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2. Using a cutter, cut the lead at the source. (Cut the contents with
the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same
time.)
After removing the Flat IC and when attaching the new IC, remove any of the excess solder on
the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC
will slip and not be attached properly.
8.1.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked
pins.
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