IBM CS821 Service Manual page 71

About this task
As part of the system processor module replacement, the heat sink is removed. When the heat sink is
removed from the system processor module, the thermal interface material (TIM) is typically adhered to
the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. If the TIM is
damaged, do not reuse the removed heat sink. Before you begin the processor removal and replacement
procedure, ensure that you have a spare TIM and heat sink on hand.
Procedure
1. Attach the electrostatic discharge (ESD) wrist strap.
Attention:
v Attach an electrostatic discharge (ESD) wrist strap to the front ESD jack, to the rear ESD jack, or to
an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging
your hardware.
v When you use an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is
used for static control. It does not increase or decrease your risk of receiving electric shock when
using or working on electrical equipment.
v If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging
and installing or replacing hardware, touch an unpainted metal surface of the system for a
minimum of 5 seconds.
2. Open the packaging of the new system processor module and place the cover upside down next to
the tray, as shown in Figure 62. The cover is used for the system processor module that you are
replacing.
Figure 62. Opening the system processor module packaging
3. Remove the processor air baffle as shown in Figure 63 on page 56. Carefully unsnap and lift the
processor air baffle from the system.
Removing and replacing parts
55