Quectel BC660K-GL Manual page 9

NB-IoT Module Series
BC660K-GL Hardware Design
Figure Index
Figure 1: Functional Diagram ..................................................................................................................... 13
Figure 2: Pin Assignment ........................................................................................................................... 15
Figure 3: Module Power Consumption in Different Modem Modes ........................................................... 21
Figure 4: Timing of Waking Up Module from PSM .................................................................................... 22
Figure 5: Reference Design for Power Supply .......................................................................................... 23
Figure 6: Turn-on Timing ............................................................................................................................ 23
Figure 7: Turn-off Timing ............................................................................................................................ 24
Figure 8: Reference Design for RESET_N Controlled with an OC/OD Driving Circuit ............................. 25
Figure 9: Reference Design for RESET_N Controlled with a Button ........................................................ 25
Figure 10: Reference Design for BOOT Controlled with a Button ............................................................. 26
Figure 11: Reference Design for Main UART Port .................................................................................... 27
Figure 12: Reference Design for Debug UART Port.................................................................................. 28
Figure 13: Reference Design for UART ..................................................................................................... 28
Figure 14: Reference Design for Module-PC Communication via RS-232 Interface ................................ 29
Figure 15: Reference Design for Level Conversion Circuit ....................................................................... 30
Figure 16: Reference Design for USIM Interface with a 6-pin USIM Card Connector .............................. 31
Figure 17: RI Behaviour When a URC/Message is Received ................................................................... 33
Figure 18: Reference Design for NETLIGHT ............................................................................................. 34
Figure 19: Reference Design for NB-IoT Antenna Interface ...................................................................... 36
Figure 20: Microstrip on a 2-layer PCB ...................................................................................................... 37
Figure 21: Coplanar Waveguide on a 2-layer PCB.................................................................................... 37
Figure 22: Coplanar Waveguide on a 4-layer PCB (Layer 3 as Reference Ground) ................................ 37
Figure 23: Coplanar Waveguide on a 4-layer PCB (Bottom Layer as Reference Ground)....................... 38
Figure 24: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 41
Figure 25: Mechanicals of U.FL-LP Connectors ........................................................................................ 42
Figure 26: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 42
Figure 27: Top and Side Dimensions (Unit: mm) ....................................................................................... 47
Figure 28: Bottom Dimension (Bottom View) ............................................................................................. 48
Figure 29: Recommended Footprint (Unit: mm) ........................................................................................ 49
Figure 30: Top View of the Module ............................................................................................................ 50
Figure 31: Bottom View of the Module ....................................................................................................... 50
Figure 32: Recommended Reflow Soldering Thermal Profile ................................................................... 52
Figure 33: Tape Dimensions (Unit: mm) .................................................................................................... 54
Figure 34: Reel Dimensions (Unit: mm) ..................................................................................................... 54
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