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d. Airflow is measured in wind tunnel.
e. Contact NVIDIA for airflow numbers with other active modules' power levels.
MCX623106TC-CDAT / MCX623106TN-CDAT /
MCX623106GN-CDAT / MCX623106GC-CDAT Specifications
Physical
Size: 5.59in. x 2.71in (142.00mm x 68.90mm)
Connector: Dual QSFP56 Ethernet (copper and optical)
Data Rate:
Protocol
Ethernet: 100GBASE-CR4, 100GBASE-KR4, 100GBASE-SR4, 50GBASE-R2, 50GBASE-R4,
Support
40GBASE-CR4, 40GBASE-KR4, 40GBASE-SR4, 40GBASE-LR4, 40GBASE-ER4, 40GBASE-R2,
25GBASE-R, 20GBASE-KR2, 10GBASE-LR,10GBASE-ER, 10GBASE-CX4, 10GBASE-CR, 10GBASE-
KR, SGMII, 1000BASE-CX, 1000BASE-KX, 10GBASE-SR, 100GBASE-CR2, 100GBASE-KR2,
100GBASE-SR2
PCI Express Gen 3.0/4.0: SERDES @ 16.0GT/s, 16 lanes (2.0 and 1.1 compatible)
Voltage: 12V
Power
Power
Specificatio
(a)
Typical Power
ns
Maximum Power
Maximum power available through QSFP56 port: 5W (each port)
Voltage: 3.3Aux
Maximum current: 100mA
Temperature
Environmen
tal
Humidity
Altitude (Operational)
Requirements @
Safety
Regulatory
EMC
RoHS
a. Power numbers are provided for passive cables only. For board power numbers while using active
cables, please add the outcome of the following formula to the passive cables power numbers
Ethernet
Cable Type
Passive Cables
(b)
Passive Cables
Operational
Non-operational
90% relative humidity
3050m
Airflow
Passive Cable
(d)(e)
55C
Active 2.5W Cable
Active 3.5W Cable
CB / cTUVus / CE
CE / FCC / VCCI / ICES / RCM
RoHS compliant
1/10/25/40/50/100 Gb/s
PCIe Gen
PCIe Gen 4.0
3.0
TBD
18.96W
TBD
26.64W
0°C to 55°C
-40°C to 70°C
(c)
Hot Aisle - Heatsink to Port
550LFM
700LFM
1100LFM
70
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Troubleshooting
