Table of Contents
Advertisement
74
7.3.2 FCBGA Reference Reflow Profile for RoHS/Lead-free Solder
Figure 7–4 FCBGA Reference Reflow Profile for RoHS/Lead-Free SMT
Notes when using RoHS/lead-free solder (SAC305 Tin-Silver-Cu):
•
The final reflow temperature profile will depend on the type of solder paste and
chemistry of flux used in the SMT process or BGA rework process. Modifications
to this reference reflow profile may also be required in order to accommodate
to other critical components.
•
The use of a reflow oven with 10 heating zones or above is highly recommended.
•
To ensure that the reflow profile meets the target specification on both sides of
SMT components, a different reflow profile for the first and second reflow may
be required.
•
A mechanical stiffening carrier boat can be used to minimize PWB warpage
during the reflow process.
•
It is suggested to decrease the temperature cooling rate to minimize BGA
component and PWB warpage.
•
This recommended reflow profile applies only to the RoHS/lead-free (high
temperature) soldering process, and it should not be applied to Eutectic solder
packages without any reliability validation.
•
Maximum three reflows are allowed on the same part.
"Vega 10" Databook
56006_1.00
Mechanical Data
© 2017 Advanced Micro Devices, Inc.
AMD Confidential - Do not duplicate.
Advertisement
Table of Contents
