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Device Markings
Figure 1
provides an example of the 2837xS device markings and defines each of the markings. The
device revision can be determined by the symbols marked on the top of the package as shown in
Figure
1. Some prototype devices may have markings different from those illustrated.
example of the device nomenclature.
Package
Pin 1
SILICON REVISION CODE
B
C
(1)
Silicon Revision ID
TMS
PREFIX
TMX = experimental device
TMP = prototype device
TMS = qualified device
DEVICE FAMILY
320 = TMS320 MCU Family
TECHNOLOGY
F = Flash
SPRZ422D – August 2014 – Revised July 2016
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TMS320
F28379SPTPT
$$#-YMLLLLS
G4
Figure 1. Example of Device Markings
Table 1. Determining Silicon Revision From Lot Trace Code
SILICON REVISION
B
C
320
F
28379S
PTP
T
PACKAGE TYPE
DEVICE
28379S
28377S
28376S
28375S
28374S
Figure 2. Example of Device Nomenclature
Copyright © 2014–2016, Texas Instruments Incorporated
=
YMLLLLS
Lot Trace Code
=
YM
2-Digit Year/Month Code
=
LLLL
Assembly Lot
=
S
Assembly Site Code
=
$$
Wafer Fab Code as applicable
=
#
Silicon Revision Code
=
G4
Green (Low Halogen and RoHS-compliant)
(1)
REVID
Address: 0x5D00C
0x0002
0x0003
TEMPERATURE RANGE
T
−40°C to 105°C (T )
=
=
S
−40°C to 125°C (T )
=
Q
−40°C to 125°C (T )
(Q refers to Q100 qualification for automotive applications.)
337-Ball ZWT New Fine Pitch Ball Grid Array (nFBGA)
176
-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (HLQFP)
100-Pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
TMS320F2837xS Delfino™ Microcontrollers
Device Markings
Figure 2
shows an
COMMENTS
This silicon revision is available as TMX.
This silicon revision is available as TMS.
J
J
A
5
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