Table of Contents
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1.
2
1.1
Introduction ...................................................................................................................... 2
1.1.1
Overview ..........................................................................................................................................................2
1.1.2
Aim of the document ........................................................................................................................................2
1.2
Services provided by the feature or equipment ...................................................................... 2
1.3
External Interfaces ............................................................................................................ 2
1.4
Terminology / Abbreviations ............................................................................................... 7
1.5
Related Documents........................................................................................................... 7
1.6
Features .......................................................................................................................... 8
2.
2.1
Standards ........................................................................................................................ 8
2.1.1
BT related certification ...................................................................................................................................8
2.2
Environmental requirements ............................................................................................. 11
3.
3.1
Bluetooth WLAN daughter board BT stack diagram .............................................................. 11
3.2
Bluetooth WLAN daughter board bloc diagram .................................................................... 12
3.3
Mechanical aspects......................................................................................................... 12
3.4
Specification .................................................................................................................. 15
4.
4.1
Electronic ...................................................................................................................... 18
4.1.1
RF solution to be implemented .................................................................................................................... 18
4.1.2
Schematic ...................................................................................................................................................... 18
4.1.3
BOM .............................................................................................................................................................. 19
4.2
Radio frequency ............................................................................................................. 21
4.2.1
Antenna ......................................................................................................................................................... 21
4.2.2
Immunity to external spurious and interferences ....................................................................................... 25
4.3
Layout........................................................................................................................... 26
4.3.1
BTWDB layout .............................................................................................................................................. 26
4.3.2
Place requirements of BTWDB on mainboard ........................................................................................... 26
Table of Content
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Related Manuals for Alcatel-Lucent Enterprise 8088
Summary of Contents for Alcatel-Lucent Enterprise 8088
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Page 1: Table Of Contents
Table of Content Generalities Introduction ........................2 1.1.1 Overview ................................2 1.1.2 Aim of the document ............................2 Services provided by the feature or equipment ..............2 External Interfaces ......................2 Terminology / Abbreviations ....................7 Related Documents......................7 Features .......................... 8 General Requirements 8 Standards ........................ -
Page 2: Generalities
This document is intended to give all the technical inputs in order to make a BTWDB daughter board which will be used on the Alcatel-Lucent Enterprise IP Phones. A first step will be to use it on Pleiades phone, but we should care to make it possible to be used also on nextgen phones. - Page 3 The interface signals are listed hereafter: Pin Name Type Description Voltage Ground connections Main power voltage source input VBAT 3.3V Power up/down internal regulators used by WiFi WL_REG_ON section WLAN to wake-up HOST WL_INT SDIO data line 2 SDIO_DATA_2 1.8V SDIO data line 3 SDIO_DATA_3 1.8V...
- Page 4 PCM clock PCM_CLK 1.8V Ground connections PCM data input PCM_IN 1.8V PCM sync signal PCM_SYNC 1.8V Ground connections Bluetooth UART interface UART_RTS_N 1.8V Bluetooth UART interface UART_TXD 1.8V Bluetooth UART interface UART_RXD 1.8V Bluetooth UART interface UART_CTS_N 1.8V Ground connections The VBAT pin can accept 3.3V +/- 5%.
- Page 5 The PCM bus is for audio data. The PCM Interface on the AP6256 can connect to linear PCM Codec devices in master or slave mode. In master mode, the AP6256 generates the PCM_CLK and PCM_SYNC signals, and in slave mode, these signals are provided by another master on the PCM interface and are inputs to the AP6256.
- Page 6 SDIO 4-Bit Mode DATA0 Data Line 0 DATA1 Data Line 1 or Interrupt Data Line 2 or Read Wait DATA2 DATA3 Data Line 3 Clock Command Line Check the AP6256 datasheet for more information. The module has signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN and internal regulator blocks.
