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HP 378927-B21 Quickspecs page 13

Bladesystem p-class interconnect components

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QuickSpecs
Technical Specifications
Operating and
Operating and
Operating and
Operating and
Dimensions
Dimensions
Dimensions
Dimensions
Performance
Performance
Performance
Performance
Specifications for GbE2
Specifications for GbE2
Specifications for GbE2
Specifications for GbE2
Interconnect Switch
Interconnect Switch
Interconnect Switch
Interconnect Switch
Weight
Weight
Weight
Weight
Performance
Performance
Performance
Performance
Forwarding Mode
Forwarding Mode
Forwarding Mode
Forwarding Mode
MAC Addresses
MAC Addresses
MAC Addresses
MAC Addresses
Forwarding Table
Forwarding Table
Forwarding Table
Forwarding Table
Age Time
Age Time
Age Time
Age Time
Memory
Memory
Memory
Memory
Compliance
Compliance
Compliance
Compliance
Network Transfer
Network Transfer
Network Transfer
Network Transfer
Rate
Rate
Rate
Rate
Connector
Connector
Connector
Connector
EMI
EMI
EMI
EMI
Safety
Safety
Safety
Safety
Power
Power
Power
Power
Requirements
Requirements
Requirements
Requirements
Temperature
Temperature
Temperature
Temperature
Range
Range
Range
Range
Relative Humidity
Relative Humidity
Relative Humidity
Relative Humidity
(non-condensing)
(non-condensing)
(non-condensing)
(non-condensing)
Wet Bulb
Wet Bulb
Wet Bulb
Wet Bulb
Temperature
Temperature
Temperature
Temperature
Height
Width
Depth
12.0 lb/5.4 kg per interconnect switch
24 Gbps External port bandwidth per server blade enclosure (full duplex)
Forwarding rate 1.5 million pps per gigabit port (64-byte packets)
Auto-MDI/MDIX, auto-negotiation and auto-sensing with full-duplex support
Store and forward
2,048 per interconnect switch
Maximum age: 1 to 65535 seconds; default: 300 seconds
128MB Main, 32MB flash and 2MB packet buffer per interconnect switch
IEEE 802.3, 802.3u, 802.3ab, 802.3x, 802.3z (F-GbE2 only), 802.1D,
802.3ac, 802.3ad (Static), and 802.1Q
SNMP v1 (RFC 1157), MIB-II (RFC 1213), Bridge MIB (RFC 1493), Interface
Group MIB (RFC 2863), Ethernet MIB (RFC 1643), 802.1Q Extended Bridge
MIB , Entity MIB (RFC 2037), RADIUS Authentication MIB, 802.3-2002 MIB,
SNMP Trap Convention (RFC 1215), Bridge Trap (RFC 1493), Remote
Monitoring Traps (RFC 1757) and HP Enterprise Switch MIBs and
Environmental Traps
RADIUS (RFC 2138), Telnet (RFC 854), TFTP client (RFC 783), SSH v1.5,
SCP v1.5, NTP v2 (RFC 1119), BootP client (RFC 2132), and XModem
10 Base-T (half-duplex)
10 Base-T (full-duplex)
100 Base-TX (half-duplex) 100 Mbps
100 Base-TX (full-duplex)
1000 Base-TX (half and
full-duplex)
1000 Base-SX (full-duplex) 2000 Mbps
12 RJ-45, 2 DB-9 (C-GbE2 Interconnect Kit)
8 LC fiber, 4 RJ-45, 2 DB-9 (F-GbE2 Interconnect Kit)
FCC Class A
ICES-003 Class A
AS/NZS 3548 Class A
VCCI Class A
UL/CUL Listed Accessory
CE
48VDC: 2040 mA, 98 W maximum (per interconnect switch without Storage
Connectivity Kit)
48VDC: 2355 mA, 113 W maximum (per interconnect switch with Storage
Connectivity Kit)
Operating
Non-operating
Operating
Non-operating
Operating
Non-operating
DA - 12331
Worldwide — Version 4 — September 12, 2007
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
HP BladeSystem p-Class Interconnect Components
10.405 in (26.43 cm)
1.535 in (3.899 cm)
27.697 in (70.35 cm)
10 Mbps
20 Mbps
200 Mbps
2000 Mbps
50° to 95° F (10° to 35° C)
-22° to 140° F (-30° to 60° C)
20% to 80%
5% to 95%
82.4° F (28° C)
101.7° F (38.7° C)
Page 13

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