Telit Wireless Solutions LM960 Design Manual
  1. Manuals
  2. Brands
  3. Telit Wireless Solutions Manuals
  4. Control Unit
  5. LM960
  6. Design manual

Telit Wireless Solutions LM960 Design Manual

Hide thumbs Also See for LM960:
Table of Contents

Advertisement

Quick Links

Download this manual
LM960
HW Design Guide
1VV0301485 Rev.1 –2018-05-30
Mod.0818 2017-01 Rev.0

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the LM960 and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Related Manuals for Telit Wireless Solutions LM960

Summary of Contents for Telit Wireless Solutions LM960

  • Page 1 LM960 HW Design Guide 1VV0301485 Rev.1 –2018-05-30 Mod.0818 2017-01 Rev.0...

  • Page 2: Notice

    LM960 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.

  • Page 3: Usage And Disclosure Restrictions

    LM960 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 4: Applicability Table

    LM960 HW Design Guide Applicability Table PRODUCTS LM960 1VV0301485 Rev. 1 Page 4 of 70 2018-05-30...

  • Page 5: Table Of Contents

    Environmental Requirements ............18 2.9.1. Temperature Range ..............18 2.9.2. RoHS Compliance ..............19 PINS ALLOCATION ..............20 Pin-out ..................20 LM960 Signals That Must Be Connected ........24 Pin Layout ................... 25 1VV0301485 Rev. 1 Page 5 of 70 2018-05-30...
  • Page 6 LM960 HW Design Guide POWER SUPPLY ............... 26 Power Supply Requirements ............26 Power Consumption ..............26 General Design Rules ..............27 4.3.1. Electrical Design Guidelines ............27 4.3.1.1. + 5V Input Source Power Supply – Design Guidelines ....27 4.3.2.
  • Page 7 General ..................52 Finishing & Dimensions .............. 52 Drawing (TBD) ................52 APPLICATION GUIDE ............... 53 Debug of the LM960 Module in Production ......... 53 Bypass Capacitor on Power Supplies ......... 53 EMC Recommendations ............. 54 PACKAGING ................57 Tray .................... 57 CONFORMITY ASSESSMENT ISSUES ........
  • Page 8 LM960 HW Design Guide SAFETY RECOMMENDATIONS..........63 READ CAREFULLY ..............63 REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..64 ACRONYMS ................67 DOCUMENT HISTORY .............. 69 1VV0301485 Rev. 1 Page 8 of 70 2018-05-30...

  • Page 9: Introduction

    This document introduces the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document are applicable to all LM960 variants, where “LM960” refers to the variants listed in the Applicability Table.
  • Page 10 LM960 HW Design Guide For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

  • Page 11: Text Conventions

    LM960 HW Design Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

  • Page 12: Related Documents

    LM960 HW Design Guide Related Documents  LM960 SW User Guide, 1VV0301477  LM960 AT Commands Reference Guide, 80568ST10869A  Generic EVB HW User Guide, 1VV0301249  LM960 Interface Board HW User Guide, 1VV0301502  SIM Integration Design Guide Application Note Rev10, 80000NT10001A 1VV0301485 Rev.

  • Page 13: General Product Description

    LTE / WCDMA networks for data communication • Designed for industrial grade quality In its most basic use case, LM960 can be applied as a wireless communication front-end for mobile router products, offering mobile communication features to an external host CPU through its rich interfaces.

  • Page 14: Target Market

    • Internet connectivity Main features The LM960 family of industrial grade cellular modules features LTE and multi-RAT module together with an on-chip powerful application processor and a rich set of interfaces. The major functions and features are listed below. Main Features...
  • Page 15 LM960 HW Design Guide Function Features • 4Gbit NAND Flash + 2Gbit LPDDR2 MCP is supported to allow for customer’s own software applications Interfaces Rich set of interfaces, including: • USB3.0 – USB port is typically used for: o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system...

  • Page 16: Block Diagram

    LM960 HW Design Guide Block Diagram Below figure shows an overview of the internal architecture of the LM960 module. LM960 Block Diagram It includes the following sub-functions: • Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC.
  • Page 17 LM960 HW Design Guide Technology 3GPP Compliance 4G LTE Throughput >95% 10MHz Dual Receiver 3G WCDMA BER <0.1% 12.2 Kbps Dual Receiver Product Band Typical Rx Sensitivity (dBm) * / ** (LTE BW = 10 MHz) LM960 LTE FDD B1...

  • Page 18: Mechanical Specifications

    Length: 50.95 mm, +/- 0.15 mm tolerance • Width: 30.00 mm, +/- 0.15 mm tolerance • Thickness: 2.70 mm, +/- 0.15 mm tolerance 2.8.2. Weight The nominal weight of the LM960 module is grams. Environmental Requirements 2.9.1. Temperature Range Note Operating –20°C ~ +55°C This range is defined by 3GPP (the global...

