Toshiba TOSDIC-CIE DS Operation Manual
Toshiba TOSDIC-CIE DS Operation Manual

Toshiba TOSDIC-CIE DS Operation Manual

Dpcs emulator hardware (i/o system component)
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DPCS emulator
hardware operation manual
(I/O system component)
6F8C1332

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Summary of Contents for Toshiba TOSDIC-CIE DS

  • Page 1 DPCS emulator hardware operation manual (I/O system component) 6F8C1332...
  • Page 2 Do not copy or transcribe this manual in part or entirety without written permission from Toshiba. The manual is subject to change without notice. Although we tried hard to make this manual error free, if you find any errors or unclear passages,...
  • Page 3: Safety Precautions

    Safety Precautions Safety Precautions The instruction manual and the labels affixed to the products or equipment give important information for using products safely. It helps prevent damage to properties and hazard to people who use them or work with them. Make yourself familiar with the signal words and signs in this page, then read the safety precautions that follow and always follow the instructions to avoid hazards.
  • Page 4 Safety Precautions 1. Safety precautions on installation DANGER Always ground the device. • Otherwise, an electric shock or fire may occur. Mandatory action Caution Avoid installation or storage in the following environment. • Place with dust • Place with corrosive gases (SO S) or flammable gases •...
  • Page 5 Safety Precautions 2. Safety precautions on maintenance and inspection DANGER When inserting or removing the module or when connecting the equipment, turn off the power. Otherwise, an electric shock accident or failure of the device may Mandatory action occur. When inserting or removing the module after wiring, make sure that the external power supply is turned off.
  • Page 6 When the ambient temperature or internal temperature of the device with the module increases abnormally high or when failure occurs in the device, stop using the device and turn off the power, and contact the nearest Toshiba Mandatory action service station.
  • Page 7 Safety Precautions Caution Do not touch the parts, terminals, connectors, and solder surfaces in the module. Electrostatic breakdown of ICs and LSIs may occur, causing failure. Prohibition An injury may occur due to the end of the lead wire of the parts. Do not disassemble or modify the device or module.
  • Page 8 Toshiba is not liable for any incidental damage from use or non use of this product (loss of business profit, discontinuation of business, change or loss of the memorized content and so on).
  • Page 9: Introduction

    Introduction Introduction The next generation Toshiba Integrated Control System TOSDIC-CIE DS is an integrated production system that combines the de-facto standard and Toshiba's original control technology. In addition to Toshiba's advanced control technology and computer technology, a standard multi-vendor network and easy-to-use integrated engineering tools are adopted to achieve a highly reliable system in an open environment.
  • Page 10 Introduction Work station Personal computer Information system Ethernet OIS-DS SVR-DS engineering tool OIS-DS OIS-DS Ethernet Control LAN PCS-DS engineering tool PCS-DS DPCS emulator Parallel PI/O Intelligent PI/O Example of CIEMAC-DS system configuration ■ Structure of this manual This manual consists of the following. Chapter 1 System configuration Chapter 1 describes the positioning of the I/O system components in the DPCS emulator...
  • Page 11 Introduction ■ Target readers of this manual This manual is intended for new users of the CIEMAC-DS system. Some knowledge on computer operation is required to understand this manual, but the reader is not required to be a computer expert. ■...
  • Page 12 Introduction ■ Notational convention Besides the safety precautions, the following symbols describe cautions on use. INSTRUCTION: Describes what to implement for correct use of the product. Indicates reference information to help the reader to understand the main text. REFERENCE: REFERENCE Indicates documents to refer to for deeper understanding of the main text.
  • Page 13 Introduction...
  • Page 14: Table Of Contents

