Texas Instruments BQ25303J User Manual

www.ti.com
User's Guide
BQ25300, BQ25302, BQ25303J Evaluation Module
This user's guide provides detailed testing instructions for the BQ25300, BQ25302, BQ25303J evaluation
module (EVM). Also included are descriptions of the necessary equipment, equipment setup, procedures, the
printed-circuit board layouts, schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM, BMS005, and the term evaluation module are synonymous
with the BQ2530X evaluation module, unless otherwise noted.
1 Introduction.............................................................................................................................................................................2
1.1 EVM Features....................................................................................................................................................................
1.2 I/O Descriptions..................................................................................................................................................................2
2 Test Setup and Results..........................................................................................................................................................
2.1 Equipment..........................................................................................................................................................................
2.2 Equipment Setup................................................................................................................................................................3
2.3 Test Procedure...................................................................................................................................................................
3 PCB Layout Guideline............................................................................................................................................................
4 Board Layout, Schematic, and Bill of
4.1 Board Layout......................................................................................................................................................................7
4.2 Schematic..........................................................................................................................................................................
4.3 Bill of Materials.................................................................................................................................................................10
5 Revision History...................................................................................................................................................................
Figure 2-1. Original Test Setup for BMS005................................................................................................................................
Figure 4-1. Top Overlay...............................................................................................................................................................
Figure 4-2. Top Solder.................................................................................................................................................................
Figure 4-3. Top Layer...................................................................................................................................................................7
Figure 4-4. Bottom Layer.............................................................................................................................................................
Figure 4-5. Bottom Solder............................................................................................................................................................7
Figure 4-6. Bottom Overlay..........................................................................................................................................................7
Figure 4-7. Schematic..................................................................................................................................................................9
Table 1-1. Device Data Sheet......................................................................................................................................................
Table 1-2. EVM I/O Connections.................................................................................................................................................
Table 1-3. EVM Jumper and Shunt
Table 2-1. Precharge Current Measurement...............................................................................................................................
Table 2-2. Fast Charge Current Measurement............................................................................................................................
Table 4-1. BQ2530X Inductor
Table 4-2. BQ25302EVM Bill of
Trademarks
All trademarks are the property of their respective owners.
SLUUC53A - OCTOBER 2020 - REVISED MARCH 2021
Submit Document Feedback
ABSTRACT

Table of Contents

Materials...................................................................................................................7
List of Figures
List of Tables
Installation............................................................................................................................2
Selection.......................................................................................................................................8
Materials..................................................................................................................................10
Copyright © 2021 Texas Instruments Incorporated
BQ25300, BQ25302, BQ25303J Evaluation Module
Table of Contents
2
3
3
4
6
8
12
3
7
7
7
2
2
4
4
1