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User's Guide
TPS272C45 Evaluation Module
The TPS272C45EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS272C45 industrial high side switch. The TPS272C45EVM
contains everything needed to test and assess the TPS272C45 before designing it into part of a greater
application's power system. The evaluation module is designed to either be used as a standalone board with an
attached voltage supply and output load or in conjunction with an underlying Texas Instruments microcontroller
by using the standardized BoosterPack headers. A wide range of application features such as current sensing,
multiplexed current limiting, and transient suppression are enabled and visible through use of this evaluation
module.
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Introduction.............................................................................................................................................................................2
2 Compatibility Across Silicon Versions.................................................................................................................................
Operation..........................................................................................................................................................4
4 TPS272C45EVM Schematic...................................................................................................................................................
5 Connection Descriptions.......................................................................................................................................................
6 TPS272C45EVM Assembly Drawings and Layout...............................................................................................................
Configuration.................................................................................................................................................10
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9 Transient Protection.............................................................................................................................................................
10 Bill of Materials...................................................................................................................................................................
History..................................................................................................................................................................15
Figure 4-1. TPS272C45EVM Schematic Drawing.......................................................................................................................
Figure 6-1. 3D Representation....................................................................................................................................................
Layer...................................................................................................................................................................7
Figure 6-3. Power Layer..............................................................................................................................................................
Figure 6-4. Ground Layer............................................................................................................................................................
Figure 6-5. Bottom Layer.............................................................................................................................................................
Table 3-1. Connected BoosterPack Header Pins on TPS272C45EVM.......................................................................................
Table 5-1. Connections and Test Points......................................................................................................................................
Configurations................................................................................................................................................6
Table 10-1. TPS272C45 Bill of Materials...................................................................................................................................
Trademarks
All trademarks are the property of their respective owners.
SLVUBV4A - DECEMBER 2020 - REVISED DECEMBER 2021
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ABSTRACT
Table of Contents
List of Figures
Limit.........................................................................................................................................10
List of Tables
Versions.............................................................................................................3
Copyright © 2021 Texas Instruments Incorporated
Table of Contents
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TPS272C45 Evaluation Module
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Related Manuals for Texas Instruments TPS272C45
Summary of Contents for Texas Instruments TPS272C45
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Page 1: Table Of Contents
TPS272C45 industrial high side switch. The TPS272C45EVM contains everything needed to test and assess the TPS272C45 before designing it into part of a greater application's power system. The evaluation module is designed to either be used as a standalone board with an attached voltage supply and output load or in conjunction with an underlying Texas Instruments microcontroller by using the standardized BoosterPack headers. -
Page 2: Introduction
TPS272C45 industrial high side switch. This evaluation board provides a seamless way to connect a set of power supplies to the inputs of the TPS272C45, connect loads to the output channels, and switch on and off the device using the control pins of the chip itself. An on-board 3.3-V LDO is included on the EVM to simplify controlling signals to the TPS272C45 and easily assert and deassert logic signals by the use of a set of external hardware jumpers. -
Page 3: Compatibility Across Silicon Versions
The A, C and D version of the device includes the ability to power the digital logic of the TPS272C45 from an external Vdd pin. While the Vdd input pin exists on the A version of the TPS272C45 it does not exist in the B versions. -
Page 4: Boosterpack Operation
Additionally the header labeled J18 can be used to configure how the FAULT pin is pulled up. This pin is an open drain output used to report faults on the TPS272C45 such as overcurrent or open load. -
Page 5: Tps272C45Evm Schematic
4.7k 100V 1.00k MMSZ5226B-7-F 100pF ILIM1_CTL_BP 1 ILIM1_CTL_BP 2 3.3V 2N7002Q-7-F 2N7002Q-7-F 961102-6404-AR 961102-6404-AR GND_IC Figure 4-1. TPS272C45EVM Schematic Drawing SLVUBV4A – DECEMBER 2020 – REVISED DECEMBER 2021 TPS272C45 Evaluation Module Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated... -
Page 6: Connection Descriptions
TP11 IC Ground (IC_GND) Table 5-2 shows the relevant configuration jumpers of the TPS272C45EVM as well as the associated values. Please refer to the TPS272C45 data sheet for detailed information on each pin's functionality. Table 5-2. Jumper Configurations Jumper Function/Settings... -
Page 7: Tps272C45Evm Assembly Drawings And Layout
TPS272C45EVM Assembly Drawings and Layout 6 TPS272C45EVM Assembly Drawings and Layout Figure 6-1. 3D Representation Figure 6-2. Top Layer SLVUBV4A – DECEMBER 2020 – REVISED DECEMBER 2021 TPS272C45 Evaluation Module Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated... -
Page 8: Figure 6-3. Power Layer
TPS272C45EVM Assembly Drawings and Layout www.ti.com Figure 6-3. Power Layer Figure 6-4. Ground Layer TPS272C45 Evaluation Module SLVUBV4A – DECEMBER 2020 – REVISED DECEMBER 2021 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated... -
Page 9: Figure 6-5. Bottom Layer
TPS272C45EVM Assembly Drawings and Layout Figure 6-5. Bottom Layer SLVUBV4A – DECEMBER 2020 – REVISED DECEMBER 2021 TPS272C45 Evaluation Module Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated... -
Page 10: Current Limit Configuration
7 Current Limit Configuration The TPS272C45EVM has the ability to configure both the ILIM1 and ILIM2 pins of the TPS272C45 to set a wide range of current limits that are custom tailored to the end design. Additionally the user is able to custom tailor the duration of time taken before the output current shuts off through the resistor connected to the ILIMD pin. -
Page 11: Current Sense
Zener diode. The R15 pin's footprint is populated in a 0805 package to allow for easy soldering and desoldering. SLVUBV4A – DECEMBER 2020 – REVISED DECEMBER 2021 TPS272C45 Evaluation Module Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated... -
Page 12: Transient Protection
Optional external inductive load turn-off diode footprints on D2, D3, D8, and D9 to provide a mechanism to discharge an inductive load if the internal clamp is not adequate (A, B or D versions of TPS272C45) or the clamp does not exist (C version of TPS272C45) •... -
Page 13: Bill Of Materials
Bill of Materials 10 Bill of Materials Table 10-1 lists the TPS272C45 Bill of Materials. Table 10-1. TPS272C45 Bill of Materials Designator Value Description Package Reference Part Number Manufacturer CAP, CERM, 2.2 uF, 50 V, +/- 10%, X7R, AEC-Q200 CGA4J3X7R1H225K1 2.2 uF... - Page 14 Bill of Materials www.ti.com Table 10-1. TPS272C45 Bill of Materials (continued) Designator Value Description Package Reference Part Number Manufacturer 10.0 k RES, 10.0 k, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 ERJ-6ENF1002V Panasonic 4.99 k RES, 4.99 k, 1%, 0.125 W, AEC-Q200 Grade 0, 0805...
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Page 15: Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (December 2020) to Revision A (December 2021) Page • Added support for TPS272C45 version D......................• Updated Figure 4-1 ............................5 •... - Page 16 STANDARD TERMS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein.
- Page 17 www.ti.com Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product.
- Page 18 www.ti.com Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à...
- Page 19 www.ti.com EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices.
- Page 20 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated...
- Page 21 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2021, Texas Instruments Incorporated...
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