  • Page 19: Rohs Compliance

    Temperature Range 2.9.2. RoHS Compliance As a part of the Telit corporate policy of environmental protection, the LM960 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU). 1VV0301485 Rev. 1 Page 19 of 70...

  • Page 20: Pins Allocation

    LM960 HW Design Guide 3. PINS ALLOCATION Pin-out LM960 Pin-out Signal Function Type Comment USB HS 2.0 Communication Port USB_D+ USB 2.0 Data Plus Analog USB_D- USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port USB_TX_P USB 3.0 super-...
  • Page 21 LM960 HW Design Guide PCIE_RESET_N Functional reset to 1.8V the card SIM Card Interface 1 SIMVCC1 Supply output for an 1.8V / Power external UIM1 card 2.85V SIMIO1 Data connection with 1.8V / an external UIM1 2.85V card SIMCLK1 Clock output to an 1.8V /...
  • Page 22 LM960 HW Design Guide GPIO_04 General purpose I/O 1.8V Control Signal PCIE_WAKE_N PCIe wake-up 1.8V W_DISABLE_N RF disable Open-drain Internal VBATT Pull-up WAN_LED_N LED control Open-drain Miscellaneous Functions VREG_L6_1P8 Reference Voltage 1.8V Power SYSTEM_RESET_N Reset Input 1.8V Digital Audio Interface...
  • Page 23 LM960 HW Design Guide VBATT Power supply Power VBATT Power supply Power GROUND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Information –...

  • Page 24: Lm960 Signals That Must Be Connected

    Information – Unless otherwise specified, RESERVED pins must be left unconnected (Floating). LM960 Signals That Must Be Connected Below table specifies the LM960 signals that must be connected for a debugging purpose even if not used by the end application: Mandatory Signals...

  • Page 25: Pin Layout

    LM960 HW Design Guide Pin Layout LM960 Pin Layout Top side Bottom side - Odd pins - Even pins PCIE_WAKE_N VBATT GPIO_01 GPIO_02 SIMRST2 PCIE_CLKREQ_N SIMVCC1 SIMIO1 PCIE_REFCLK_M SIMCLK1 PCIE_REFCLK_P SIMRST1 SIMVCC2 SIMCLK2 SIMIO2 W_DISABLE_N PCIE_RESET_N USB/PCIE_TX_M VBATT USB/PCIE_TX_P VREG_L6M...

  • Page 26: Power Supply

    3.3V Supply voltage range 3.10V – 3.6V Maximum ripple on module input supply 30 mV Power Consumption Below table provides typical current consumption values of LM960 for various operation modes. LM960 Current Consumption Mode Average [Typ.] Mode Description IDLE Mode...

  • Page 27: General Design Rules

    Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • A protection diode must be inserted close to the power input to protect the LM960 module from power polarity inversion. 1VV0301485 Rev. 1...

  • Page 28: Thermal Design Guidelines

    Therefore, you must pay special attention how to dissipate the heat generated. While designing the application board, the designer must make sure that the LM960 module is located on a large ground area of the application board for effective heat dissipation.

  • Page 29: Power Supply Pcb Layout Guidelines

    PCB trace from the capacitor to LM960 is wide enough to ensure a drop-less connection even during the 2A current peaks.

  • Page 30: Internal Ldo For Gnss Bias

    1.8V Internal LDO for GNSS bias The LDO for GNSS bias is applied inside the LM960 model. The voltage supply come from LM960’s LDO to GNSS active antenna. This table lists the LDO for GNSS bias of LM960. LM960 Reference Voltage when VBATT is 3.3...

  • Page 31: Electrical Specifications

    LM960 HW Design Guide 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings – Not Operational Caution – A deviation from the value ranges listed below may harm the LM960 module. Absolute Maximum Ratings – Not Operational Symbol Parameter Unit VBATT Battery supply voltage on pin VBATT -0.5...

  • Page 32: Digital Section

    6. DIGITAL SECTION Logic Levels Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface circuits.

  • Page 33: Sim Card Pins

    LM960 HW Design Guide Parameter Unit Comment IIHPD High-level input leakage 27.5 97.5 [uA] With pull-down current CI/o I/O capacitance [pF] 6.1.3. 1.8V SIM Card Pins Operating Range – SIM Pins Working at 1.8V Parameter Unit Comment Input high level 1.26V...

  • Page 34: Power On

    6.2.1. Initialization and Activation State After turning on the LM960 module, the LM960 is not yet activated because the SW initialization process of the LM960 module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module.