    Contents Contents Safety Precautions ·························································································· i Introduction····································································································vii Chapter 1 System configuration ······························································· 1 I/O system configuration ··································································································· 2 Chapter 2 System component ································································ 5 General specification ········································································································ 6 Base unit ··························································································································· 6 Base card ························································································································· 8 Module specifications and outer shape············································································ 17 Cable specifications and outer shape ··············································································...
  • Page 15 Contents Chapter 4 Maintenance and inspection ·················································· 49 Periodic inspection ······································································································· 50 Periodic inspection ····································································································· 50 Aging part ··················································································································· 51 Appendix 1 Specification ······································································ 53 xiii...
  • Page 16 Contents...
  • Page 17: System Configuration

    1. System configuration Chapter System configuration I/O system configuration ··············································· 2...
  • Page 18: I/O System Configuration

    1. System configuration I/O system configuration The I/O system is connected to the main control system via the serial bus as shown in Fig. 1.1. The I/O system consists of the I/O base unit, I/O base card, and I/O module, and is connected to the terminal block unit of the existing DPCS, as shown in Fig.
  • Page 19 1. System configuration The I/O system consists of the I/O base unit UIOU12, I/O module, and base cards UIOU5n and 6n. These components are directly connected to the terminal block unit of the existing DPCS via the dedicated cables. The DPCS system can be migrated to the DS system smoothly without rewiring the external input-output lines.
  • Page 20 1. System configuration...
  • Page 21: System Component

    2. System component Chapter System component General specification ··················································· 6 Base unit ······································································· 6 Base card ······································································ 8 Module specifications and outer shape ····················· 17 Cable specifications and outer shape ······················· 36...
  • Page 22: General Specification

    2. System component General specification Table 2.1 General specification Item Specification Power supply Rated voltage and 24VDC frequency 24VDC ± 10% Allowable voltage and frequency 0 to 55 ° C Environment Operating temperature -25 to 70 ° C Storage temperature Humidity 5 to 95%RH (no condensation) Vibration (no current)
  • Page 23 2. System component Fig. 2.1 Base unit external view スロット No. Slot No. 10   9   8   7   6   5   4   3   2   1 UIOU54~59, UIOU60 Fig. 2.2 Base card installation diagram...
  • Page 24: Base Card

    2. System component Base card Table 2.3 UIOU51 specification Item Specification Model name UIOU51 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VPCX2/VPCPX2B power supply (24V system power supply) Applicable module None Number of modules connected...
  • Page 25 2. System component Table 2.4 UIOU52 specification Item Specification Model name UIOU52 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VPCPX2B Applicable module SBIF1C Number of modules mounted 2 units (redundant) Mounting slot UIOU12 (Fixed at Slot 9) (1-slot width)
  • Page 26 2. System component Item Specification Model name UIOU54 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VPINX11, VPINX12 Applicable module SPI01 Number of modules mounted 2 units Mounting slot UIOU12 Slots 1 to 8 (1-slot width)
  • Page 27 2. System component Table 2.6 UIOU55 specification Item Specification Model name UIOU55 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VDINX1, VDOPX1 Applicable module SDI01 or SDO01 module Number of modules mounted 1 unit Mounting slot...
  • Page 28 2. System component Table 2.7 UIOU56 specification Item Specification Model name UIOU56 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VDIOX1 Applicable module SDI01,SDO01 Number of modules mounted One each of SDI01 and SDO01 module Mounting slot UIOU12 (Slots 1 to 8) (1-slot width)
  • Page 29 2. System component Table 2.8 UIOU57 specification Item Specification Model name UIOU57 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VAIMX1, VAOPX1, VAMPX12 Applicable module SAI012, SAO012, STC012 Number of modules mounted 2 units of the same module (1 unit for SAO01)
  • Page 30 2. System component Table 2.9 UIOU58 specification Item Specification Model name UIOU58 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VAMPX11 Applicable module SAI022 Number of modules mounted 4 units Mounting slot UIOU12 (Slots 1 to 8) (2-slot width)
  • Page 31 2. System component Table 2.10 UIOU59 specification Item Specification Model name UIOU59 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card VRTDX1 Applicable module SRT012 module Number of modules mounted 2 units Mounting slot...
  • Page 32 2. System component Table 2.11 UIOU60 specification Item Specification Model name UIOU60 Fixed with M3 × 6 screws at 3 locations and with M3 × 8 screws at Mounting type 2 locations DPCS target card (Depending on the vacant slot) Applicable module None (I/O module cannot be installed) Number of modules connected...
  • Page 33: Module Specifications And Outer Shape

