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5.1. MAIN BOARD:COMPONENT VIEW_1
5.2. MAIN BOARD:COMPONENT VIEW_2
5.3. MAIN BOARD:BOTTOM VIEW_1
5.4. MAIN BOARD:BOTTOM VIEW_2
6. SCHEMATIC DIAGRAM AND PRINTED CIRCUIT
BOARD
6.1. SCHEMATIC DIAGRAM (POWER UNIT)
7. PRINTED CIRCUIT BOARD
7.1. POWER UNIT:COMPONENT VIEW
8. SEVICE INFORMATION
If you do not have the special tools (for example: SPOT HEATER) to remove the SPOT
HEATER'S Flat IC, If you have solder (large amount) a soldering iron and a cutter knife, you can
easily remove IC's even though large than 100 pin.
8.1. HOW TO REPLACE THE FLAT PACKAGE IC
8.1.1. PREPARATION
- SOLDER / Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19,KR-
19RMA
- Soldering iron / Recommended power consumption is between 30
W to 40 W. / Temperature of Copper Rod 662 ± 50°F (350 ± 10°C) /
(An expert may handle a 60~80 W iron, but beginner might damage
foil by overheating.)
- Flux / HI115 Specific gravity 0.863 / (Original flux should be
replaced daily.)
8.1.2. FLAT PACKAGE IC REMOVE PROCEDURE
1. When all of the IC lead can not been seen at the standard degree,
fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up
directly in the P.C.board's pattern. If you do not fill with large quantities of solder as in step 1
the P.C.board pattem may be removed.
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