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J. Tips for operation
1. After turn on the head power switch, check whether the upper hot-air nozzle gives out cool
breeze. If not, never start the machine, or the upper heater may be burnt.
2. Set different temperature curves for different BGA. The temperature should not be higher than
250
. In lead
-free soldering, it can be set according to the soldering temperature
℃
curve of BGA soldering balls.
3. When desoldering BGA, turn the cooling fan to auto. After the temperature curve
goes over, the buzzer alarms automatically. Then remove BGA form PCB quickly
with a vacuum suction pen and take PCB away from the positioning bracket.
4. When desoldering BGA, turn the cooling fan to auto. After the temperature curve
goes over, the buzzer alarms automatically. The cooling fan begins to cool BGA and
the lower heating area. The hot-air nozzle gives out cold breeze at the same time. The upper
main heater arises to 8-10mm from the surface of BGA and pauses for 30-40s. Or after the working
light is off, move the main heater away and take PCB away from the positioning bracket.
5. Before soldering BGA, check the PCB pad and BGA balls one by one. After
soldering, check the appearance one by one again. If there is some problem, stop
assembling and check the temperature. Continue after adjust it well. Or the BGA
and PCB may be destroyed.
6. Clean the surface of the machine regularly, especially the infrared heating board.
Don't leave dirt plot on the board to prevent it from radiating, or the soldering may
be a failure and the life of infrared heater will be significantly shortened. (If the
infrared heater is destroyed due to this reason, our company will not change it for
free.)
7. When we use the optical place system, we must turn the self-lock (heating head
and nozzle) switch to auto, or the heating head and nozzle can not rotate freely.
Those who are not trained by our company mustn't modify the parameters or
disassembly the control box.
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