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DBT0038A
38 X (0.3)
38 X (0.5)
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
38 X (1.5)
SYMM
1
19
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
www.ti.com
EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(R0.05) TYP
38
SYMM
20
4220221/A 05/2020
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