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5. This machine can be connected to a computer to be controlled more conveniently with a built-in
PC serial port and a proprietary software attached to it.
6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a
vacuum suction pen to facilitate the removing of BGA after desoldering.
7. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements,
all can be handled easily.
F. Operation Steps
1. Preheating
Preheat the BGA and PCB before repairing. The temperature in thermostat is usually set at
80℃-100℃,time 12-24 hours, to remove the moisture in PCB and BGA, and prevent burst when
heating.
2.Desoldering
Put PCB on the positioning bracket, choose the appropriate hot-air reflow nozzle, set the right
soldering temperature curve, and press the START button. After the procedure is over, move the
hot-air nozzle away by hand, and use the vacuum suction pen to remove BGA.
3.Clean the soldering pad.
There are mainly 2 ways: one is use suction line to make it flat, the other is use the soldering
iron to remove the dregs directly. It is better to remove the dregs soon after the desoldering of BGA,
for the BGA has not cooled down, and the damage caused by temperature difference is less.To use
some flux paste when cleaning the pad can increase the solder activity and achieve better cleaning
effect. Be careful to not to destroy PCB pad! Try to use some volatile solvents.
4.Reballing
Lay the BGA Flux Paste on the BGA pad evenly with a brush. Choose corresponding steel net,
and plant the soldering ball on the BGA pad with a BGA Reball Kit.
5.Soldering
Put the BGA on the bottom heating area of BGA Rework Station, and solder the balls on the
pad.
6.Lay on Flux paste
Lay the BGA Flux Paste on the BGA pad evenly with a brush, no more, no less.
7.Mounting
Mount the BGA on the right place of PCB. When we place in by hand, we can make use of the
silk screen borders. We can touch the surface of the pad and the balls to know whether it is placed
in the right area.
8.Soldering
Put PCB with new-mounted BGA on the positioning bracket, move the hot-air nozzle to the
right place, choose the appropriate hot-air reflow nozzle, set the right soldering temperature curve,
and press the START button. After the procedure is over, turn on the cooling fan to cool down BGA
for 30-40 seconds, and elevate the upper hot-air nozzle to be 8-10mm away from the surface of
BGA. Or move away the hot-air nozzle after the START light is off, then remove PCB from the
heating area.
G. PLC (Programmable Logic Controller）
1.Top/bottom PLC
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