Table of Contents
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CONTENTS
ABOUT THIS MANUAL ................................................................3
What you can do with this manual ...........................................3
Using Adobe Reader (Windows version) ...................................4
SAFETY PRECAUTIONS ...............................................................6
NOTE FOR SCHEMATIC DIAGRAM ..............................................7
NOTE FOR PARTS LIST ................................................................7
1. Ground for Human Body ......................................................7
2. Ground for Workbench ........................................................7
TECHNICAL SPECIFICATIONS .....................................................9
DIMENSION ..............................................................................10
CAUTION IN SERVICING ...........................................................11
Initializing This Unit .................................................................11
DISASSEMBLY ..........................................................................12
1. MAIN PCB ...........................................................................14
2. SMPS PCB ...........................................................................14
3. FRONT ASS'Y ......................................................................15
4. BOTTOM ASSY ....................................................................16
SPECIAL MODE .........................................................................17
Special mode setting button ..................................................17
1. Factory Initialization Mode.................................................18
2. User Initialization Mode .....................................................19
3. Version Display Mode ........................................................20
4. Protection History Display Mode .......................................22
Procedure after Replacing the Printed circuit boards. ...........24
Procedure after Replacing the Microprocessor, etc. ..............24
FIRMWARE UPDATE PROCEDURE ............................................25
1. Updating via USB ...............................................................25
2. Updating via DPMS ............................................................28
3. Updating via Touch Sensor ................................................29
TROUBLE SHOOTING ................................................................30
1. OLED dose not light ...........................................................30
2. No Sound. Noise generated ...............................................31
2.1.1. COMMON (DIR-SPK Out / signal)....................................31
2.1.3. Preout / Subwoofer out .................................................33
2.2. Analog IN ..........................................................................34
2.3. USB / ETHERNET / Wi-Fi / Bluetooth .................................35
2.4. Optical / Coaxial In ............................................................37
MEASURING METHOD AND WAVEFORMS ...............................38
BLOCK DIAGRAM .....................................................................41
POWER DIAGRAM ....................................................................42
WIRING DIAGRAM ....................................................................43
PRINTED CIRCUIT BOARDS ......................................................44
SCHEMATIC DIAGRAMS (01/10)...............................................46
SCH01_FRONT .........................................................................46
SCH02_TOUCH ........................................................................47
SCH03_LED HP P.SW ...............................................................48
SCH04_MAIN POWER ..............................................................49
SCH05_MAIN CPU CY920 ........................................................50
SCH06_MAIN DSP DIR FPGA ...................................................51
SCH07_MAIN CSRA .................................................................52
SCH08_MAIN SPKOUT .............................................................53
SCH09_MAIN PREOUT .............................................................54
SCH10_SMPS ...........................................................................55
EXPLODED VIEW ......................................................................56
PACKING VIEW .........................................................................57
SEMICONDUCTORS ..................................................................58
1. IC's ......................................................................................58
2. DISPLAY .............................................................................86
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