9.3 PCB Soldering Pad and Stencil Design
PCB soldering pad and stencil design please refer to《FIBOCOM NL668 LCC SMT Design Description》.
9.4 SMT
SMT production process parameters and related requirements please refer to《FIBOCOM NL668 LCC
SMT Design Description》.
9.5 Carrier and storage
Carrier and storage please refer to《FIBOCOM NL668 LCC SMT Design Description》.
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FIBOCOM NL668-LA Series Hardware User Manual
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