    2. System component Module specifications and outer shape Table 2.12 SBIF1C specification Item Specification Model name SBIF1C Applicable base card UIOU52 Redundancy Available (2 units can be installed in the communication base unit UIOU52) Serial bus specifications According to Appendix Table 1.1 Serial bus specifications I/O bus specification According to Appendix Table 1.2 I/O bus specification Current consumption...
  • Page 34 2. System component Table 2.13 SAI012 specification Item Specification Model name SAI012 Number of input points 8 points Input insulation unit 8-point common insulation (input (-) side common) Bipolar: ± 10mV, ± 20mV, ± 50mV, ± 100mV, ± 1V, ± 5V (all DC) Input signal level Unipolar: 1-5VDC Each point can be set independently.
  • Page 35 2. System component Signal V/F converter State insulating circuit circuit display/switch analog multi- plexer Internal CPU circuit circuit Internal power supply Insulation Constant voltage RS-485 RS-485 DC/DC transceiver transceiver power circuit converter Bus A Bus B Module connector System power supply Redundancy I/O bus (DC24V) Fig.
  • Page 36 2. System component Table 2.14 SAI022 specification Item Specification Model name SAI022 Number of input points 4 points Input insulation unit Insulation at each point Input signal level 1-5VDC ±30Vpeak Maximum applied voltage 1M Ω or more Input impedance Data update cycle 18ms A/D conversion data +6400 to +32000 counts...
  • Page 37 2. System component State V/F converter Signal Filter display/switch circuit insulating circuit Internal CPU Insulation DC/DC circuit converter RS-485 RS-485 transceiver transceiver Constant voltage Internal power circuit power supply Bus A Bus B Module connector System power supply Redundancy I/O bus (DC24V) Fig.
  • Page 38 2. System component Table 2.15 SAO012 specification Item Specification Model name SAO012 Number of output points 8 points Output insulation unit 8-point common insulation (output (-) side common) Output signal level 4-20mADC Load resistance range 0 to 750Ω Slew rate 10ms(0 to 63%) D/A conversion data +800 to +4000 counts...
  • Page 39 2. System component Signal State D/A conversion insulating display/switch circuit with circuit analog Internal read-back Internal CPU power supply circuit Constant voltage RS-485 RS-485 power circuit transceiver transceiver Analog circuit Insulation DC/DC Bus A Bus B power supply converter Module connector System power supply Redundancy I/O bus (DC24V)
  • Page 40 2. System component Table 2.16 SDI01 specification Item Specification Model name SDI01 Number of input points 32 points Input insulation unit Input 32-point common insulation (one side common) Input signal No-voltage contact/open collector input 5mA (external power supply 24VDC, contact resistance 0 Ω ) Input current ON:500 Ω...
  • Page 41 2. System component Internal CPU State circuit display/switch Filter Internal power circuit supply Constant voltage power circuit External power supply RS-485 RS-485 transceiver transceiver External power supply monitoring Bus A Bus B Module connector System power supply Redundancy I/O bus (DC24V) Fig.
  • Page 42 2. System component REFERENCE: State change detection function (ON/OFF) For SDI01 with the firmware V2.0 or later, the state change detection function can be used. This function detects the state changes (rising edge and falling edge) of DI input and retains the state for a certain period of time.
  • Page 43 2. System component ※ When another state change occurs while a state change is being retained, retention starts from that point. CDDI retention time Rising edge detection CDDI retention time Rising edge detection data CDDI retention time CDDI retention time...
  • Page 44 2. System component Table 2.17 SDO01 specification Item Specification Model name SDO01 Number of output points 32 points Output insulation unit Output 32-point common insulation (one side common) Output signal Open drain output Output current 100mA (Max) Voltage drop upon output off 0.8V (Load 24VDC-100mA) Leak current upon output off 0.1mA or less...
  • Page 45 2. System component State display/switch Photo- coupler Output insulating latch circuit Internal circuit CPU circuit Internal power supply External power External power supply supply constant Constant voltage RS-485 RS-485 voltage circuit power circuit transceiver transceiver Bus A Bus B Module connector System power supply Redundancy I/O bus (DC24V)
  • Page 46 2. System component Table 2.18 SRT012 specification Item Specification Model name SRT012 Number of input points 4 points Input insulation unit Insulation at each point Input signal level Three-wire RTD (resistance-temperature detector: Pt100(Pt385) and JPt100(Pt3916) can be set at each point independently) Data update cycle 186/159ms (Selected from 50/60Hz filters) A/D conversion data...
  • Page 47 2. System component Current output State Signal Insulation DC/DC insulating display/switch Resistance detection converter circuit circuit Analog V/F converter multiplexer Internal CPU circuit circuit circuit RS-485 RS-485 transceiver transceiver Constant voltage Internal power power circuit Bus A Bus B supply Module connector System power supply Redundancy I/O bus...
  • Page 48 2. System component Table 2.19 SPI01 specification Item Specification Model name SPI01 Number of input points 4 points Input insulation unit 4-point common insulation Input signal (Note 1) No-voltage contact (open collector input)/voltage pulse can be set independently at each point Counter 16-bit up counter Input current (no-voltage contact)
  • Page 49 2. System component State Internal CPU circuit display/switch Internal power supply Constant voltage power circuit RS-485 RS-485 External power supply transceiver transceiver External power supply Bus A Bus B monitoring Module connector System power supply Redundancy I/O bus (DC24V) Fig. 2.26 SPI01 module internal circuit RUN indicator: Illuminates when normal Alarm indicator: Blinks upon an error...
  • Page 50 2. System component Table 2.20 STC012 specification Item Specification Model name STC012 Number of input points 8 points Input insulation unit Insulation at each point Input signal level (Thermocouple: Each of B, R, S, J, K, T, E can be set independently) 1M Ω...
  • Page 51 2. System component Signal V/F converter State Input insulating circuit display/switch protection analog circuit circuit multi- plexer Internal CPU circuit circuit Internal power supply Insulation Constant voltage RS-485 RS-485 DC/DC power circuit Cold junction transceiver transceiver converter compensation Bus A Bus B circuit Module connector...
  • Page 52: Cable Specifications And Outer Shape

