Telit Wireless Solutions LE940B6-NA AUTO Hardware User's Manual
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Telit Wireless Solutions LE940B6-NA AUTO Hardware User's Manual

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LE940B6
Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15

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Summary of Contents for Telit Wireless Solutions LE940B6-NA AUTO

  • Page 1 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15...

  • Page 2: Table 1: Applicability Table

    1VV0301331 Rev. 1.8 - 2017-03-15 This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE940B6-NA AUTO North America regional variant (AT&T and T-Mobile) LE940B6-NV AUTO North America region variant (Verizon, AT&T and T-Mobile) LE940B6-RW AUTO...
  • Page 3 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.
  • Page 4 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 5: Table Of Contents

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Contents Introduction ..................... 12 1.1. Scope ........................ 12 1.2. Audience ......................12 1.3. Contact Information, Support ................12 1.4. Text Conventions ..................... 13 1.5. Related Documents ..................14 1.6. Abbreviations ....................14 1.7.
  • Page 6 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.2. Recommended Operating Conditions ............. 39 4.3. Logic Level Specifications ................. 40 4.3.1. 1.8V Standard GPIOs ................40 4.3.2. 1.8V I2C Pads ..................41 4.3.3. 1.2V EMIC Pads ..................41 4.3.4. 1.8V/2.9V SIM Pads ................42 4.3.5.
  • Page 7 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 7.5. PCB Guidelines in case of FCC certification ............. 65 7.5.1. Transmission line design............... 65 7.5.2. Transmission line measurements ............66 Hardware Interfaces..................69 8.1. USB Port ......................70 8.2. Serial Ports ....................... 71 8.2.1.
  • Page 8 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mounting the Module on your Board ............... 85 10.1. General ......................85 10.2. Finishing & Dimensions ..................85 10.3. Recommended Footprint for the Application ..........86 10.4. Stencil ....................... 87 10.5. PCB Pad Design ....................87 10.6.
  • Page 9 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 List of Tables Table 1: Applicability Table ......................... 2 Table 2: Related Documents ......................14 Table 3: Document Structure ......................15 Table 4: RF Bands per Regional Variant .................... 20 Table 5: RF Bands Characteristics ..................... 21 Table 6: LE940B6 Pin-out ........................
  • Page 10 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Table 40: EMC Recommendations ....................94 Table 41: Tray Packing ........................96 Table 42: Packing Quantities ......................96 Table 43: Document Revision History .................... 102 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 10 of 104...
  • Page 11 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 List of Figures Figure 1: LE940B6 High-level Functionality ..................18 Figure 2: LGA Pads Layout LE940B6 334 Pads Top View ..............38 Figure 3: Power-on Circuit ........................ 44 Figure 4: LE940B6 Initialization and Activation ................45 Figure 5: Power-up Flow Chart ......................

  • Page 12: Introduction

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Introduction 1.1. Scope This document introduces the Telit LE940B6 module and presents possible and recommended hardware solutions for developing a product based on the LE940B6 module. All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table.

  • Page 13: Text Conventions

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

  • Page 14: Related Documents

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 1.5. Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE940B6 AT Command Reference Guide 80514ST10767A Ref 2: LE940B6 SW User Guide 1VV0301296 Ref 3: Telit EVK2 User Guide 1vv0300704 Ref 4: SIM Integration Design Guide 80000NT10001A...

  • Page 15: Document Organization

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Term Definition RGMII Reduced Gigabit media-independent interface Subscriber identity module System-on-Chip SmartMX Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system Universal serial bus Wireless Coexistence Interface WCDMA Wideband code division multiple access 1.7.
  • Page 16 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Chapter# Chapter Title Description Antenna(s) Describes the antenna connections and related aspects of board layout design, which are most critical for the overall product design Hardware Interfaces Specifies the peripheral and audio interfaces Miscellaneous Functions Mounting the Module on your Board...

