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Summary of Contents for GigaDevice Semiconductor GD32W515
- Page 1 GigaDevice Semiconductor Inc. GD32W515 Hardware Development Guide Application Note AN066...
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Page 2: Table Of Contents
AN066 GD32W515 Hardware Development Guide Table of Contents Table of Contents ......................2 List of Figures ........................ 3 List of Tables ........................4 Introduction ......................5 Hardware design ....................6 2.1. Power supply ....................... 6 2.2. Reset and mode selection circuit ................8 2.3. -
Page 3: List Of Figures
AN066 GD32W515 Hardware Development Guide List of Figures Figure 2-1. Circuit diagram of GD32W515 series MCU module ............6 Figure 2-2. Circuit at the module power .................... 7 Figure 2-3. RF power pin circuit of the chip ..................7 Figure 2-4. Circuit of other power pins of the chip ................8 Figure 2-5. -
Page 4: List Of Tables
AN066 GD32W515 Hardware Development Guide List of Tables Table 1-1. Applicable Products ......................5 Table 2-1. BOOT Mode ......................... 8 Table 3-1. Refer to the PCB layer definition ..................14 Table 4-1. Package Model Description ..................... 21 Table 5-1. Revision history ........................ 22... -
Page 5: Introduction
AN066 GD32W515 Hardware Development Guide Introduction This paper is designed for developers of 32-bit general purpose MCU GD32W515 series based on Arm Cortex -M33 architecture and Trustzone highly integrated 2.4GHz Wi-Fi ® ® system-on-chip(SOC). The hardware development of GD32W515 series products is generally introduced.Such as power supply, reset, clock, RF circuit and so on.The purpose of this... -
Page 6: Hardware Design
XTAL circuit design LXTAL circuit design Figure 2-1. Circuit diagram of GD32W515 series MCU module Power supply 2.1. GD32W515 series MCU module power pins can be divided into MCU RF part power pins and other parts (digital, analog, etc.) power pins. -
Page 7: Figure 2-2. Circuit At The Module Power
AN066 GD32W515 Hardware Development Guide AVDD33_ANA(Pin11), AVDD33_PA(Pin17), AVDD33_CLK(Pin18). The latter includes VBAT(Pin10), VDDA (Pin21), VDD (Pin44), and the standard operating voltage of the above power pins is 3.3V. It is recommended to place a large capacitor and a small capacitor at the module power entrance (as shown in Figure 2-2. -
Page 8: Reset And Mode Selection Circuit
If GD32W515 is used as the master MCU, it is recommended to use NRST as the enabling pin, and the PU is always raised. If the GD32W515 is used as a slave device, you are advised to use PU as the enabling pin, and the NRST is always raised. -
Page 9: Rf Circuit
PU pin is pulled down to disable W515. RF circuit 2.3. The reference design of GD32W515 RF circuit is shown in Figure 2-6. RF circuit design.The RF pin of the chip is Pin12, and there is a set of π-type (CLC combination) matching circuit... -
Page 10: Xtal Circuit
Figure 2-6. RF circuit design XTAL circuit 2.4. GD32W515 module supports 40M, 26M and other frequency patch passive crystal, the default frequency is 40MHz, and the package can choose 3225, 2520, etc. The crystal circuit of GD32W515 series MCU refer to Figure 2-7. -
Page 11: Lxtal Circuit
AN066 GD32W515 Hardware Development Guide Figure 2-8. Recommended crystal index LXTAL circuit 2.5. LXTAL crystal is a 32.768kHz low speed external crystal (passive crystal), which can provide a low power and high precision clock source for RTC. Figure 2-9. LXTAL external crystal circuit Figure 2-10. - Page 12 AN066 GD32W515 Hardware Development Guide In bypass mode, the signal is input from OSC32_IN and the OSC32_OUT is suspended; For the value of external matching capacitance, please refer to the formula C = 2*(C ), where C is the stray capacitance of PCB and MCU pins, and the...
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Page 13: Pcb Layout Design
The Layout of GD32W515 module reference design is shown in Figure 3-1. GD32W515 module layout. Figure 3-1. GD32W515 module layout In the Layout design of GD32W515 module, the following parts should be noted: PCB stack design; Power supply network;... -
Page 14: Pcb Stack Design
AN066 GD32W515 Hardware Development Guide PCB Stack Design 3.1. GD32W515 module PCB stacking should be designed with four layers, and the layer definition can be referred to Table 3-1. Refer to the PCB layer definition： Table 3-1. Refer to the PCB layer definition... -
Page 15: Rf Circuit Design
AN066 GD32W515 Hardware Development Guide Figure 3-2. Power supply circuit layout design RF Circuit Design 3.3. The RF line impedance must be 50 Ohm. During the design, it is necessary to calculate the line width and line distance of RF routing based on the permittivity of plate and PCB laminated structure, so as to ensure the impedance consistency of RF routing and avoid impedance mutation or offset. -
Page 16: Xtal Circuit Design
AN066 GD32W515 Hardware Development Guide through-hole can be equivalent to a strong inductor, and the two parallel short ground through- holes can be equivalent to a weak inductor. In this case, the matching circuit structure can be equivalent to (C + L) + L + (C + L). The purpose of the above means is to construct the... -
Page 17: Gnd Integrity & Epad Design
AN066 GD32W515 Hardware Development Guide routing. The load capacitors on both sides are connected to the corresponding GND PAD on the crystal, and multiple GND VIA are placed to improve heat dissipation. Try not to walk any transmission line under the crystal, keep the intact GND laying copper. -
Page 18: Shielding Cover Design
AN066 GD32W515 Hardware Development Guide For the chip EPAD, you are advised not to connect it to the external copper layer at the TOP layer. More GND VIA is used for heat dissipation, as shown in Figure 3-7. MCU EPAD layout design. -
Page 19: Routing And Ploygon Design
AN066 GD32W515 Hardware Development Guide Figure 3-8. Layout design of shielding cover Routing and Ploygon Design 3.7. In addition to the power line and RF line width requirements described above, it is recommended that the GPIO line width should be 5-6mil and the GND line width should be at least 8-10mil. -
Page 20: Figure 3-9. Differential Pair Routing Layout Design
AN066 GD32W515 Hardware Development Guide Figure 3-9. Differential pair routing layout design The copper laying area of the module PCB should be close to the size of the board frame. Before laying copper, you can first hit more GND VIA in the blank area according to irregular ways, and hit a row of GND VIA on the side of the board;... -
Page 21: Package Description
AN066 GD32W515 Hardware Development Guide Package Description GD32W515 series has two package forms, QFN56 and QFN36 respectively. Table 4-1. Package Model Description Part Number Package GD32W515PxQ6 QFN56(7x7, 0.4pitch) GD32W515TxQ6 QFN36(5x5, 0.4pitch) (The unit of size is mm) -
Page 22: Revision History
AN066 GD32W515 Hardware Development Guide Revision history Table 5-1. Revision history Revision No. Description Date Initial Release Aug.30 2022... - Page 23 Important Notice This document is the property of GigaDevice Semiconductor Inc. and its subsidiaries (the "Company"). This document, including any product of the Company described in this document (the “Product”), is owned by the Company under the intellectual property laws and treaties of the People’s Republic of China and other jurisdictions worldwide.
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