Table Of Contents - Boardcon Embedded Design PICO-IMX8M-MINI Reference User Manual

Content
1 PICO-IMX8M-MINI Introduction ............................................................................................................. 3
1.1 Summary ..................................................................................................................................... 3
1.2 Processor Features ...................................................................................................................... 3
1.3 SoM Specifications ...................................................................................................................... 4
1.4 Block Diagram.............................................................................................................................. 5
1.5 PCB Dimension............................................................................................................................ 6
1.6 Pin Definition ................................................................................................................................ 6
1.7 Development Kit (EM-IMX8M-MINI) ........................................................................................... 14
2 Peripheral Introduction ......................................................................................................................... 15
2.1 Display ....................................................................................................................................... 15
2.2 Camera I/F ................................................................................................................................. 15
2.3 Audio .......................................................................................................................................... 16
2.3.1 Digital Interface (SAI) ....................................................................................................... 16
2.3.2 Sony/Philips Digital Interface ........................................................................................... 18
2.4 Ethernet ..................................................................................................................................... 18
2.5 USB ........................................................................................................................................... 19
2.6 PCIe ........................................................................................................................................... 19
2.7 EMMC/SD/SDIO ........................................................................................................................ 19
2.7.1 EMMC 5.1 ........................................................................................................................ 19
2.7.2 SD/SDIO3.0 ..................................................................................................................... 20
2.8 SPI ............................................................................................................................................. 21
2.8.1 ECSPI .............................................................................................................................. 21
2.8.2 QSPI ................................................................................................................................ 21
2.9 UART ......................................................................................................................................... 21
2.10 I2C ........................................................................................................................................... 22
2.11 PWM ........................................................................................................................................ 23
2.12 JTAG ........................................................................................................................................ 23
3 Product Electrical Characteristics ........................................................................................................ 24
3.1 Dissipation and Temperature ..................................................................................................... 24
3.2 Reliability of Test ........................................................................................................................ 24
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