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03-3. Precautions for reflow soldering
(1) Check the actual temperature profile at the connector mounting position and
check that it matches the recommended temperature profile.
Temperature
When the resin part of the connector is melted or deformed during reflow
(2)
soldering, check whether or not the heating temperature is excessive, or there is
an electronic component with a large heat capacity near the connector-mounting
position.
(3) If the soldering is defective, carry out the following check.
If solder reaches the contact section or its periphery, it is possible that the amount
of solder applied was excessive, or that wicking has occurred. In this case, check
the amount of solder applied and the temperature at the connector-mounting
position.
Special care is required with an N2 reflow oven.
(4) Larger front fillets can be achieved by extending the screen opening outward and
shifting the solder application position outward.
(5) Take the following precautions to minimize temperature variations among
connector terminals during reflow soldering onto flexible PC boards.
- If the base on which a flexible PC board is mounted is made of metal (e.g.
aluminum), ensure that the flexible PC board and the base are kept in close
contact.
- If a metal support plate is used, ensure closer contact between the base and the
plate (e.g. double-sided adhesive tape).
Panasonic Corporation
industrial.panasonic.com/ac/e/
Operation manual for Narrow-pitch connectors P5KF
Time
©
- 14 -
Panasonic Corporation 2017
ACCTF1E-4 201704
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