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02-2. Precautions for printed circuit design
1) Circuit design
(1)To obtain a good front fillet and back fillet, please review the foot pattern
dimensions recommended in the specifications or catalog for terminal foot pattern
design.
(2)Do not provide through holes on the extension of the
foot pattern. During reflow, the printed solder will be
absorbed by the through hole section, and this will
cause poor solder at the terminal section.
(3)Please control the insulation coating thickness
(resist thickness) on the pattern surface.
The coating thickness can ordinarily be controlled
to the µm level.
If the thickness is too great, it will press up on the
connector bottom, and will cause terminal poor
solder.
(4)Be sure to consult with us beforehand if you want to
perform through hole wiring on the bottom side of
the connector. Basically, you should avoid through
holes on the connector bottom side. They will cause
terminal poor solder.
(5)When mounting to an FPC board, we recommend using the type with a boss.
This makes it possible to limit connector movement during the reflow process,
and reduce soldering trouble.
Panasonic Corporation
industrial.panasonic.com/ac/e/
Operation manual for Narrow-pitch connectors P5KF
©
- 6 -
Panasonic Corporation 2017
Foot
pattern
Resist
Board
ACCTF1E-4 201704
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