  • Page 17: General Product Description

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 General Product Description 2.1. Overview LE940B6 is Telit’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies: • 4G cellular for voice and data communication •...

  • Page 18: General Functionality And Main Features

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.3. General Functionality and Main Features The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below: •...

  • Page 19: Environmental Requirements

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.4. Environmental Requirements 2.4.1. Temperature Range Operating -20 ~ +55°C. temperature range This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range.

  • Page 20: Operating Frequency Bands

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.5. Operating Frequency Bands The operating frequencies in WCDMA and LTE modes conform to the 3GPP specifications. 2.5.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation.

  • Page 21: Reference Table Of Rf Bands Characteristics

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.5.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710.2 ~ 1784.8...
  • Page 22 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset TDSCDMA 1900 – 1880 ~ 1920 1880 ~ 1920 Tx: 9400 ~ 9600 0 MHz Rx: 9400 ~ 9600 LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599...
  • Page 23 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149 45 MHz Rx: 6000 ~ 6149 LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449...

  • Page 24: Sensitivity

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.6. Sensitivity LE940B6 maximum sensitivity levels are as follows (exact performance figures will be specified at a later stage): • < 3GPP @ 2G • < 3GPP @ 3G • < 3GPP @ 4G FDD (BW=5 MHz) •...

  • Page 25: Le940B6 Mechanical Specifications

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 2.7. LE940B6 Mechanical Specifications 2.7.1. Dimensions The LE940B6 module’s overall dimensions are: • Length: 40 mm, +/- 0.20 mm tolerance • Width: 40 mm, +/- 0.20 mm tolerance • Thickness: 3.0 mm, +/- 0.15 mm tolerance (with label) 2.7.2.

  • Page 26: Le940B6 Module Connections

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 LE940B6 Module Connections 3.1. Pin-out Table 6: LE940B6 Pin-out Signal Function Type COMMENT USB HS 2.0 Communication Port Power sense for the internal USB USB_VBUS transceiver USB_D+ I/O USB differential Data (+) USB_D- I/O USB differential Data (-) Asynchronous UART...
  • Page 27 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 JTAG_TCK JTAG_TCK 1.8V JTAG_TRST_N JTAG_TRST* 1.8V JTAG_TDO JTAG_TDO 1.8V JTAG_TMS JTAG_TMS 1.8V JTAG_TRIGIN JTAG_TRIGIN 1.8V JTAG - MiPi 34 Interface JTAG_PTI_CLK MiPi Clock 1.8V JTAG_PTI_DATA0 I/O MiPi Data 0 1.8V JTAG_PTI_DATA1 I/O MiPi Data 1 1.8V JTAG_PTI_DATA2 I/O MiPi Data 2 1.8V...
  • Page 28 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 SPI_CS SPI Chip select output 1.8V SPI_CLK SPI Clock output 1.8V I2C Interface I2C_SCL I/O I2C Clock 1.8V I2C_SDA I/O I2C Data 1.8V Digital I/O GPIO_01 I/O GPIO_01 1.8V GPIO_02 I/O GPIO_02 1.8V GPIO_03 I/O GPIO_03...
  • Page 29 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 RGMII Receive Data Available/Error MAC_RXDV_ER 2.5/3.3V or RMII Receive Error ETH_INT_N Ethernet PHY Interrupt 2.5/3.3V ETH_RST_N Ethernet PHY Reset Output 2.5/3.3V RF Section ANT_1 I/O Primary Antenna 1 ANT_DIV_1 Diversity Antenna 1 ANT_GPS GPS Antenna Miscellaneous Functions...
  • Page 30 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
  • Page 31 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Ground Ground Ground Ground AP11 Ground Ground AP13 Ground Ground AP15 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AR10 Ground Ground AR12 Ground Ground AR14 Ground Ground AR16 Ground Ground Ground...
  • Page 32 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground AV10 Ground Ground AV12...
  • Page 33 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 D101 Ground Ground U101 Ground Ground W101 Ground Ground Y101 Ground Ground AR101 GND Ground Ground AT101 GND Ground Ground AV101 GND Ground Ground ZZ102 Ground Ground B102 Ground Ground D102 Ground Ground U102...
  • Page 34 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved AH17 Reserved Reserved Reserved Reserved AF17 Reserved Reserved AB17 Reserved Reserved Reserved Reserved AD17 Reserved Reserved Reserved Reserved...
  • Page 35 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved AL20 Reserved Reserved AN20 Reserved Reserved Reserved Reserved...

