Preliminary User’s Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH. TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User’s Manual or parts of it without special notification.
A certain TQMLX2160A derivative does not necessarily provide all features described in this Preliminary User’s Manual. This Preliminary User’s Manual does also not replace the LX2160A documentation (1), (2). The information provided in this Preliminary User’s Manual is only valid in connection with the tailored boot loader, which is preinstalled on the TQMLX2160A, and the BSP provided by TQ-Systems.
Temperature supervision Error log All essential CPU pins are routed to the TQMLX2160A connectors. There are therefore no restrictions for customers using the TQMLX2160A with respect to an integrated customised design. All TQMLX2160A versions are fully pin-compatible and therefore interchangeable.
HRESET_IN# JTAG_TRST# Figure 5: Block diagram Reset structure Boot source The boot source of the TQMLX2160A is selected with signals BOOT_SRC[2:0]. Pull-Ups to 3.3 V are provided on the TQMLX2160A. Table 2: Boot source selection BOOT_SRC2 (X2-A34) BOOT_SRC1 (X2-A33) BOOT_SRC0 (X2-A32)
For TQMLX2160A without an assembled eMMC, the SDHC_2 interface routed to the connectors can be used. The SDHC interface can be enabled with the eMMC_SEL0/1 signals. Pull-Ups to 3.3 V are provided on the TQMLX2160A. The eMMC_SEL configuration cannot be changed during runtime.
EEPROM, 24LC64 The TQMLX2160A provides a 64 Kbit serial EEPROM type 24LC64. The EEPROM is connected to I2C1 of the LX2160A. WP of the M24LC64 is pulled low on the TQMLX2160A, thus write access is permitted. See also Figure 7.
The SE97B is connected to the I2C1 bus of the LX2160A and contains a 2 Kbit (256 × 8 Bit) EEPROM. In this EEPROM TQMLX2160A-specific data is stored, see Table 4. The user can also store own data in this EEPROM.
4.9.1 SerDes The LX2160A provides three SerDes blocks with eight lanes each. No AC coupling capacitors are assembled on the TQMLX2160A. These have to be populated on the carrier board. The following tables show the SerDes muxing options. Table 5: SerDes Block 1 muxing options Front Side Left SERDES1 (×8)
C bus 1 structure on TQMLX2160A 4.7 kΩ Pull-Ups at the I C bus are assembled on the TQMLX2160A. More devices can be connected to the bus but then additional external Pull-Ups may be required on account of the higher capacitive load.
4.9.5 RGMII Both RGMII interfaces EC1 and EC2 are directly routed to the TQMLX2160A connectors. The I/O signals have 1.8 V level. The signals EC1_TX_EN (GPIO4_DAT4) and EC2_TX_EN (GPIO4_DAT16) are equipped with 1 kΩ Pull-Downs on the TQMLX2160A. 4.9.6 JTAG The JTAG interface is routed to the connectors.
4.10.3 Power consumption The given power consumptions have to be seen as typical values. The power consumption of the TQMLX2160A strongly depends on the application, the mode of operation, the environmental temperature, and the operating system. The power supply of the carrier board should be designed for an output power of up to 60 watts.
4.11.2 SerDes track length The following table shows the SerDes interface track lengths on the TQMLX2160A from the CPU ball to the connector pin, and the insertion loss of each lane in dB assuming the following conditions: • PCIe Gen 3: 4.00 GHz...
The CPU on the TQMLX2160A has a maximum height of approximately 10.5 mm above the MBLX2160A. The TQMLX2160A provides four 2.7 mm Ø mounting holes and two M2 steel spacers to mount a heat sink. The TQMLX2160A weighs approximately 84 grams.
401-55103-51 • Data transfer rate 16+ Gbit/s To avoid damaging the connectors of the TQMLX2160A during extraction, the use of the extraction tool MOZILX2160A is strongly recommended. Note: 16 Gbit+ specification It is strongly recommended to use the 220-pin module connectors with 16 Gbit+ specification for carrier boards.
TQMLX2160A and thus malfunction, deterioration or destruction. Structural requirements The TQMLX2160A should be fastened to the carrier board with spacer bolts or spacer sleeves at the four mounting holes. Notes of treatment To avoid damage caused by mechanical stress, the TQMLX2160A may only be extracted from the carrier board by using the extraction tool MOZILX2160A that can also be obtained separately.
• Filtering of all signals, which can be connected externally (also "slow signals" and DC can radiate RF indirectly). Since the TQMLX2160A is plugged on an application-specific carrier board, EMC or ESD tests only make sense for the whole device.
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the TQMLX2160A, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of this subassembly is minimised by suitable measures. The TQMLX2160A is delivered in reusable packaging.
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