Measurement socket (M2) DA14706 Devkit User Manual Rev.1.00.93 Page 32 of 58...
Preliminary document Specifications in this document are tentative and subject to change. Table 5: Monitored Power Sources Monitored Magnitude Signal Comments Sourced from PRO-Daughterboard VSYS VSYS Sourced from PRO-Daughterboard Main power rail of the Power management unit 1.8V V18, Sourced from PRO-Daughterboard V18P, 1.8V rails powering peripherals (V18P), external memories V18F...
Preliminary document Specifications in this document are tentative and subject to change. There are 8 TRIG options defined (TRIG_0 to TRIG_7). As shown in Figure 32 suitable jumper block (J7) allows the user to select directly C_TRIG (P0_06) and some other preferred options.
Preliminary document Specifications in this document are tentative and subject to change. Figure 33: PMM2 current Measurement Circuit PMM2 The input to the circuit is the voltage across the sense resistors R74 and R75.The voltage across the sense resistors is sampled simultaneously by 2 differential amplifier stages and is converted by the ADC to a digital value.
Preliminary document Specifications in this document are tentative and subject to change. Figure 34: PMM2 on board peripherals (Power supply, Memory etc.) The circuit can be set in a low current measurement mode from the host (hibernation mode), useful in measuring the current of the DA1470x in hibernation (shipping) mode, which is in the order of some 100s of nA.
Preliminary document Specifications in this document are tentative and subject to change. Negative voltage generator Shift High Prec OPAMP 16.384 EEPROM U11,U12 OPAMPs RSense Figure 35: Current measurement unit PCBA (TOP) 5.2.1 Accuracy of current measurement for DA1470x system (VLDO) The total measuring range of the current measurement circuit of the power measurement module 2 is 100nA to 500mA for VBLDO= 3.3V, implemented into two scales.
Preliminary document Specifications in this document are tentative and subject to change. Table 6: Accuracy of the Current Measurement Circuit Current Range Mode Error (%) 100 nΑ to 1 μΑ Hibernation mode <±10% 1μΑ το 60uA Hibernation mode <±5% 1 μA to 10 μA Default mode <±10% 10 μA to 500mA...
Preliminary document Specifications in this document are tentative and subject to change. 5.2.2 Settings of power configuration header J9 Figure 38: Power connections Jumper block J9 allows for different configurations as described in Error! Reference source not found.. Alternatively, an external current measurement instrument can be connected on these jumpers. Table 7Jumper setting of current measurement connector J9 Settings Operation...
LCD interface and add-on board LCD interface on PRO-Motherboard Figure 39: Header schematic for LCD daughterboard (Interface board) The DA14706 PRO Development kit provides LCD support via a dedicated daughterboard (add-on) mounted on the J37 connector on the PRO-Motherboard side. LCD type: ▪...
Preliminary document Specifications in this document are tentative and subject to change. LCD Amoled board, da1470x-sb-E120A390QSR (500-31-X) The E120A390QSR, 390x390 AMOLED with capacitive touch has been selected and applied on the LCD add- on, da1470x-sb-E120A390QSR (500-31-D). Figure 40: LCD add-on daughterboard from Analog Devices able to generate positive and U1 is the adjustable DCDC converter LT3463EDDPBF negative supplies.
Preliminary document Specifications in this document are tentative and subject to change. Figure 41: QSPI AMOLED LCD daughterboard position on PRO-Development kit Figure 42: LCD TFT daughterboard top (left) and PCBA bottom side (right) DA14706 Devkit User Manual Rev.1.00.93 Page 42 of 58...
Preliminary document Specifications in this document are tentative and subject to change. PRO Daughterboard Main features The system on DA1470x PRO- Daughterboard. consists of the DA1470x SoC, crystals, power and radio sections. The system block diagram and the actual components location are presented in Figure 43.
Preliminary document Specifications in this document are tentative and subject to change. Figure 43: System Block Diagram of DA1470x PRO-Daughterboard Figure 44: PCB top of the DA14706 PRO- Daughterboard. DA14706 Devkit User Manual Rev.1.00.93 Page 44 of 58...
Preliminary document Specifications in this document are tentative and subject to change. Figure 45: PCB bottom of the DA1470x PRO- Daughterboard. Figure 46: PRO- Daughterboard. interface connectors to PRO-Motherboard DA14706 Devkit User Manual Rev.1.00.93 Page 45 of 58...