    2. System component Cable specifications and outer shape Serial bus cable shape Shielded line Shielded line Cable length Fig. 2.30 Serial bus cable I/O bus cable shape This cable connects UIOU-VTBUX32 and UIOU-VTBUX34. There are 3 types; straight type, PI, and AO. Cable length Fig.
  • Page 53: Installation And Wiring

    3. Installation and wiring Chapter Installation and wiring Precautions on installation ·············································· 38 Precautions on mounting and wiring ························· 39 Base card installation ················································ 43 Base unit installation ················································· 43 Cable wiring ······························································· 44 Module installation ····················································· 45 Various settings ·························································...
  • Page 54: Precautions On Installation

    3. Installation and wiring This chapter describes installation and wiring of DPCS emulator I/O system component. This component has superior environment resistance. However, to improve the reliability of the product and make use of the functions fully, check the following precautions before installation.
  • Page 55: Airflow

    3. Installation and wiring Airflow The I/O system components release heat by natural convection. Therefore, no forced cooling is required for each base unit or module. However, to keep the ambient temperature within the operating conditions, an exhaust fan is normally required in the storage housing.
  • Page 56 3. Installation and wiring Table 3.1 Specifications of the shielded twisted pair cable Item Specification 10MΩ • km Minimum insulating resistance 100 Ω Characteristic impedance Minimum allowable bend radius 25mm Cautions on wiring of the serial bus When wiring the serial bus cable, note the following. Perform wiring within the same housing or between neighboring housings with a total extension of 30 meters or less.
  • Page 57 3. Installation and wiring For the separation distance of wiring when metal ducts with lid or metal ducts are used, refer to Table 3.3 in "Wiring separation" on the next page. Perform laying work with tubing in the following steps. (1) Use a pull box where cables are connecter or duct lines with different radius are connected.
  • Page 58: Grounding

