Pace DUAL THERMOPIK DTP-80 Operation & Maintenance Manual page 15

TIP PREPARATION
DTP-80 tips must be kept free of oxidation to ensure that maximum heat transfer
will take place at all times.
BGA Removal Tips - are not tinnable; use the tip cleaning tools (provided with the
optional Tip Maintenance Station P/N 6993-0138) to remove all traces of oxidation
from the heated tip.
PQFP Removal Tips - must be kept properly cleaned and tinned. Carefully inspect
for any oxidation buildup. Use the tip cleaning tools (provided with the optional Tip
Maintenance Station P/N 6993-0138) to remove all traces of oxidation and solder
from the heated tip. If oxidation is present, clean the tip until no oxidation spots
remain. Immediately tin the tip surfaces and keep them tinned at all times.
Prepare the installed tip using the following procedure:
1. Clean all bottom edges of the installed tip using a PACE fiber cleaning
tool.
2. Shock the bottom edges of the installed tip using a PACE sponge tool or
sponge.
3. When using a PQFP Removal Tip, apply
a continuous bead of solder along the
bottom edges of the installed tip.
The molten solder of a properly tinned PQFP Removal Tip is the medium
through which an efficient heat transfer takes place making simultaneous
reflow of all solder joints and component removal possible.
NOTE
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