Telit Wireless Solutions LE910C MPCIE Series Thermal Design Manual
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Telit Wireless Solutions LE910C MPCIE Series Thermal Design Manual

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LE910Cx mPCIe
Thermal Design Guide
1VV0301626 Rev. 2 – 2021-07-09
Telit Technical Documentation

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Summary of Contents for Telit Wireless Solutions LE910C MPCIE Series

  • Page 1 LE910Cx mPCIe Thermal Design Guide 1VV0301626 Rev. 2 – 2021-07-09 Telit Technical Documentation...

  • Page 2: Applicability Table

    LE910Cx mPCIe Thermal Design Guide APPLICABILITY TABLE PRODUCTS LE910C4-NF MPCIE LE910C1-NF MPCIE LE910C1-NA MPCIE LE910C1-NS MPCIE LE910C1-AP MPCIE LE910C4-AP MPCIE LE910C1-EU MPCIE LE910C4-EU MPCIE LE910C1-SA MPCIE LE910C1-ST MPCIE LE910C1-SV MPCIE LE910C1-LA MPCIE LE910C4-LA MPCIE LE910C4-CN MPCIE LE910C1-EUX MPCIE LE910C1-SVX MPCIE LE910C1-SAX MPCIE 1VV0301626 Rev.

  • Page 3: Table Of Contents

    LE910Cx mPCIe Thermal Design Guide CONTENTS APPLICABILITY TABLE CONTENTS INTRODUCTION THERMAL MODEL Temperature Sensor and Hotspot 2.1.1. Temperature Reading and Monitoring Thermal Mitigation Algorithm 2.2.1. How to Change Thermal Mitigation Level Range Thermal Model Temperature Range Current Consumption in Each Mode THERMAL DESIGN Thermal Design Guidelines Thermal Design Solution...
  • Page 4 LE910Cx mPCIe Thermal Design Guide GLOSSARY DOCUMENT HISTORY 1VV0301626 Rev. 2 Page 4 of 26 2021-07-09 Not Subject to NDA...

  • Page 5: Introduction

    LE910Cx mPCIe Thermal Design Guide 1. INTRODUCTION This document provides a thermal model and design guidelines useful for developing a product with the Telit LE910Cx mPCIe. Note: Proper thermal protection design protects against damage to people or component under worst-case conditions. And it reduces the probability of failure and does not adversely affect the use of the module, and greatly extends the operation time with maximum performance.

  • Page 6: Thermal Model

    LE910Cx mPCIe Thermal Design Guide 2. THERMAL MODEL Temperature Sensor and Hotspot LE910Cx mPCIe has two thermistors inside the module. The internal temperature can be monitored by the AT command. Figure 1: LE910Cx mPCIe Temp Sensor & Hotspot As you can see in the figure above, there is a temperature sensor (PA_THERM0) inside the LE910Cx mPCIe.

  • Page 7: Temperature Reading And Monitoring

    LE910Cx mPCIe Thermal Design Guide 2.1.1. Temperature Reading and Monitoring AT#TEMPMON command provides several methods to read the internal temperature as instant reports and to monitor the internal temperature using URC and GPIO. #TEMPMON – Temperature monitor AT#TEMPMON= Set command sets the behavior of the module internal temperature monitor. <mod>...

  • Page 8: Thermal Mitigation Algorithm

    LE910Cx mPCIe Thermal Design Guide #TEMPMON – Temperature monitor Test command reports the supported range of values for parameters <mod>, AT#TEMPMON=? <urcmode>, <action>, and <GPIO> Thresholds levels are defined in #TEMPCFG command. See there for detailed description on thermal mitigation configuration. Last <action>...

  • Page 9: How To Change Thermal Mitigation Level Range

    LE910Cx mPCIe Thermal Design Guide 2.2.1. How to Change Thermal Mitigation Level Range Thermal mitigation level range and action could be modified through AT#TEMPCFG command. #TEMPCFG – Temperature Monitor Configuration AT#TEMPCFG= Set command sets the Temperature zones used in the #TEMPMON command. <etlz_clr>,<etlz>...
  • Page 10 LE910Cx mPCIe Thermal Design Guide Thermal mitigation mechanism works like this: The whole temperature scale is divided into 5 states (zones). Each temperature measured should belong to a particular state called "current state". State is defined by the following fields: "thresholds"...
  • Page 11 LE910Cx mPCIe Thermal Design Guide Here is the graph illustrating the temperatures configuration. State 3 State 1 State 2 State 0 State 4 Thre 0 thr_clr 4 Thre 2 Thre 4 thr_clr 2 thr_clr 0 Thre 1 Thre 3 thr_clr 3 thr_clr 1 Figure 2: Temperatures Configuration When temperature exceeds the "current state"...
  • Page 12 LE910Cx mPCIe Thermal Design Guide etlz_clr – Extreme low zone threshold clear is enforced to have value of '-273'. The Module does not operate at this temperature, but this value is logically set to clearly define the 'thermal state' at temperatures below -40 deg. etuz –...