  • Page 35: Power Off

    OFF or during an ON/OFF transition. Power Off To turn off the LM960, SYSTEM_RESET_N pad must be asserted low more than 1 seconds and then it should be kept low. When the SYSTEM_RESET_N is asserted low more than 1 seconds, LM960 goes into the finalization state and after the end of the finalization process VREG_L6_1P8 will go to low.

  • Page 36: Reset

    Graceful Reset by USB AT command AT#REBOOT • Unconditional Reset using the SYSTEM_RESET_N 6.4.1. Graceful Reset To gracefully restart the LM960 module, AT#REBOOT AT command must be sent via a USB communication. Graceful Reset by AT#REBOOT 1VV0301485 Rev. 1 Page 36 of 70...

  • Page 37: Unconditional Hardware Reset

    LM960 HW Design Guide 6.4.2. Unconditional Hardware Reset To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released. Unconditional Hardware Reset by SYSTEM_RESET_N Pad Information – The Unconditional Hardware Reset must be used only as an emergency exit procedure, and not as a normal power-off operation.

  • Page 38: Usb Interface

    The USB port is typically the main interface between the LM960 module and OEM hardware. USB 3.0 needs series capacitors on the TX lines in both directions for AC coupling. In order to interface USB3.0 with an application board of customer, 0.1uF capacitors should...
  • Page 39 LM960 HW Design Guide Warning – At power-up, LM960 success to enumerate SS_USB interface. But if a hot-plug is attempted in case of SS_USB, then LM960 may fail to enumerate SS_USB. Information – According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time.

  • Page 40: Pcie Interface

    LM960 HW Design Guide Information – Consider placing a low-capacitance ESD protection component to protect LM960 against ESD strikes If an ESD protection should be added, the suggested connectivity is as follows: ESD Protection for USB2.0 ESD Protection for USB3.0 6.5.2.
  • Page 41 LM960 HW Design Guide Signal Function Type Comment PCIE_WAKE_N PCIe wake-up Analog PCIe reference clock request PCIE_CLKREQ_N Analog signal PCIe differential reference PCIE_REFCLK_M Analog clock – minus PICe differential reference PCIE_REFCLK_P Analog colock – plus PCIE_RESET_N Functional reset to the card...

  • Page 42: Sim Interface

    LM960 HW Design Guide 6.5.3. SIM Interface The LM960 supports two external SIM interfaces (1.8V or 2.85V). Below table lists the SIM interface signals. SIM Interface Signals Signal Function Type Comment SIM Card Interface 1 SIMVCC1 Supply output for an 1.8V / 2.85V...

  • Page 43: Control Signals

    WAN_LED_N LED control Open-drain 6.5.4.1. W_DISABLE_N The W_DISABLE_N signal is provided to make the LM960 goes into the airplane mode: • Enter into the airplane mode: Low • Normal operating mode: High or Leave the W_DISABLE_N not connected LM960 contains an internal VBATT(Nominal 3.3V) pull-up resistor on W_DISABLE_N.

  • Page 44: Pcie_Wake_N

    Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be written or queried and set the value of the pin output. The following GPIOs are always available as a primary function on the LM960. Below table lists the GPIO signals of LM960.

  • Page 45: Using A Gpio Pin As Input

    LM960 HW Design Guide Pin no. Signal Function Type Drive Strength GPIO_01 Configurable Pull-Down 2-16 mA GPIO 1.8V GPIO_02 Configurable Pull-Down 2-16 mA GPIO 1.8V GPIO_03 Configurable Pull-Down 2-16 mA GPIO 1.8V GPIO_04 Configurable Pull-Down 2-16 mA GPIO 1.8V 6.5.5.1.

  • Page 46: I2C - Inter-Integrated Circuit

    Using the Temperature Monitor Function The Temperature Monitor permits to monitor the module’s internal temperature and, if properly set (see the #TEMPSENS command in LM960 AT Commands Reference Guide ), raises a GPIO to High Logic level when the maximum temperature is reached.

  • Page 47: Rf Section

    Secondary RF antenna #1: Rx Diversity path • GNSS antenna: Dedicated GNSS path Primary Antenna Requirements The antenna for the LM960 device must meet the following requirements: WCDMA / LTE Antenna Requirements Depending by frequency band(s) provided by the network Frequency range...

  • Page 48: Gnss Receiver

    This allows the module to work well with a passive GNSS antenna. If the antenna cannot be located near the LM960, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used with an external dedicated power supply circuit.

  • Page 49: Antenna Connection

    See the picture on the below for their position on the interface. 7.5.2. Antenna Connector The LM960 is equipped with a set of 50 Ω RF MHF4 connectors from I-PEX 20449-001. For more information about mating connectors visit the website https://www.i-pex.com 7.5.3.

  • Page 50: Antenna Installation Guidelines

    RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LM960 module. Antennas used for this OEM module must not exceed gain of below table for mobile and fixed operating configurations.

