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eases the burden on the main 5 V supply to provide
regulated power when the output is shorted. The
power-switch rise and fall times are controlled to
minimize current surges during turn-on and turn-off.
TPS2065CDBVR (IC1301)
TPS20xxC
EN or EN
SLVSAU6A – JUNE 2011 – REVISED JULY 2011
FUNCTIONAL BLOCK DIAGRAM
TPS2065CDBVR Block Diagram
IN
V
IN
R
FLT
10 kW
NAME
8-PIN PACKAGE
GND
FLT
EN or EN
EN or
Pad*
GND
EN
IN
FLT
Figure 1. Typical Application
OUT
PowerPAD
(DGN ONLY)
TPS2065CDBVR Pin Discriptions
Table 1. DEVICES
5-PIN PACKAGE
NAME
EN or EN
8-PIN PACKAGE
DEVICES
EN or EN
GND
(PowerPad) ™
GND
IN
TPS2051C
IN
FLT
TPS2065C
FLT
OUT
TPS2069C
OUT
PowerPAD
TPS2000C / 1C
(DGN ONLY)
DEVICE INFORMATION
table.
5-PIN PACKAGE
EN or EN
GND
IN
FLT
OUT
6
6
Current
Sense
IN
Charge
Pump
DGN
(Top View)
EN or
EN
8
GND
1
OUT
IN
2
7
OUT
IN
3
6
UVLO
OUT
GND
4
5
FLT
Current
DEVICE INFORMATION
Sense
V
OUT
IN
OUT
150 mF
Charge
PINS
DESCRIPTION
Pump
EN or
4
Enable input, logic high turns on power switch
EN
1
Ground connection
UVLO
2, 3
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
GND
to the IC
5
Active-low open-drain output, asserted during over-current, or over-temperature conditions
6, 7, 8
Power-switch output, connect to load
PAD
Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal performance.
PAD may be left floating if desired. See
for guidance.
(1)
PINS
DESCRIPTION
STATUS
4
Enable input, logic high turns on power switch
MSOP-8
4
Enable input, logic high turns on power switch
2
Ground connection
SOT23-5
1
Ground connection
5
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
-
2, 3
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
Preview
to the IC
to the IC
3
Active-low open-drain output, asserted during over-current, or over-temperature conditions
Active
Preview
5
Active-low open-drain output, asserted during over-current, or over-temperature conditions
1
Power-switch output, connect to load.
Active
6, 7, 8
Power-switch output, connect to load
PAD
Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal performance.
Active
PAD may be left floating if desired. See
for guidance.
4
Enable input, logic high turns on power switch
2
Ground connection
5
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
to the IC
3
Active-low open-drain output, asserted during over-current, or over-temperature conditions
1
Power-switch output, connect to load.
Copyright © 2011, Texas Instruments Incorporated
CS
Current
(Disabled+
Limit
DBV
UVLO)
(Top View)
Driver
OUT
1
5
IN
GND
2
OTSD
9-ms
FLT
3
4
EN or EN
Deglitch
Thermal
Sense
CS
PIN FUNCTIONS
Current
(Disabled+
Limit
UVLO)
Driver
9-ms
OTSD
Deglitch
Thermal
Sense
DEVICE INFORMATION
POWER DISSIPATION AND JUNCTION TEMPERATURE
PIN FUNCTIONS
-
-
POWER DISSIPATION AND JUNCTION TEMPERATURE
76
OUT
FLT
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OUT
FLT
section
Copyright © 2011, Texas Instruments Incorporated
Copyright © 2011, Texas Instruments Incorporated
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