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Summary of Contents for Telit Wireless Solutions LM960
- Page 1 LM960 Thermal Design Guide 1VV0301620 Rev. 2 – 2021-09-09 Telit Technical Documentation...
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Page 2: Applicability Table
LM960 Thermal Design Guide APPLICABILITY TABLE PRODUCTS LM960 LM960A18 1VV0301620 Rev. 2 Page 2 of 26 2021-09-09 Not Subject to NDA... -
Page 3: Table Of Contents
LM960 Thermal Design Guide CONTENTS APPLICABILITY TABLE CONTENTS INTRODUCTION Scope Audience Contact Information, Support Symbol Conventions Related Documents THERMAL MODEL Temperature Sensor and Hotspot 2.1.1. Temperature Reading and Monitoring Thermal Mitigation Algorithm 2.2.1. Thermal Mitigation Level Reading 2.2.2. How to Change Thermal Mitigation Level Range... - Page 4 LM960 Thermal Design Guide 4.2.3. High Risk Materials 4.2.4. Trademarks 4.2.5. Third Party Rights 4.2.6. Waiver of Liability Safety Recommendations GLOSSARY DOCUMENT HISTORY 1VV0301620 Rev. 2 Page 4 of 26 2021-09-09 Not Subject to NDA...
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Page 5: Introduction
Audience This document is intended system integrators that are using the Telit LM960 module in their products. Contact Information, Support For technical support and general questions please e-mail: TS-EMEA@telit.com... -
Page 6: Symbol Conventions
Table 1: Symbol Conventions All dates are in ISO 8601 format, that is YYYY-MM-DD. Related Documents • LM960 HW User Guide, 1VV0301485 • LM960 SW User Guide, 1VV0301477 1VV0301620 Rev. 2 Page 6 of 26... -
Page 7: Thermal Model
AT command. Figure 1: LM960 Temp Sensor & Hotspot As you can see in the figure above, inside the LM960 there are three temperature sensors (TSENS2, PA_THERM0, PA_THERM1). And it can be read from internal temperatures using the AT#TEMPSENS command. - Page 8 LM960 Thermal Design Guide #TEMPSENS – Temperature monitor AT#TEMPSENS= Set command sets the operation of the internal temperature monitor. <mod>[,<interval> Parameters: [,<action> <mod> ,<low_temp> 0 – disables the periodic reporting (factory default) ,<high_temp> 1 – enables the periodic reporting [,<gpio>]]] 2 –...
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Page 9: Thermal Mitigation Algorithm
Table 2: AT Command for Temperature Monitoring Thermal Mitigation Algorithm LM960 has a built-in thermal mitigation algorithm to reduce the probability of failure and extend the operation time with maximum performance. The thermal mitigation algorithm operates according to the internal temperature value read through the three temperature sensors. -
Page 10: Thermal Mitigation Level Reading
LM960 Thermal Design Guide After entering mitigation level 3, the limited service mode is released after the PA_THERM and TSENS sensor reaches mitigation level 0. In other words, the sensor reading falls below the level 1 clearing thresholds. 2.2.1. Thermal Mitigation Level Reading AT#TMLVL command used for read current thermal mitigation level of each temperature sensors. -
Page 11: How To Change Thermal Mitigation Level Range
LM960 Thermal Design Guide 2.2.2. How to Change Thermal Mitigation Level Range The range of the Thermal mitigation level could be modified through thermal engine configuration file. For using ADB on Windows OS Download the ADB tool through google (Can be skipped if you already have it). - Page 12 • After do commands, you can see ADB device that attached on Laptop. Change thermal engine configuration file Current thermal engine configuration file can be got from LM960 through ADB command. • adb pull /etc/thermal-engine.conf • Open and edit the thermal-engine.conf file.
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Page 13: Thermal Model -Tbd
LM960 Thermal Design Guide Thermal Model -TBD Thermal Model is evaluated by thermal simulation and RF test with thermal chamber. Figure 2: Equivalent thermal resistance model The two-resistor compact model is calculated according to JEDEC standard. is the thermal resistance from junction to the top side: 9 °C/W Ɵ... -
Page 14: Temperature Range
• • TS-SRD@telit.com Temperature Range The maximum operating temperature allowed is +105°C which can be read by AT#TEMPSENS. It is not recommended to operature the LM960 above the allowable maximum operating temperature. Operating Condition Condition The Temperature read by AT#TEMPSENS +105°C... - Page 15 LM960 Thermal Design Guide Mode Average [Typ.] Mode Description CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL 2DL CA with 2x2 MIMO / 2UL CA 900mA (FDD 300Mbps DL / 150Mbps UL) CA_2A-5B-66A-66A, 2x2 MIMO, Full RB, 256QAM DL /...
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Page 16: Thermal Design
Thermal Design Guidelines To enhance heat dissipation: • Make sure there is sufficient air flow around the LM960 . (Spread the heat) Balance the heat flow between front and back of the PCB Insulate hot spots on the device skin from hot areas below •... - Page 17 LM960 Thermal Design Guide Figure 3: LM960 Side View Warning: RF and Baseband areas must be dissipated from heat Figure 4: LM960 Shield Cover with TIM (Bottom View) Figure 5: Copper Pad Location on Bottom of LM960 1VV0301620 Rev. 2...
- Page 18 LM960 Thermal Design Guide On the back of LM960 there is the large resist opening area for soldering for better heat dissipation to the heat sinks found on the customer’s application board. This chapter defines the heat sink or TIM for application as the basic element of the heat sink design.
- Page 19 LM960 Thermal Design Guide Figure 8: TIM on Bottom Side Note: If you ignore the above contents, the network connection may be terminated due to overheating. When the temperature drops, the network connection will be restarted 1VV0301620 Rev. 2 Page 19 of 26...
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Page 20: Product And Safety Information
LM960 Thermal Design Guide 4. PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. -
Page 21: Usage And Disclosure Restrictions
LM960 Thermal Design Guide computer programs, including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the Third Party software supplier. -
Page 22: Trademarks
LM960 Thermal Design Guide 4.2.4. Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 4.2.5. Third Party Rights The software may include Third Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights. -
Page 23: Safety Recommendations
LM960 Thermal Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc. -
Page 24: Glossary
LM960 Thermal Design Guide 5. GLOSSARY Android Debug Bridge Bandwidth Carrier Aggregation Downlink Frequency Division Duplex GPIO General Purpose Input Output Long Term Evolution GPIO General Purpose Input Output MIMO Multiple Input Multiple Output Power Amplifier Printed Circuit Board Primary Component Carrier... -
Page 25: Document History
LM960 Thermal Design Guide 6. DOCUMENT HISTORY Revision Date Changes 2021-09-09 Minor changes on the language and on the layout Legal Notices updated Glossary added 2019-11-11 Applicability table – Added LM960A18 2019-08-02 Initial Release From Mod.0818 rev.4 1VV0301620 Rev. 2...
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