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If the Vacuum Pick adjustment is incorrect (the vacuum cup not resting
on the component body correctly), refer to the "Vacuum Pick
Adjustment" portion of this manual.
6. The installed tip, when used to remove . . .
a) PQFP components - should make contact
with all the leads/solder joints
simultaneously. After 1-5 seconds, all the
leads should have reflowed.
Activate and hold the Vacuum Switch to
apply vacuum. If any adhesive is located
beneath the component, gently slide the
component to break adhesive loose.
NOTE - Total time for the operation from
tip placement to component lifting should
take no longer than 6-8 seconds. If
complete solder melt has not been
achieved, remove the tool and allow the
board and component to cool before a
second attempt.
b) BGA components - should make contact
with the package. Dwell times may be
longer than one minute & will vary
depending on your particular component
and PCB.
After reflow of all connections, activate
and hold the Vacuum Switch to apply
vacuum.
7. Lift the handpiece straight up with the vacuum still running. Release the
Vacuum Switch to deposit the component on an insulated surface.
8. Clean the tip; re-tin if using a PQFP Removal Tip (BGA Removal Tips
are not tinnable). Return the handpiece to its Tip & Tool Stand.
You may wish to alter your procedure for best results in your application.
Use the SX-70 Sodr-X-Tractor handpiece to remove the old solder from the PCB
and to prepare the lands for installation of a new part. Refer to one of the SX-70
Sodr-X-Tractor manuals for suggested solder removal techniques.
NOTE
19
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