9.3 PCB Soldering Pad and Stencil Design
PCB soldering pad and stencil design please refer to FIBOCOM NL668 LCC SMT Design Guide.
9.4 SMT
SMT production process parameters and related requirements please refer to FIBOCOM NL668 LCC
SMT Design Guide.
9.5 Carrier and storage
Carrier and storage please refer to FIBOCOM NL668 LCC SMT Design Guide.
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FIBOCOM NL668-LA Series Hardware Guide
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