  • Page 36: Le940B6 Signals That Must Be Connected

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 3.2. LE940B6 Signals That Must Be Connected Table 7 lists the LE940B6 signals that must be connected even if not used by the end application: Table 7: Mandatory Signals Signal Notes AP17, AP19, AR18, AR20, AS17, AS19, AT18, VBATT &...
  • Page 37 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 If not used, connect to a test USB_SS_TX_M point or a USB connector AH19 If not used, connect to a test C103/TXD point AF19 If not used, connect to a test C104/RXD point AA18...

  • Page 38: Lga Pads Layout

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 3.3. LGA Pads Layout Figure 2: LGA Pads Layout LE940B6 334 Pads Top View GPIO_2 GPIO_2 ANT_GP ON_OFF ANT_1 MIC1_M JTAG_R JTAG_T JTAG_T RST_N JTAG_R MIC1_M JTAG_T JTAG_T JTAG_T STAT_L ESOUT_ RIGIN JTAG_P JTAG_P...

  • Page 39: Electrical Specifications

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Electrical Specifications 4.1. Absolute Maximum Ratings – Not Operational Caution: A deviation from the value ranges listed below may harm the LE940B6 module. Table 8: Absolute Maximum Ratings – Not Operational Symbol Parameter Unit...

  • Page 40: Logic Level Specifications

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3. Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE940B6 are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE940B6 interface circuits.

  • Page 41: 1.8V I2C Pads

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.2. 1.8V I2C Pads Table 12: Operating Range – 1.8V I2C Pads Parameter Input high level 1.26V 2.3V Input low level -0.3V 0.54V Output high level Output low level 0.36V 4.3.3. 1.2V EMIC Pads Table 13: Operating Range –...

  • Page 42: 1.8V/2.9V Sim Pads

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.4. 1.8V/2.9V SIM Pads Table 14: Operating Range – 1.8V SIM Pads Parameter Input high level 1.26V 2.1V Input low level -0.3V 0.36V Output high level 1.26V 2.1V Output low level -0.3V 0.36V Table 15: Operating Range –...

  • Page 43: 2.5V/3.3V Emac Interface For Rmii And Rgmii

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 4.3.6. 2.5V/3.3V EMAC Interface for RMII and RGMII Table 17: Absolute Maximum Ratings – 3.3V EMAC Interface Parameter Input level on 3.3V EMAC when on -0.3V 3.6V Table 18: Operating Range – 2.5V EMAC Interface Parameter Input high level 1.7V...

  • Page 44: Hardware Commands

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Hardware Commands 5.1. Turning on the LE940B6 Module To turn on the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 80 - 120 milliseconds and then released. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output.

  • Page 45: Figure 4: Le940B6 Initialization And Activation

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 4: LE940B6 Initialization and Activation NOTE: To check whether the LE940B6 has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands.

  • Page 46: Figure 5: Power-Up Flow Chart

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 5 shows a flow chart for the proper power-up procedure: Figure 5: Power-up Flow Chart Modem ON Procedure START VBATT > 3.4V ? VAUX/PWRMON = ON? ON_OFF_N = LOW Go to 80 ms <...

  • Page 47: Figure 6: At Command Managing Flow Chart

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 6 shows a flow chart illustrating the AT commands managing procedure. Figure 6: AT Command Managing Flow Chart Start AT CMD START Delay 300 ms Enter AT <CR> Go to AT Answer in HW SHUTDOWN 1 sec ?

