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User's Guide
TPS272C45 Evaluation Module
The TPS272C45EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS272C45 industrial high side switch. The TPS272C45EVM
contains everything needed to test and assess the TPS272C45 before designing it into part of a greater
application's power system. The evaluation module is designed to either be used as a standalone board with an
attached voltage supply and output load or in conjunction with an underlying Texas Instruments microcontroller
by using the standardized BoosterPack headers. A wide range of application features such as current sensing,
multiplexed current limiting, and transient suppression are enabled and visible through use of this evaluation
module.
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Introduction.............................................................................................................................................................................2
Operation..........................................................................................................................................................4
4 TPS272C45EVM Schematic...................................................................................................................................................
5 Connection Descriptions.......................................................................................................................................................
Configuration.................................................................................................................................................10
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9 Transient Protection.............................................................................................................................................................
10 Bill of Materials...................................................................................................................................................................
History..................................................................................................................................................................15
Figure 6-1. 3D Representation....................................................................................................................................................
Layer...................................................................................................................................................................7
Figure 6-3. Power Layer..............................................................................................................................................................
Figure 6-4. Ground Layer............................................................................................................................................................
Figure 6-5. Bottom Layer.............................................................................................................................................................
Configurations................................................................................................................................................6
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SLVUBV4A - DECEMBER 2020 - REVISED DECEMBER 2021
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ABSTRACT
Table of Contents
List of Figures
Limit.........................................................................................................................................10
List of Tables
Versions.............................................................................................................3
Copyright © 2021 Texas Instruments Incorporated
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