Intel P43 User Manual page 16

775- Land Package Removal
Chamfer on Land Side
Cover (align this with
pin 1 mark on 775-land
LGA package)
Large Retention Tabs
(pointing towards user)
Hold at corners
5. Visually inspect socket contact array
1. First Pass Inspection
i. Scan socket contact array at varying angles noting the presence of any foreign material
ii. If foreign material can't be blown off by compressed air, or mechanical damage (Mode1 or 4)
observed, reject the motherboard for further evaluation or socket replacement.
2. Second Pass Inspection
i. Repeat 2 more times to sight down the rows and columns from each of the 4 sides of the socket to
ensure all contacts within the array are inspected
ii. Inspect for Mode2, Mode3, and Mode5 failures
Note: Refer to the Test Module for detail visual inspections
6. Assemble LGA775 socket PnP cap
i. Secure/Hook the back side of PnP cap.
ii. Snap down the front side to fully secure
1. Open the Load Plate/Lever with both hands:
With left hand index finger and thumb to support the load
plate edge, engage PnP cap with right hand thumb and peel the
cap from LGA775 Socket while pressing on center of PnP cap to
assist in removal.
2. Pick up 775-land LGA package:
By Vacuum Pen: Place a minimum 9-mm cup at approximately
the center of IHS.
Recommend not to place Vacuum Pen on IHS edge. Risk of
dropping and causing bent contact.
Recommend not to use Vacuum Pen for inserting CPU By Hand:
Index finger to hold load plate hinge side and thumb to hold load
lever side
3. Lift the package straight up and away.
4. Assemble processors land side cover immediately to
prevent contamination.
i. While holding the processor by the 3 corners, the other
hand lift land side cover from work surface by grasping at
the large retention tabs. Ensure retention tabs and
package are pointing each other.
ii. Orientate so that land side cover chamfer is matching with
package Pin 1 location.
iii. Hook the first large retention tab on the package
substrate. Then press the opposite tab onto the substrate.
iv. Place processor with land side cover installed onto
proper shipping media or other ESD approved work
surface
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