Preliminary document Specifications in this document are tentative and subject to change. Main Components Description BLE SoC (U1): DA1470x is a BLE SoC family integrating : the latest Arm Cortex M33 application processor, advanced power management functionality allowing the multi power options approach (LiPo, Coincell battery),a Graphic Processing Unit (GPU) for advanced graphics processing, a cryptographic security engine, analog and digital peripherals, a dedicated sensor node controller, and a software configurable protocol engine with a radio that is compliant to the Bluetooth®...
The DA1470x provides three SWD ports (M33, SNC and CMAC) and a UART port. On DA14706 PRO-Devkit, by default, SWD ports for M33 and SNC as well as UART port are accessed through the USB connector of PRO-Motherboard. On Daughterboard two debugging connectors are applied (10 Pos, 1.27mm pitch) one for the CMC/M33 debugging (J4) and one for the SNC debugging (J5).
Preliminary document Specifications in this document are tentative and subject to change. Figure 47: CMAC/M33 & SNC debugging connectors schematic Audio Section DA1470x SoC has provides a Voice Activity Detection (VAD) engine. VAD engine allows DA1470x SoC to stay in sleep mode until enough audible energy has been sensed to trigger an interrupt assertion and consequently wake up the rest of the SoC.
Preliminary document Specifications in this document are tentative and subject to change. Figure 49: Programmable gain amplifier signal routing RF Section A printed F-antenna (ANT1) is used as the radiating element for the DA1470 PRO-DB. The DA1470x RFIO pin is connected to the printed antenna through a RF strip line and a matching circuit as shown below: Figure 50: RF Section of PRO-Daughterboard.
Preliminary document Specifications in this document are tentative and subject to change. On PRO-Daughterboard, the printed IFA antenna (ANT1) is enabled. For conducted measurements J7, MM8130-2600R, microwave coaxial connector with a switch, must be used. The MXHS83QE3000 of Murata (Cable Assembly Coaxial 0.303m SMA to L Type Probe F-M) must be plugged on J7.
Preliminary document Specifications in this document are tentative and subject to change. Figure 52: USB OVP protection (U3) & Rsence (R18) Figure 52 the OVP protection of the USB is being taken care of the NCP367DPMUEETBG, this device it also offers an overvoltage protection related to the LiPo battery via the VBAT pin. R18 is acting as sensing resistor when the PRO-MB is powered from the USB connector (VBUS).
Preliminary document Specifications in this document are tentative and subject to change. The 64Μbit QSPI flash memory used for storage in the PRO- Daughterboard is the MX25U6432FZNI02 from Macronix. During read the operating current may reach the 80mA level for beyond the V18F current capability of 30mA.
Preliminary document Specifications in this document are tentative and subject to change. Table 12: Flash memory signals to the monitoring headers at PRO-Motherboard Flash memory Corresponded Monitoring header Direct Connectivity to Monitoring signal GPIO at PRO-MB at PRO-MB Headers J5 (7) Resistor R30 should be mounted, PCB marking see Figure 55...
Preliminary document Specifications in this document are tentative and subject to change. There is the option for the user to connect a 1Gbit OCTAL NOR flash memory the (MX66UM1G45GXD from Macronix) used for storage. This OCTA flash memory is however, not being populated, along with the correlated monitoring resistors (R30-R33) shown in Figure 57 Figure 57: MX66UM1G45GXD OSPI FLASH schematic...
For proper operation, PRO-Motherboard must be always plugged to source (for e.g. PC, laptop etc.)) through USB. The reason is that a number of circuits (e.g. analog switches, PMM2 module etc) are supplied from the USB connector of the Pro-MB. Table 13: DA14706 PRO-Development kit, Quick setup Description Comments...
Preliminary document Specifications in this document are tentative and subject to change. Ensure correct Define power power source and source for PRO- position for SW1 Daughterboard VBLDO: 3V. It is generated on PRO-Motherboard BAT: it is supplied from LiPo battery or Coin Cell Debug interfaces –...
Preliminary document Specifications in this document are tentative and subject to change. Debug interfaces -–UART After connecting the USB port, two virtual COM parts are created on the PC. The COM port with lowest number is used for UART communication to the DA1470x. The other COM port is used for SPI communication to the Power Management Module.
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Preliminary document Specifications in this document are tentative and subject to change. Revision History Revision Date Description PRELIMINARY – 1 0.91 28-May-2022 Release / 1 comments update (David Sharples). PRELIMINARY – 1 0.92 31-May-2022 Release / 2 Comments updated (David Sharples) PRELIMINARY –...
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