    3. Installation and wiring Table 3.3 Recommended minimum separation distance (when metal ducts with lid and metal ducts are used) Total parallel distance Cable power 10m or less 25m or less 100m or less 125V or less 10A or less 10 or more 10 or more 50 or more...
  • Page 59: Base Card Installation

    3. Installation and wiring Connect FG of the terminal block and shield of the input-output cable to the dedicated grounding. Avoid 2-point grounding of the shielded lines of the various input-output signal wiring cables such as analog input/output and digital input/output. Otherwise malfunction of the module may occur depending on the installation environment.
  • Page 60: Cable Wiring

    3. Installation and wiring Cable wiring System power supply cable Insert the power supply cable of the 24V system power supply from VPSUX1 to the power connector of UIOU51. Insert it fully until it clicks. • Do not ground the common signal (0V) of the 24V system power supply. •...
  • Page 61: Module Installation

    3. Installation and wiring Module installation Module installation Install the module to the base card in the following steps (Fig. 3.1). (1) Place the hook of the module bottom to the back of the base unit guide ( ). (2) Press the module top into the specified position of the terminal block unit or communication base unit ( ).
  • Page 62 3. Installation and wiring Wiring of the serial bus cable Wire the serial bus cable to each terminal of the terminal block TB1 (1) through (6) of the communication base unit. For the communication base unit in the last stage, place terminal resistance to the (1) and (3) terminals and (2) and (4) terminals.
  • Page 63: Various Settings

    3. Installation and wiring Various settings Address setting For the I/O module, set an I/O address. For the base unit, set the unit address setting switches to the unit number of 1 to F (1 to 15). For the I/O module, set the module address setting switches to the module number of 1 to E (1 to 14).
  • Page 64: Terminal Resistance Setting

    3. Installation and wiring Terminal resistance setting For Slots 1 to 8, turn on the terminal resistance switch of the rightmost base card. Turn off the terminal resistance switch of the remaining slots.
  • Page 65: Maintenance And Inspection

    4. Maintenance and inspection Chapter 4 Maintenance and inspection Periodic inspection ···················································· 50...
  • Page 66: Periodic Inspection

    4. Maintenance and inspection Periodic inspection Periodic inspection Check the following items regularly (about once in every 6 months). (1) Clean the modules. Remove the modules from the basic base unit and remove dust by blowing air. After cleaning, install the modules to the original positions. (2) Check the mounting state of the basic base unit.
  • Page 67: Aging Part

    4. Maintenance and inspection Aging part Each module has aging parts. Take appropriate actions based on the following list. Item name Deteriorated Description Model Nominal Recommended Recommen- part Life replacement ded action cycle Aluminum Electrostatic Dry up SBIF1C 10 years Module electrolytic capacitance...
  • Page 68 4. Maintenance and inspection...
  • Page 69: Appendix 1

    Appendix 1. Specification Appendix 1 Specification...
  • Page 70 Appendix 1. Specification Appendix Table 1.1 Serial bus specifications Item Specification Transmission line configuration Shielded twisted pair cable Number of connected nodes Up to 30 serial bus communication modules such as SBIF when redundant Transmission line length Up to 30m (for wiring inside the housing only) Transmission speed 1Mbps Transmission format...
  • Page 71 DPCS emulator hardware operation manual (I/O system components) 2008 Jan. 15 First edition Issued by Industrial Systems Company, Toshiba Corporation Toshiba Bldg., 1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN © TOSHIBA Corporation 2004-2008 Unauthorized reproduction is prohibited. All Right Reserved.
  • Page 72 Industrial Systems Company TOSHIBA CORPORATION Toshiba Bldg., 1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN...

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