Package Description - Analog Devices LINEAR LT8491 Manual

PACKAGE DESCRIPTION

7.50 ±0.05
PIN 1
TOP MARK
(SEE NOTE 6)
11.00 ±0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Variation: UKJ64(58)
64(58)-Lead Plastic QFN (7mm × 11mm)
(Reference LTC DWG # 05-08-1922 Rev Ø)
1.80 ±0.05
5.50 REF
0.25 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 ±0.05
7.00 ±0.10
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
For more information
UKJ Package
1.50 ±0.05
9.38 ±0.05
3.60 ±0.05
0.45
3.83
0.50 BSC
9.50 REF
10.10 ±0.05
11.50 ±0.05
53
0.00 – 0.05
52
0.325
REF
1.50 ±0.10
44
1.20 ±0.10
11.00 ±0.10
40
35
33
0.50 REF
31
0.200 REF
www.analog.com
0.70 ±0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
5.50 REF
63 64
1
2
9.50 REF
9.38 ±0.10
0.45 ±0.10
3.83 ±0.10
3.60 ±0.10
20
0.40 ±0.10
27 25 21
0.25 ±0.05
(UKJ64(58)) QFN 0412 REV Ø
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
LT8491
Rev. 0
81