Option - TEC SL-9000 Owner's Manual

2. SPECIFICATION

2.2 OPTION

Option Name
LON Connector
TM8P-88P
LON Terminal
Resistor 285D-8P
LON
LON Cable
S-STLAN-2P
(200 m/roll)
I/O PC Board
TMCC
TMCC Cable Kit
MEMO PC Board
(SL-9000 only)
Memory Module
10 Base T (LAN) Interface
Board (SL-9000N only)
NOTES:
1. Contact TOSHIBA TEC H.Q. or your nearest TOSHIBA TEC representative.
2. Order from TOSHIBA TEC Parts Center or purchase locally.
3. When purchasing memory modules locally, select one having the following specifications.
■ Maker: HITACHI Pseudo Static RAM (OP-9000-RAM-512KB)
HITACH Static RAM (OP-9000-SRAM-512KB)
■ Type: HM658512ALP-8V 80 ns, 600 mil 32-pin Plastic DIP (DP-32) (OP-9000-RAM-512KB)
HM628512ALP-770ns, 600mil 32-pin Plastic DIP (DP-32) (OP-9000-SRAM-512KB)
4. The MEMO PC Board (Flash ROM type) is installed in the SL-9000N model as standard.
Model No.
or Part No.
Part No. A modular connector used to connect scales to
EAJ-0028001 each other in a LON configuration.
Part No. A modular resistor attached to the scales
EAJ-0029001 connected at both ends of the LON configuration.
Part No. An 8-pin telephone cable used with the LON
10319100003 connectors attached to both ends of the cable.
This cable connects scales to each other in a
LON configuration.
OP-9000-IOB An I/O board equipped with the TMCC interface
and PC-AT keyboard interface ports. It is used
to construct a TMCC system and program PLU
data, etc..
OP-9000-IOCN- A cable kit for the TMCC interface.
TMCC
OP-9000- This board is used to expand the PLU memory to
PIGGYBACK 4MB by installing the memory module.
OP-9000-
PIGGYBACK-
S/F
OP-9000-RAM- DIP type PS-RAM to be installed on the MEMO
512KB PC board (OP-9000-PIGGYBACK) for memory
expansion. When expanding the memory,
install the two modules as one set.
OP-9000-SRAM- DIP type S-RAM to be installed on the MEMO PC
512KB board (OP-9000-PIGGYBACK-S/F) for memory
expansion. When expanding the memory,
install the two modules as one set.
OP-9000N-LAN This board enables the SL-9000N to be used in a
LAN network.
2- 2
Description
2.2 OPTION
Source
See
Note 2
See
Note 2
See
Note 2
See
Note 1
See
Note 1
See
Note 1
See
Note 1
and 3
See
Note 1