Intel P43 User Manual page 15

Express and chipset based m/b for lga775 quad core ready intel core processor family

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Table of Contents

775- Land LGA Package Insertion

Press to remove

Pin 1 Indicator

Alignment Key

CAUTION: Using Vacuum Pen for installation is not recommended

Lift processor package from shipping media by grasping

the substrate edges ONLY.

Note: Orient processor package such that the Pin 1 triangle

mark is on bottom left and both key notches are on left side

Land Side Cover Handling: Remove land side cover with

the opposite hand by depressing larger retention tab and

peeling the cover away

Set and reserve the land side cover aside.

Note: Always keep the land side cover on the processor

when not in the socket.

Visually inspect the package gold pads: Scan the

processor package gold pad array for presence of foreign

material. Refer to Overview Module for FM cleaning

recommendations

Orient the package with IHS up. Locate Pin 1 and the two

orientation key notches

Carefully place the package into the socket body using a

purely vertical motion

Verify that package is within the socket body and properly

mated to the orient keys

Close the socket by

Rotating the Load Plate onto the package HIS

ii.

While pressing down lightly on Load Plate, engage the

Load Lever.

iii.

Securing Load Lever with Load Plate tab under retention

tab of Load Lever

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