imec NEUROPIXELS 1.0 User Manual page 44

Figure 44: Solder applied to solder pad and GND/REF wire separately.
Place the GND/REF wire on top of the solder pad.
•
Press the solder tip on top of the GND/REF wire and feed some amount of solder wire. This
•
forms a strong solder joint. (Figure 45)
Always inspect the quality of the solder joint under a microscope before implanting. Also check the
components surrounding the solder pads for eventual damage. Run the built-in self-tests after soldering
to check the functionality of the probe.
IMPORTANT: Generally, poor connections are a common source of noise. The reference and ground
connections on the probe and flex are critical as they are very close to the probe signal amplifiers.
NEUROPIXELS 1.0 USER MANUAL V1.0.5
Figure 45: Soldered wire to solder pad without hole.
44