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LE910Cx HW User Guide
Stencil
The layout of the stencil openings can be the same as the recommended footprint (1:1).
The suggested thickness of stencil foil is greater than 120 µm.
PCB Pad Design
The solder pads on the PCB are recommended to be of the Non-Solder Mask Defined
(NSMD) type.
Figure 33: PCB Pad Design
Recommendations for PCB Pad Dimensions (mm)
Figure 34: PCB Pad Dimensions
1VV0301298 Rev. 33
Page 97 of 128
Not Subject to NDA
2021-06-29
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