Cleaning - Teli LE910C1-NA Design Manual

LE910Cx HW User Guide
Warning: The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature
range. Customer must optimize the reflow profile depending on the
overall system taking into account such factors as thermal mass and
warpage
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature min (Tsmin)
– Temperature max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak temperature (Tp)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down rate
Time 25°C to peak temperature
Table 44: Solder Profile Characteristics
Note: All temperatures refer to the top side of the package,
measured on the package body surface.
Warning: The LE910Cx module withstands one reflow process only.
10.7.2.

Cleaning

In general, cleaning the module mounted on the carrier board is not recommended.
• Residues between the module and the host board cannot be easily removed with
any cleaning method.
1VV0301298 Rev. 33
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max
8 minutes max
Page 99 of 128
Not Subject to NDA
Pb-Free Assembly
2021-06-29