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Conclusion
In the productive area of electronic products, especially the computer and
communicative electronics areas, the components tend to miniaturization. Different
kinds of packaging technology emerge, while BGA/CSP is the mainstream.
To meet the fast-increasing demand of BGA circuit assembly, the manufacture
companies need to choose safer, faster and more convenient assembly and rework
technology.
Appendix:
Order
Name
1
BGA Rework
Station
3
Install program
4
Vacuum sucker
5
Temperature
sensor
6
Data access
7
Power cable
8
Instruction
book
packing list
Specification
ZM-DGC900
Software
ZM-DGC900
Unit
O.
Set
Set
PCS
PCS
PCS
PCS
copy
31
N
Note
1
(electric cabinet)
1
1
1
1
1
1
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