Pace DUAL THERMOPIK DTP-80 Operation & Maintenance Manual page 17

4. In order to maximize heat transfer from the handpiece tip to PQFP
component lead/land connections, PACE recommends adding
bridgefill ..............
solder wrap ..........
flux ......................
to maximize heat transfer across all connections.
When removing BGA components, the use of flux is an option which can
be used to enhance heat transfer.
or
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