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NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Narrow pitch connectors
• Socket (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
0.20±0.03
0.60±0.03
1.325±0.03
: Insulatin
area
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
0.35±0.01
0.18±0.01
0.60±0.01
1.325±0.01
–5–
A35US
with power terminal (0.35mm pitch)
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
0.20±0.03
0.26±0.03
1.045±0.03
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
0.35±0.01
0.18±0.01
0.20±0.01
0.885±0.01
Please refer to the latest product
specifications when designing your
product.
ACCTB78E 201510-T
: Insulatin
area
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