  • Page 13: Thermal Model

    LE910Cx mPCIe Thermal Design Guide AT#TEMPCFG=-273,-33,3,-35,-28,2,-30,80,0,78,90,3,81,528,3 +CME ERROR: operation not supported Explain: Zone Thr_clr Action Info 'Extreme low zone' -273 3 – emergency call only 'Operate low zone' 2 – TX backoff 'Operate normal zone' 0 – no mitigation 'Operate up zone' 3 - emergency call only 'Extreme up zone' 3 - emergency call only...

  • Page 14: Temperature Range

    LE910Cx mPCIe Thermal Design Guide The two-resistor compact model is calculated according to JEDEC standard. Ɵ is the thermal resistance from junction to the top side: 8 °C/W is the thermal resistance from the top side to the air side: 25 °C/W Ɵ...
  • Page 15 LE910Cx mPCIe Thermal Design Guide * Worst/best case current values depend on the network configuration ** Loop-back mode in call equipment *** 3.3 voltage / room temperature Note: The electrical design for the power supply must ensure a peak current output of at least 2A. 1VV0301626 Rev.

  • Page 16: Thermal Design

    LE910Cx mPCIe Thermal Design Guide 3. THERMAL DESIGN This chapter provides the customer thermal design guide to help their thermal design. Thermal Design Guidelines To enhance heat dissipation: • Ensure that there is sufficient air flow around the LE910Cx mPCIe. (Spread the heat) Balance the heat flow between front and back of the PCB Insulate hot spots on the device skin from hot areas below...

  • Page 17: Thermal Design Solution

    LE910Cx mPCIe Thermal Design Guide Thermal Design Solution There are the LE910Cx mPCIe for the heat dissipation. Figure 4: LE910Cx mPCIe Side View RF and Baseband areas must be heat dissipation. Figure 5: Copper Pad Location on Bottom of LE910Cx mPCIe On the back of the LE910Cx mPCIe there is the large solder resist opening area for the better heat dissipation to heat sinks found on a customer’s application board.
  • Page 18 LE910Cx mPCIe Thermal Design Guide Figure 6: Thermal Solution on Both sides The best method is to connect a heat sink on the top and a TIM on the bottom side. Inevitable environment where the heat sink or TIM cannot be fixed on both sides, it is able to attach a heat sink or TIM only one side, but this is not the best option.
  • Page 19 LE910Cx mPCIe Thermal Design Guide Note: If the above contents are ignored, the network connection might be terminated due to overheating. When the temperature drops, the network connection will be restarted. 1VV0301626 Rev. 2 Page 19 of 26 2021-07-09 Not Subject to NDA...

  • Page 20: Product And Safety Information

    LE910Cx mPCIe Thermal Design Guide 4. PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein.

  • Page 21: Usage And Disclosure Restrictions

    LE910Cx mPCIe Thermal Design Guide computer programs, including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the Third Party software supplier.

  • Page 22: Trademarks

    LE910Cx mPCIe Thermal Design Guide 4.2.4. Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 4.2.5. Third Party Rights The software may include Third Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.

  • Page 23: Safety Recommendations

    LE910Cx mPCIe Thermal Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: •...
  • Page 24 LE910Cx mPCIe Thermal Design Guide 5. GLOSSARY GPIO General Purpose Input Output HSPA High Speed Packet Access Printed Circuit Board Subscriber Identification Module Thermal Interface Material Universal Serial Bus WCDMA Wideband Code Division Multiple Access 1VV0301626 Rev. 2 Page 24 of 26 2021-07-09 Not Subject to NDA...
  • Page 25 LE910Cx mPCIe Thermal Design Guide 6. DOCUMENT HISTORY Revision Date Changes 2021-07-09 Minor changes on the language Minor changes on the layout Legal Notices updated Updated Applicability table 2020-03-19 Updated Applicapability table 2019-09-24 First issue From Mod.0818 rev.4 1VV0301626 Rev. 2 Page 25 of 26 2021-07-09 Not Subject to NDA...

This manual is also suitable for:

Le910c4-nf mpcieLe910c1-nf mpcieLe910c1-na mpcieLe910c1-ns mpcieLe910c1-ap mpcieLe910c4-ap mpcie ... Show all

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