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Page 7: Terminology / Abbreviations
1.4 Terminology / Abbreviations BTWDB: BlueTooth WLAN Daughter Board BT: BlueTooth 1.5 Related Documents Document Reference number Alcatel documents [1] PLEIADES HLA for the new range .docx OD-401314 External documents [3] AP6256 datasheet_V2.5_03022020.pdf... -
Page 8: Features
1.6 Features The board must provide the following features: WLAN: TX and RX low-density parity check (LDPC) support for improved range and power efficiency. Single-stream spatial multiplexing up to 433.3 Mbps data rate. Supports 1 antenna with one for WLAN & Bluetooth shared port ... - Page 9 Requested certifications: Generic Certification of BT&WLAN Standards Module Europe ETSI EN 300 328 V2.2.2 (2019-07) - ( 2,4 GHz ISM band ) ETSI EN 301 893 V2.1.1 ( 5 GHz RLAN ) ETSI EN 300 440 V2.2.1 ( 5.725-5.875 GHz RLAN ) FCC 47 CFR Part 15 Subpart C ( 2,4 GHz ISM band )
- Page 10 Brazil Radio module certification Anatel Korea Radio module certification Mexico Radio module certification IFETEL Taiwan Radio module certification FCC 47CFR 2.1091 ( at least 20 cm between transmitter and the body ) Refer to FCC KDB Publication 447498 D01 : SAR test exclusion Human exposure for...
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Page 11: Environmental Requirements
2.2 Environmental requirements These are the same as for the terminal for which this board is intended. The tests are made on the daughter board assembled or mounted in a final product, so they are part of the product qualification. For details see for example PLEIADES HLA for the new range 3 General Description 3.1 Bluetooth WLAN daughter board BT stack diagram... -
Page 12: Bluetooth Wlan Daughter Board Bloc Diagram
3.2 Bluetooth WLAN daughter board bloc diagram 3.3 Mechanical aspects This board will be mounted on other boards. So we can make it with a dongle or directly mounted on board. For radiofrequency propagation reasons, the antenna area must not cover any copper plane. For industrial reasons, the board must lay on the CPU board on at least 2/3 of it’s surface. - Page 13 Connections: To reduce cost, we want to avoid a board to board connector. The daughter board will use the technique of the cut metal holes on the board edge (top view): Metal holes Gold plating Before milling During milling Resulting connections The connections number is 33, spread over three sides of the board as following: Mounting on boards The daughter board is mounted flat directly on the other boards.
- Page 14 Mainboard The solder is put here Daughter board Care must be taken in order to equilibrate the layout, to avoid that the PCB becomes curved during soldering process (due to differential thermal expansion of the copper layers). The cut-hole size must be defined big enough in order to get a solid solder area, and to avoid that the copper of the hole is snatched during milling process.
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Page 15: Specification
On Main board, the recommended footprint is as follows: The GND pins must be connected to the GND plane as short as possible, with enough vias. Dotted line is the board outline. 3.4 Specification Model Name BTWDB01 1Tx/1Rx 802.11 ac/a/b/g/n Wi-Fi Product Description + BT 5.0 Module L x W: 29 x 17.5(Typ.)mm、H :... - Page 16 Bluetooth specification: Feature Description General Specification BDR(1Mbps)、EDR(2、 Bluetooth Standard 3Mbps)、LE(1Mbps、2Mbps) Host Interface UART Frequency Band 2402 MHz ~ 2480 MHz 79 channels for classic、40 Number of Channels channels for BLE GFSK, π/4-DQPSK, 8DPSK Modulation RF Specification MAX (dBm) BDR Output EIPR Power EDR Output EIPR Power LE Output EIPR Power WLAN RF specification...
