Periodic Inspection - Toshiba TOSDIC-CIE DS Operation Manual

Dpcs emulator hardware (i/o system component)
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4. Maintenance and inspection

Periodic inspection

Periodic inspection
Check the following items regularly (about once in every 6 months).
(1) Clean the modules.
Remove the modules from the basic base unit and remove dust by blowing air.
After cleaning, install the modules to the original positions.
(2) Check the mounting state of the basic base unit.
Check the mounting state of the basic base unit. Check for looseness or backlash.
If looseness exists, tighten the mounting screws.
(3) Check the cables.
Check for damage of the cables (serial bus cable and I/O cable). Replace damaged
cables if any. Also, check for looseness of connectors. If looseness exists, tighten the
mounting screws.
(4) Check the screws for power supply input/output terminals.
Check for looseness. If looseness exists, tighten them.
(5) Check the installation environment.
Check that the installation environment such as temperature, humidity, vibration, and
dust is appropriate.
(6) Check the installation state.
Check the installation state such as looseness of installation part screws.
(7) Check redundancy.
The communication module SBIF1C can be made redundant. However, depending on
the failure mode, failure diagnosis may fail even in the failure diagnosis part and
redundancy changeover may not be executed. A power on/off test and redundancy
changeover test are recommended upon periodic repair.
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