  • Page 48: Turning Off The Le940B6 Module

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3. Turning off the LE940B6 Module Turning off the device can be done in four different ways: • Shutdown by software command using AT#SHDN command • Hardware shutdown using ON_OFF_N pad •...

  • Page 49: Figure 7: Shutdown By Software Command

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 7: Shutdown by Software Command VBATT AT#SHDN VAUX/PWRMON Monitoring Status Variable Above 6 sec Internal State Activation State Finalization State OFF State NOTE: To check whether the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, the device has powered off.

  • Page 50: Hardware Shutdown

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.2. Hardware Shutdown To turn off the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 1150 - 1250 milliseconds and then released. Use the same circuitry and timing for power-on. When the ON_OFF_N is asserted low for a period in the range 1150 - 1250 milliseconds and then released, LE940B6 goes into the Finalization state and in the end shuts down VAUX/PWRMON.

  • Page 51: Unconditional Hardware Reset (Reset_N)

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.3. Unconditional Hardware Reset (RESET_N) To unconditionally restart the LE940B6 module, the RESET_N pad must be tied low in the range 1300 - 1800 milliseconds and then released. Figure 9 shows a simple circuit for this action. Figure 9: Circuit for Unconditional Hardware Reset RESET_N 1300ms <...

  • Page 52: Unconditional Hardware Shutdown

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE940B6 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. Figure 10 shows a simple circuit for applying an unconditional shutdown. Figure 10: Circuit for Unconditional Hardware Shutdown SHDN_N At least 200ms...

  • Page 53: Figure 11: Turn Off Procedure

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 11 shows a flow chart of the proper turn off procedure. Figure 11: Turn Off Procedure Modem OFF Procedure START VAUX/PWRMON = ON? SW SHUTDOWN HW SHUTDOWN OFF Mode ON_OFF_N = LOW AT#SHDN Delay = 200 ms ON_OFF_N = HIGH...

  • Page 54: Power Supply

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design.
  • Page 55 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Average (Typ.) Mode Description 3.8 mA Paging cycle #128 frames (1.28 sec DRx cycle) 3.2 mA Paging cycle #256 frames (2.56 sec DRx cycle) Operative Mode (LTE) 300 mA LTE data call (Non-CA BW 5 MHz, RB=1) 500 mA LTE data call (CA BW 20 + 20MHz, Full RB, B4+B4 Intra LTE (0dBm)
  • Page 56 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mode Average (Typ.) Mode Description GSM 1800/1900 300 mA GPRS 4 Tx + 1 Rx GSM 850/900 PL5 750 mA GPRS Sending Data mode (CS-4) DCS 1800/1900 PL0 550 mA EGPRS 4 Tx + 1 Rx GSM 850/900 PL8 550 mA GPRS Sending Data mode (MCS-5)

  • Page 57: General Design Rules

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: • Electrical design • Thermal design • PCB layout 6.2.1. Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained.

  • Page 58: + 12V Input Source Power Supply - Design Guidelines

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 12: Example of Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used.

  • Page 59: Figure 13: Example Of Switching Regulator With 12V Input - Part 1

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 Figure 14: Example of Switching Regulator with 12V Input – Part 2 Reproduction forbidden without written authorization by Telit Communications S.p.A.

  • Page 60: Battery Source Power Supply - Design Guidelines

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2.1.3. Battery Source Power Supply – Design Guidelines • The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE940B6 module.

  • Page 61: Thermal Design Guidelines

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 6.2.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications: • Average current consumption during LTE 2xCA DL Max throughput @PWR level max in LE940B6: 1250 mA NOTE: The average consumption during transmission depends on the power level at which the device is...
  • Page 62 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 • The PCB traces to LE940B6 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons.

  • Page 63: Antenna(S)

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design.

  • Page 64: Table 23: Antenna Line On Pcb Requirements

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 • If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model.

