Telit Wireless Solutions LM960 Thermal Design Manual
  1. Manuals
  2. Brands
  3. Telit Wireless Solutions Manuals
  4. PCI Card
  5. LM960
  6. Thermal design manual

Telit Wireless Solutions LM960 Thermal Design Manual

Hide thumbs Also See for LM960:
Table of Contents

Advertisement

Quick Links

Download this manual
LM960
Thermal Design Guide
1VV0301620 Rev. 1 – 2019-11-11
Mod.0818 2019-01 Rev.0

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the LM960 and is the answer not in the manual?

Questions and answers

Related Manuals for Telit Wireless Solutions LM960

Summary of Contents for Telit Wireless Solutions LM960

  • Page 1 LM960 Thermal Design Guide 1VV0301620 Rev. 1 – 2019-11-11 Mod.0818 2019-01 Rev.0...

  • Page 2: Notice

    LM960 Thermal Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.

  • Page 3: Usage And Disclosure Restrictions

    LM960 Thermal Design Guide USAGE AND DISCLOSURE RESTRICTIONS License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 4: Applicability Table

    LM960 Thermal Design Guide APPLICABILITY TABLE PRODUCTS LM960 LM960A18 1VV0301620 Rev. 1 Page 4 of 22 2019-11-11...

  • Page 5: Table Of Contents

    LM960 Thermal Design Guide Contents NOTICE COPYRIGHTS ....................2 COMPUTER SOFTWARE COPYRIGHTS ............2 USAGE AND DISCLOSURE RESTRICTIONS ..........3 APPLICABILITY TABLE ................4 CONTENTS ....................5 INTRODUCTION ................6 THERMAL MODEL ..............7 Temperature Sensor and Hotspot ..........7 2.1.1.

  • Page 6: Introduction

    LM960 Thermal Design Guide 1. INTRODUCTION The aim of this document is to provide thermal model and design guidelines useful for developing a product with the Telit LM960. Information – Proper thermal protection design protects against human or component damage for worst-case conditions.

  • Page 7: Thermal Model

    AT command. <LM960 Temp Sensor & Hotspot> As you can see in the figure above, there are three temperature sensors (TSENS2, PA_THERM0, PA_THERM1) inside the LM960. And it can be read by the internal temperatures using the AT#TEMPSENS command. 2.1.1.
  • Page 8 LM960 Thermal Design Guide #TEMPSENS – Temperature monitor [,<action> Parameters: ,<low_temp> <mod> ,<high_temp> 0 – disables the periodic reporting (factory default) [,<gpio>]]] 1 – enables the periodic reporting 2 – instantaneous reporting of the Temperature Note: the module cannot enter sleep when <mod>=1.

  • Page 9: Thermal Mitigation Algorithm

    #TEMPSENS: PA_THERM0,30 #TEMPSENS: PA_THERM1,30 Thermal Mitigation Algorithm LM960 has built-in thermal mitigation algorithm to reduce the probability of failure and extend the operation time with maximum performance. The thermal mitigation algorithm operates according to the internal temperature value read through the three temperature sensors.

  • Page 10: Thermal Mitigation Level Reading

    LM960 Thermal Design Guide Sensor Level Action Comment PA_THERM Normal Enable UL data throttling Start throttling the uplink data rate by reporting a smaller buffer status report. Enable MTPL back-off Limit maximum Tx power (23dBm) Lmitied service mode Call released.
  • Page 11 LM960 Thermal Design Guide #TMLVL – Thermal Mitigation Level Note : level2 is shown only with PA_THERM device. AT#TMLVL? Read command reports a current thermal mitigation level of all devices in the format: #TMLVL: TSENS2,<level> #TMLVL: PA_THERM,<level> AT#TMLVL=? Test command returns the supported range of values for parameter <device_id>.

  • Page 12: How To Change Thermal Mitigation Level Range

    LM960 Thermal Design Guide 2.2.2. How to Change Thermal Mitigation Level Range Thermal mitigation level range could be modified through thermal engine configuration file. For using ADB on Windows OS Download the ADB tool through google (Can be skipped if you already have).
  • Page 13  After do commands, you can see ADB device that attached on Laptop. Change thermal engine configuration file Current thermal engine configuration file can be got from LM960 through ADB command.  adb pull /etc/thermal-engine.conf  Open and edit the thermal-engine.conf file.

  • Page 14: Thermal Model -Tbd

    LM960 Thermal Design Guide Thermal Model -TBD Thermal Model is evaluated by thermal simulation and RF test with thermal chamber. <Equivalent thermal resistance model> The two-resistor compact model is calculated according to JEDEC standard. Ɵ is the thermal resistance from junction to the top side: 9 °C/W Ɵ...

  • Page 15: Temperature Range

    LM960 Thermal Design Guide Temperature Range The allowable maximum operating temperature is +105°C which can be read by AT#TEMPSENS. It is not recommended to operature LM960 above the allowable maximum operating temperature. Operating Condition Condition The Temperature read by AT#TEMPSENS +105°C...
  • Page 16 LM960 Thermal Design Guide Mode Average [Typ.] Mode Description WCDMA HSPA WCDMA data call (DC-HSDPA up to 42 650 mA (22 dBm) Mbps, Max Throughput) * Worst/best case current values depend on network configuration ** Loop-back mode in call equipment *** 3.3 voltage / room temperature...

  • Page 17: Thermal Design

    This chapter provides the thermal design guide for customer to help their thermal design. Thermal Design Guidelines To enhance heat dissipation: Ensure that the air flow around the LM960 is sufficient. (Spread the heat) • Balance the heat flow between front and back of the PCB...

  • Page 18: Thermal Design Solution

    LM960 Thermal Design Guide Thermal Design Solution There are the 1.2 W/m-k thermal conductive materials between main chipset and shield cover of the LM960 for the better heat dissipation. <LM960 Side View> RF and Baseband areas must be heat dissipation.
  • Page 19 This chapter defines the heat sink or TIM for your application as a basic element of the heat sink design. LM960 is able to get very hot when operating at the upper limit of its range.
  • Page 20 LM960 Thermal Design Guide <TIM on Bottom Side> Information – If ignore the above contents, network connection might be terminated due to overheating. When the temperature drops, it will be restart the network connection. 1VV0301620 Rev. 1 Page 20 of 22...

  • Page 21: Document History

    LM960 Thermal Design Guide 4. DOCUMENT HISTORY Revision Date Changes 2019-08-02 Initial Release 2019-11-11 Applicability table – Added LM960A18 1VV0301620 Rev. 1 Page 21 of 22 2019-11-11...
  • Page 22 Mod.0818 2019-01 Rev.0...

This manual is also suitable for:

Lm960a18

Table of Contents