Soldering - imec NEUROPIXELS 1.0 User Manual

If the experiment requires a connection to the ground and/or external reference signal, the user can
make use of the two GND and REF arms which are part of the probe flex. In case these arms are not
usable as such, the user can extend or replace these by soldering wires to the provided solder pads on
the flex. Four solder pads are available for both GND and REF connection. These solder pads are
reinforced with blind vias to prevent peel off of the solder pads from the flex.
A well-maintained solder iron makes soldering to the probe much easier. Below are some general
guidelines to keep your solder tips in good condition:
Set the temperature of the solder iron to the minimum required for the application.
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Apply some solder to the solder tip before switching off. This prevents corrosion to the tip.
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Switch off the solder station or unplug the solder iron from the station when not in use.
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Replace the tip when the solder wire does no longer melt on the very tip of the solder tip.
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Always choose a solder tip which matches the size of the solder pad as good as possible.
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Solder procedure:
Make sure to use a solder iron which is grounded via the mains supply of the soldering station
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for ESD protection.
Fix the probe to a clean surface. A good method is to use ESD tape. (Figure 41)
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Clean the solder tip using a brass wire mesh or damp sponge. Repeat at frequent intervals.
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Wet the solder tip slightly with solder wire. This improves heat transfer from the iron to the
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solder pad.
Insert the wire through the hole in the solder pad. Place the solder iron at the corner between
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the pad and the GND/REF wire. (Figure 42)
NEUROPIXELS 1.0 USER MANUAL V1.0.5

Soldering

Figure 41: Fixing the probe before soldering.
42