  • Page 65: Gsm/Wcdma/Td-Scdma/Lte Antenna - Installation Guidelines

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines • Install the antenna in a location with access to the network radio signal. • The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

  • Page 66: Transmission Line Measurements

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω...
  • Page 67 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 67 of 104...
  • Page 68 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Insertion Loss of G-CPW line plus SMA connector is shown below: Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 68 of 104...

  • Page 69: Hardware Interfaces

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Hardware Interfaces Table 24 summarizes all the hardware interfaces of the LE940B6 module. Table 24: LE940B6 Hardware Interfaces LE940B6 (XMM7272 CAT6) Ethernet RMII/RGMII USB2.0 Master only, up to 26 MHz (104 MHz @ Kernel CLK/4) For sensors, audio control UART x1 UART for AT (up to 4.8 Mbps)

  • Page 70: Usb Port

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.1. USB Port The LE940B6 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update.

  • Page 71: Serial Ports

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update.

  • Page 72: Modem Serial Port 1

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.1. Modem Serial Port 1 Serial Port 1 is a +1.8V UART, having all the 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 26 lists the signals of LE940B6 Serial Port 1. Table 26: Modem Serial Port 1 Signals RS232 Pin # Signal...

  • Page 73: Modem Serial Port 2

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.2. Modem Serial Port 2 On the LE940B6, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. Table 27 lists the signals of the LE940B6 Serial Port 2. Table 27: Modem Serial Port 2 Signals Signal Function...

  • Page 74: Rs232 Level Translation

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.2.4. RS232 Level Translation To interface the LE940B6 with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: •...

  • Page 75: Figure 16: Rs232 Level Adaption Circuitry Example

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 As an example of RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (Example on 4 signals only).

  • Page 76: Peripheral Ports

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.3. Peripheral Ports In addition to the LE940B6 serial ports, the LE940B6 supports the following peripheral ports: • SPI – Serial Peripheral Interface • I2C - Inter-integrated circuit • Ethernet – Ethernet PHY Interface 8.3.1.

  • Page 77: I2C - Inter-Integrated Circuit

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.3.2. I2C - Inter-integrated Circuit The LE940B6 I2C is an alternate function of GPIO 1-15 pins. Available only from Modem side as SW emulation of I2C on GPIO lines. Any GPIO can be configured as SCL or SDA. LE940B6 supports I2C Master Mode only.

  • Page 78: Audio Interface

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Signal Function Type COMMENT AL16 MAC_RXD[0] RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] RGMII RXD[2] 2.5/3.3V AE16 MAC_RXD[3] RGMII RXD[3] 2.5/3.3V AC16 MAC_RX_CLK RGMII Receive Clock 2.5/3.3V MAC_RXDV_ER RGMII Receive Data Available/Error...

  • Page 79: Digital Audio

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 8.5.2. Digital Audio The LE940B6 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 32: Digital Audio Interface (DVI) Signals Signal Function Type...

  • Page 80: Using A Gpio Pad As Input

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Signal Function Type Drive Strength GPIO_07 Configurable GPIO CMOS 1.8V 3 mA GPIO_08 Configurable GPIO CMOS 1.8V 3 mA GPIO_09 Configurable GPIO CMOS 1.8V 3 mA GPIO_10 Configurable GPIO CMOS 1.8V 3 mA GPIO_11 Configurable GPIO...

  • Page 81: Figure 19: Gpio Output Pad Equivalent Circuit

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Figure 19: GPIO Output Pad Equivalent Circuit Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 81 of 104...

  • Page 82: Miscellaneous Functions

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Miscellaneous Functions 9.1. Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE940B6 module, the STAT_LED usually needs an external transistor to drive an external LED.

  • Page 83: Rtc - Real Time Clock

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 9.2. RTC – Real Time Clock The VRTC pin is used to power the RTC only when the main battery voltage level is too low or missing. 9.3. VAUX Power Output A regulated power supply output is provided to supply small devices from the module.

