Notes - Texas Instruments ADS869 Series Manual

DBT0038A
A
1
9.75
9.65
NOTE 3
19
B

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SCALE 2.000
6.55
6.25 TYP
PIN 1 INDEX AREA
4.45
4.35
NOTE 4
(0.15) TYP
SEE DETAIL A
PACKAGE OUTLINE
TSSOP - 1.2 mm max height
38 X 0.5
38
2X
9
20
38 X 0.23
0.17
0.1 C A B
0.25
GAGE PLANE
0 -8
www.ti.com
SMALL OUTLINE PACKAGE
SEATING
C
PLANE
0.1 C
1.2 MAX
0.75
0.50
DETAIL A
A 20
TYPICAL
4220221/A 05/2020
0.15
0.05