Repair Procedures; Introduction; Lead Free (Pbf) Solder; External Testing - Panasonic EB-X300 Service Manual

Gsm personal cellular telephone

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7. REPAIR PROCEDURES

This section provides information on testing the telephone. The layout is as follows:

Section 7.2. : Lead Free (PbF) solder: Identification and repair of PCBs using PbF solder.

Section 7.3. : External testing: describes equipment requirements and general set up procedure.

Section 7.4. : Complete Unit Test Setup: Describes how the items of test equipment are used together and general set up

procedure.

Adjustment Procedures are described in Section 8.

The Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder.

(SPARKLE ECO SOLDER : Part No. ESC F3 M705 0.3)

Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 °C higher. Always use a high temperature soldering iron

When using a soldering iron with temperature control, it should be set to 370 ± 10 °C (700 ± 20 °F).

When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF solder until it

melts before applying lead solder.

Avoid overheating PbF solder as it has a tendency to splash at temperatures above 600 °C (1100 °F).

The handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section

provides a description of the equipment required to perform those tasks.

Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 6, and then the PCB connected to

the PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysers

and oscilloscope.

The unit must be tested and calibrated for all frequency bands (900 MHz, 1800 MHz and 1900 MHz).

Personal Computer (PC)

The PC (IBM compatible) is used as a Unit Under Test controller.

Power Supply

Provides 3.8 V DC supply to RF Adaptor and PCB Repair Jig.

CAUTION

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