  • Page 84: Using The Temperature Monitor Function

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 9.5. Using the Temperature Monitor Function The Temperature Monitor supports temperature monitoring by giving periodic temperature indications, to execute some function at extreme state. If properly set (see the #TEMPMON command in the Ref 1: LE940B6 AT Command Reference Guide), it raises a GPIO to High Logic level when the maximum temperature is reached.

  • Page 85: Mounting The Module On Your Board

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Mounting the Module on your Board 10.1. General The LE940B6 module is designed to be compliant with a standard lead-free soldering process as defined in JESD22b102d, table 3b. The number of reflows must not exceed two. This limits Tmax to 245 °C.

  • Page 86: Recommended Footprint For The Application

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.3. Recommended Footprint for the Application Figure 22 shows the top view of the module, which has 334 pads (dimensions are in mm). To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module.

  • Page 87: Stencil

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. 10.5. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type.

  • Page 88: Recommendations For Pcb Pad Dimensions (Mm)

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 10.6. Recommendations for PCB Pad Dimensions (mm) Figure 24: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see Figure 25).

  • Page 89: Solder Paste

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. 10.7.

  • Page 90: Table 38: Solder Profile Characteristics

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Table 38: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (T to T 3°C/second max Preheat – Temperature min (Tsmin) 150°C – Temperature max (Tsmax) 200°C – Time (min to max) (ts) 60-180 seconds Tsmax to TL –...

  • Page 91: Application Guide

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Application Guide 11.1. Debug of the LE940B6 Module in Production To test and debug the mounting of the LE940B6 module, we strongly recommend to add several test pads on the application board design for the following purposes: •...

  • Page 92: Bypass Capacitor On Power Supplies

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.2. Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction.

  • Page 93: Sim Interface

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.3. SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE940B6 supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 27 illustrates in particular how to design the application side, and what values the components should have.

  • Page 94: Emc Recommendations

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.4. EMC Recommendations All LE940B6 signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 40 lists the characteristics. Table 40: EMC Recommendations Signal Function Contact...

  • Page 95: Antenna Detection

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 11.6. Antenna Detection The LE940B6 module provides an antenna detection application. Many automotive applications require to detect if the antenna is shorted to ground or the battery of the vehicle for fault tracing. Basically, antenna detection is performed by means of its DC characteristics, splitting the DC and RF paths.

  • Page 96: Packing System

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Packing System The LE940B6 module is packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required.

  • Page 97: Figure 28: Tray Packing

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Each tray contains 24 modules as shown in Figure 28. Figure 28: Tray Packing Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 97 of 104...

  • Page 98: Tray Drawing

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 12.1. Tray Drawing The Telit LE940B6 is packaged on trays. Each tray contains 21 pieces with the following dimensions: Figure 29: Tray Drawing Warning: These trays can withstand a maximum temperature of 125°C 12.2.

  • Page 99: Conformity Assessment Issues

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Conformity Assessment Issues 13.1. FCC/IC Regulatory Notices Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • Page 100 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

  • Page 101: Safety Recommendations

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: •...

  • Page 102: Document History

    LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Document History Table 43: Document Revision History Revision Date Changes Rev. 1.8 2017-03-10 Sec. 5.1: Added Note Sec. 5.3: Added Note Sec. 6.1: Updated table 21 LE940B6 Current Consumption Sec. 7.5: Added new sub chapter Sec.
  • Page 103 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Revision Date Changes v. 1.6 2016-11-15 Official Release Sec. 2.7: Updated the Mechanical Specifications Sec. 3.1: Added VPP pin for eFuse Sections 3.1, 3.3, 4.3.6, 8: SD / MMC interfaces were deleted - they are not supported by the chipset vendor.
  • Page 104 LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Revision Date Changes Rev. 1.5 2016-09-20 (Interim version) Page 2, Table 1: Updated the Applicability table Sec. 2: Updated the General Product Description Sec. 2.5.1, 2.5.2: Updated the RF bands tables Sec.

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