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Page 18: Detailed Technical Description
4 Detailed Technical Description 4.1 Electronic 4.1.1 RF solution to be implemented The chosen AMPAK AP6256 Module which is a total solution for a combination of Wi-Fi + BT technologies. For WI-FI, it supports 802.11a/b/g/n/ac For Bluetooth, it complies with Bluetooth core specification V5.0 Bluetooth power level is class 2: BDR output power is 6dBm EDR output power is 6dBm... -
Page 19: Bom
4.1.3 BOM Name Concatenated Description 3ML22008AAA PLEIADES BT_WLAN MODULE PCB__ 1AB144890041 RES-CHIP_THICK-FILM_0Ohm_0%_0402 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um... - Page 20 1AB088200009 CAP_CER-CM/L2_X7R_100nF_10%_16V_0402_550um 1AB110830003 CAP_CER-CM/L1_C0G_27pF_5%_50V_0402_550um 1AB110830003 CAP_CER-CM/L1_C0G_27pF_5%_50V_0402_550um 1AB147730004 CAP_CER-CM/L2_X5R_4.7uF_10%_6.3V_0603_900um 1AB147730004 CAP_CER-CM/L2_X5R_4.7uF_10%_6.3V_0603_900um 1AB147730004 CAP_CER-CM/L2_X5R_4.7uF_10%_6.3V_0603_900um INDUCTOR_RF_1.2nH_25%_300mA_100MHz/1GHz_UNSHLD_SM1005(040 2)_ML 1AB150920003 1AB399060001 INDUCTOR_RF_2.2uH_20%_1.2A_SHLD_SM2520(1008)_ML 1AB110820013 CAP_CER-CM/L1_C0G_500fF_+/- .25pF_50V_0402_550um 1AB203820005 MMIC UWAVE_BT5.0_WIFI module_AP6256_PLCC44_shielding 1AB226670015 XTAL_37.4MHz_16pF_initial 10ppm_temp 10ppm_2.5X2.0/4_-20C/75C...
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Page 21: Radio Frequency
4.2 Radio frequency 4.2.1 Antenna We use PCB antenna to compatible with 2.4GHz and 5GHZ. This is a low-cost solution. We choice the meandered inverted F antenna, which is a variant to have more compacity Width of wide Antenna trace: 1.1mm Width of narrow Antenna trace: 0.7mm simulation value for designed Antenna pattern efficiency:... - Page 22 5 GHz current and radiation diagram simulation:...
- Page 23 S 11 diagram simulation: R eal Antenna RF 3D Gain 2405-2800M 3D GAIN...
- Page 24 Total Azimuth = 0.0 Elevation = 0.0 Roll = 0.0 Total Azimuth = 88.9 Elevation = -2.2 Roll = -90.2 Total Azimuth = -13.5 Elevation = -86.3 Roll = 77.2 5100-5900M 3D GAIN...
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Page 25: Immunity To External Spurious And Interferences
Total Azimuth = 0.0 Elevation = 0.0 Roll = 0.0 Total Azimuth = 89.1 Elevation = -9.2 Roll = -87.4 Total Azimuth = 62.0 Elevation = -88.7 Roll = 151.9 For real RF PCB antenna: Max 2.4GHz antenna gain is: 3.16dbi Max 5GHz antenna gain is: 3.00dbi 4.2.2 Immunity to external spurious and interferences... -
Page 26: Layout
The shield dimension is 10.60x 10.60mm. 4.3 Layout 4.3.1 BTWDB layout The layout recommendations from AMPAK Instruments must be followed. 4.3.2 Place requirements of BTWDB on mainboard To make the BTWDB on mainboard has similar antenna resonant frequency as BTWDB alone, there are some BTWDB place requirements. - Page 27 4.4.2 L-Label location Shield size:10.6mm*10.6mm Module dimension: L x W: 29 x 17.5(Typ.)mm、H : 2.45 (Max.) mm 4.4.3 L-Label content The information available on this label are: Product information: G2 Manufacturing information: G5, G7, G13 The details for each kind of information is provided in the example of label hereafter. L-Label content: (yellow bullets (x) are contextual and need to be updated with product information’s) 3ML26108AAAA01...
- Page 28 3ML26108AAAA01;SER202112345;BD:AABBCCDDEEFF;MAC:AABBCCDDEEFF;FCC ID: OL3BTWDB01;IC: 1737D-BTWDB01; FCC ID and IC number information is inserted inside the QR code. If want to check FCC ID or IC number, you can scan the QR code to get the information. FCC ID: OL3BTWDB01 IC: 1737D-BTWDB01 FCC Statement This device complies with Part 15 of the FCC Rules.
- Page 29 CAUTION To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. (i) the device for operation in the band 5,150 – 5,250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems.
- Page 30 The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The host product itself is required to comply with all other applicable FCC & IC equipment authorizations regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product;...
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