Headstage - imec NEUROPIXELS 1.0 User Manual

Figure 6: Probes with stainless-steel cap featuring dedicated dovetail structures.
A black epoxy (EPO-TEK/H70E) encapsulates the probe perimeter and bond wires. The SMD
components are also coated with a conformal, hermetic coating (ELPEGUARD/SL 1307 FLZ-T). The probe
package with silicon spacer weighs 400 mg and the one with a metal cap 440 mg. The respective
thicknesses at the probe base are ~1.2 mm and ~1.8 mm for the two packages (Figure 4). Table 4
summarizes the package dimensions and properties.
PACKAGE DESCRIPTION
WIDTH AT PROBE BASE
WIDTH AT SMD BASE
WIDTH OF SILICON SPACER
WIDTH OF METAL CAP
WIDTH OF FLEX
LENGTH OF PROBE BASE
LENGTH OF SMD BASE
LENGTH OF SILICON SPACER
LENGTH OF METAL CAP
LENGTH OF FLEX
THICKNESS AT PROBE BASE
THICKNESS OF FLEX
EXTERNAL REFERENCE INPUT
GROUND INPUT
BLACK EPOXY
CONFORMAL COATING OF SMD
WEIGHT
NOTE: Please carefully read and follow the guidelines on soldering (Appendix B) before soldering
separate wires to the REF and GND input pads. It is advisable to have prior experience in soldering
before soldering to the Neuropixels probes.
NOTE: Please carefully read and follow the instructions on probe handling (Appendix A) and ESD
protection (Appendix C) prior to handling any Neuropixels system components. Familiarize yourself
with the probes by first handling and testing dummy probes which can be ordered separately.

3.2 Headstage

The HS (Figure 7) is 16  15 mm and weighs 0.9 g. It contains several LDO regulators for power supply,
a serializer chip for communication to/from the PXIe acquisition module, and an EEPROM for
NEUROPIXELS 1.0 USER MANUAL V1.0.5
Table 4: Probe package description
6.2 mm
7.2 mm
3.9 mm
4.8 mm
4.3 mm
10.7 mm
12.2 mm
8.5 mm
7.3 mm
39.5 mm
~1.2 mm (w/ Si spacer)
~1.8 mm (w/ metal cap)
80 µm
REF (multiple pads along flex)
GND (multiple pads along flex)
EPO-TEK / H70E
ELPEGUARD / SL 1307 FLZ-T
400 mg (w/ Si spacer)
440 mg (w/ metal cap)
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