  • Page 51: Audio Section

    Audio Interface The LM960 module supports digital audio interfaces. Digital Audio The LM960 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface on the following pins: Digital Audio Interface Signals Pin no.

  • Page 52: Mechanical Design

    LM960 HW Design Guide 9. MECHANICAL DESIGN General The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector. Finishing & Dimensions The LM960 module’s overall dimensions are: •...

  • Page 53: Application Guide

    LM960 HW Design Guide APPLICATION GUIDE Debug of the LM960 Module in Production To test and debug the mounting of the LM960 module, we strongly recommend to add several test pins on the host PCB for the following purposes: •...

  • Page 54: Emc Recommendations

    LM960 HW Design Guide EMC Recommendations EMC protection on the pins in the table below should be designed by application side according to the customer’s requirement. EMC Recommendations Signal Function Type Comment USB HS 2.0 Communication Port USB_D+ USB 2.0 Data Plus...
  • Page 55 LM960 HW Design Guide SIMIO1 Data connection with 1.8 / 2.85V an external UIM1 card SIMVCC1 Supply output for an 1.8 / 2.85V Power external UIM1 card SIM Card Interface 2 SIMRST2 Reset output to an 1.8 / 2.85V external UIM2 card...
  • Page 56 LM960 HW Design Guide PCIE_RESET_N PCIe Reset Input 1.8V Active Low SYSTEM_RESET_N Reset Input 1.8V Active Low 1.8V Voltage Regulator VREG_L6_1P8 LDO out for 1.8V Power All other pins have the following characteristics: Human Body Model (HBM): ± 1000 V Charged Device Model (CDM) JESD22-C101-C: ±...

  • Page 57: Packaging

    LM960 HW Design Guide PACKAGING Tray The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301485 Rev. 1 Page 57 of 70 2018-05-30...
  • Page 58 LM960 HW Design Guide 1VV0301485 Rev. 1 Page 58 of 70 2018-05-30...

  • Page 59: Conformity Assessment Issues

    LM960 HW Design Guide CONFORMITY ASSESSMENT ISSUES Approvals  Fully type approved confirming with RE Directive (Directive 2014/53/EU)  CE, GCF  FCC, IC, PTCRB  RoHS and REACH  Approvals for major Mobile Network Operators Declaration of Conformity The DoC is available here: www.telit.com/RED/...
  • Page 60 LM960 HW Design Guide brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.

  • Page 61: Red Regulatory Notices

    LM960 HW Design Guide Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains",...
  • Page 62 LM960 HW Design Guide module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. The allowable Antenna Specipication In all cases assessment of the final product must be met against the Essential requirements of the RE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any...

  • Page 63: Safety Recommendations

    LM960 HW Design Guide SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: ...

  • Page 64: Reference Table Of Rf Bands Characteristics

    LM960 HW Design Guide REFERENCE TABLE OF RF BANDS CHARACTERISTICS RF Bands Characteristics Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset WCDMA 2100 – 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888 190 MHz Rx: 10562 ~ 10838 WCDMA 1900 –...
  • Page 65 LM960 HW Design Guide Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179 30 MHz Rx : 5010 ~ 5179 LTE 700c – B13...
  • Page 66 LM960 HW Design Guide Mode Freq. Tx Freq. Rx Channels Tx-Rx (MHz) (MHz) Offset LTE TDD 1900+ – 1880 ~ 1920 T/Rx: 38250 ~ 38649 – LTE TDD 2300 – 2300 ~ 2400 T/Rx: 38650 ~ 39650 – LTE TDD 2500 –...

  • Page 67: Acronyms

    LM960 HW Design Guide ACRONYMS Telit Technical Support Centre TTSC Universal Serial Bus High Speed Data Terminal Equipment Universal Mobile Telecommunication System UMTS Wideband Code Division Multiple Access WCDMA High Speed Downlink Packet Access HSDPA High Speed Uplink Packet Access...
  • Page 68 LM960 HW Design Guide Slave Ready SRDY Chip Select Real Time Clock Printed Circuit Board Equivalent Series Resistance Voltage Standing Wave Radio VSWR Vector Network Analyzer Frequency division duplex Inter-integrated circuit Long term evolution System-on-Chip 1VV0301485 Rev. 1 Page 68 of 70...

  • Page 69: Document History

    LM960 HW Design Guide DOCUMENT HISTORY Revision Date Changes 2018-2-09 First Draft 2018-5-30 Sec 1.5 Some of Doc’s Referrence Number Is Updated Sec 3.3 Pin Layout Updated Sec 4.2 Current Consumption Updated Sec 6 Power On, Power Off, Reset Updated 1VV0301485 Rev.
  • Page 70 Mod.0818 2017-01 Rev.0...

Table of Contents